• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.57-57
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• 2015

전해동박(Electrodeposited Copper Foil)은 전기도금 공정으로 제조되는 얇은 구리 포일로서, 주로 TV, PC, 스마트폰 등 전자제품의 인쇄회로기판에서 전기신호를 전달하는 회로소재로 사용이 되며, 최근에는 모바일 IT, 전기자동차, 지능형 로봇, 그린 에너지 산업 등에서 필수적으로 적용되는 소재로 이용이 급증하고 있는 핵심소재이다. FPCB/PCB용 전해동박은 최근 휴대폰, PC와 더불어 전 세계적으로 열풍이 불고 있는 스마트폰, 태블릿 등의 최신 전자 모바일기기의 보급이 가속화됨에 따라 해당 제품들의 다기능화, 고집적화가 진행되고 있으며, 5G 이후의 Mobile 기기를 중심으로 하는 차세대 전자기기의 소재 분야의 선점을 위해서 광폭(600 mm 이상) 제품 제조가 가능한 전해 동박으로 다양한 표면처리의 $18{\sim}2{\mu}m$ 급의 얇은 두께를 갖는 경제성이 확보된 고특성 동박이 필요로 되는 상황이다. 이와 더불어 PCB/FPCB에서 요구하는 동박기술의 소개 및 현재 연구 개발 Trend를 소개하고자 한다.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.05a
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• pp.37-40
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• 2005

폐 프린터의 발생량이 해마다 증가하고 있으며 이에 대한 재활용이 필요하다. 폐 프린터의 재활용에 있어서 다른 구성성분보다 기판의 처리가 문제가 된다. 본 연구는 폐 프린터의 기판을 재활용하는 데에 습식처리공정을 적용하기 위하여 먼저 전처리로 분쇄와 분리를 실시하였다. 기판을 1cm 이하로 분쇄한 다음 자력선별기를 이용하여 자성물질을 제거하고 비자성물질을 대상으로 4, 12, 40 mesh의 체를 이용하여 시료를 분리하였다. 전처리를 통하여 금속성분 특히 구리가 다량 함유된 12/40# 에 속한 시료를 대상으로 산에 의한 침출실험을 실시하였다. 실험 변수로는 산의 종류, 산 농도, 반응 온도, pulp density 등이었다.

• Korean Journal of Soil Science and Fertilizer
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• v.43 no.6
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• pp.872-879
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• 2010

Layered copper hydroxides [LCHs, $Cu_2(OH)_3{\cdot}NO_3$] has the agricultural potentials as a fungicide because of its high crystallinity, excellent anion exchange capacity, and its regular layered particle size. The study, for the first time, has synthesized LCHs in highly concentrated solution and evaluated its physicochemical properties including the crystallinity and suspension stability. Optimal synthetic condition of LCHs was determined by crystallinity and stability of suspension as follow; 1) concentrations of $Cu(NO_3)_2$ and NaOH solutions were 3.0 M respectively, 2) reaction temperature and solution pH were $25^{\circ}C$ and 6.0, respectively, and 3) aging time after reaction was 2hr. Crystallinity of LCHs enhanced with increase in pH up to 9.0. Whereas, stability of suspension was decrease by increase in crystal size. Especially, increase in reaction temperature decreased stability of suspension. XRD patterns and SEM images exhibited that LCHs had regular layered particle size with 0.2~0.8 ${\mu}m$ and high crystallinity in optimal synthetic condition. The particle size was increased with increase in reaction temperature and pH. These results showed that LCHs synthesized in highly concentrated solution exhibited high stability of suspension as well as high crystallinity suitable to their potential as a fungicide.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.5
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• pp.224-228
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• 2014

Recently, the demands for separation/recovery of valuable metals such as nickel or tin from copper based alloys has been attracting much attention from the viewpoints of environmental protection and resource utilization. In this report, experimental results on concentration increasement of nickel and tin compared to the previous report are investigated. Ni is successfully separated by a organic solvent and reduced to the metal powder whose concentration is over 98 %. Sn is separated by a selective solution method and its concentration is increased to 97.5 % by three consecutive solution and reduction process. Crystal structure, surface morphology and microstructure of the separated samples are studied.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.12
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• pp.109-116
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• 2005

