1 |
H. H. Law, A. Roy, D. Kossives, T. C. Wu, and D. D. Bacon, IEEE, 1, 363 (1994)
|
2 |
Z. Sheng, M. H. Azarian, and M. G. Pecht, IEEE, 29, 217 (2006)
|
3 |
Japan Patent 1990236289 (1999)
|
4 |
N. G. Park, Circuits&Assembly, 52, 77 (2008)
|
5 |
H. I. Hwang, 표면처리 문제와 해설, 3, 23, 대광서림, (2006)
|
6 |
C. Jian, M. jusheng, W. Gangqiiang, and T. Xiangyun, IEEE, 144 (1998)
|
7 |
S. T. Kim, Journal of the Korean Institute of Metals, 24, 1267 (1986)
|
8 |
K. Takeshi, K. Junichi, M. Kuniaki, and H. Hideo, Electrochimica Acta, 47, 85 (2001)
DOI
ScienceOn
|
9 |
U. S. Patent 6,020,029 (2000)
|
10 |
D. G. Jang, Y. Y. Shin, M. K. Choi, W. K. Nam, and T. H. Hong, PCB core technology hand-book, Gold, Galwol-Dong, Yongsan-Gu, Seoul, Korea (2005)
|
11 |
J. S, Kim, Journal of Korean society for Imaging science & Technology, 4 (1998)
|
12 |
C. Y. Lee, W.C. Moon, and S.B. Jung, Materials Science and Engineering, 483-484, 723 (2008)
DOI
ScienceOn
|
13 |
U. S. Patent 4,859,281 (1987)
|
14 |
U. S. Patent 5,691,130 (1997)
|
15 |
T. B. Jeon, Journal of Korean Institute of Industrial Engineers, 6, 133 (1993)
|
16 |
C. Michael, B. Lee, K. Al, and B. Roger, CircuiTree (2004)
|