Elastic-plastic structural analysis for regenerative cooling chamber of liquid rocket thrust chamber is performed. Uniaxial tension test is also conducted for the copper alloy in order to get material data necessary for the structure analysis. The results of uniaxial tension test reveal that copper alloy become ductile after brazing process and flow stress becomes lower as temperature becomes higher. As a result of structural analysis using the material data, the deformation of cooling channel is more increased by thermal load than by internal pressure of cooling fluid. Therefore, the results of analysis show that structural stability and cooling performance of combustion thrust chamber which is designed to endure mechanical load and minimized a channel thickness are improved by decreased thermal load as possible.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.101-105
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• 2016

Recently, the hydrophobic surface has been attracted because of the excellent opto-physical properties. Various processing methods such as chemical, mechanical, photolithographic and laser processing are competitively introduced for fabrication of hydrophobic surface of polymer, metal and ceramics. In this paper, we fabricated the hydrophobic surface of copper metal by simple method which irradiated 355 nm UV-pulsed laser in order to shape microgrooves and increased surface roughness through oxidation process at room temperature. Finally the contact angle is dramatically increased by maximum $45^{\circ}$, as a result of oxidation which simply created nanostructures on the microstructures without expensive chemical process.

• Resources Recycling
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• v.21 no.3
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• pp.48-55
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• 2012

Recently, the recycling with environmentally friendly method has been an issue for various fields. An effective removal method of coating layers from coated copper wires is one critical factor for recycling copper wire. We have adopted a high frequency heating routine for removing the coating layers on the coated copper wires, and attempted to find optimum conditions. The experimental results show that the copper wires should be maintained at or above $950^{\circ}C$ for rapid removal of the polyester. The simulation and experimental results are discussed with respect to the microstrucrual evolution during heating of the copper wires.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.992-999
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.139-139
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• 2016

반도체 다마신배선용 도금용 구리도금첨가제는 대표적으로 accelerator, suppressor 및 leveler 첨가제를 사용하여 다마신 패턴을 채우고 평탄화를 시킬 수 있다. Si 반도체 공정기술에 기반한 정확한 구조분석을 통해 각각의 첨가제의 기능이 비교적 체계적으로 연구되었으며, 최근에는 유속영향을 많이 받는 것으로 알려진 leveler 첨가제에 대한 연구가 활발히 진행되고 있다. 본 연구는 대표적 leveler 첨가제의 하나인 Janus Green B(JGB, $C_{30}H_{31}ClN_6$)를 0 ~ 1 mM을 첨가하여 Si 기판위에 증착된 Cu 씨드층 상의 도금후 표면상태 및 불순물의 농도를 분석하고, 이 박막층들의 결정립 성장 경향성을 electron backscattered diffraction(EBSD) 분석을 통해 진행하였다. C, H, N 등의 불순물이 JGB 농도와 선형적 관계를 가지고 증가하는 것을 알 수 있었으며, S와 O의 불순물도 JGB 농도 증가에 따라 증가하는 것을 알 수 있었다. 또한 0.1 mM 첨가한 경우에 60% 정도 결정립 성장이 진행된 것을 알 수 있었으며, 0.2 mM을 넣은 경우에는 결정립 성장이 일어나지 않은 것을 알 수 있었다. 흥미로운 점은 4 point probe를 통한 면저항 측정을 통해 EBSD를 통한 결정립성장이 관찰되지 않은 0.2 mM JGB를 첨가한 경우에 대해서도 면저항의 감소가 관찰되며, 오히려 JGB 농도가 높을수록 이러한 면저항의 감소가 빠르게 시작되는 것을 관찰할 수 있었다. 이는 JGB 농도 증가에 따라 박막층의 불순물의 농도가 증가하고 막내에 존재하는 불순물의 농도가 증가하면 내부응력장이 커짐으로 인해 더욱 빠른 속도로 불순물의 재배치가 일어난 것으로 보인다. 이러한 불순물이 결정립계면에 편석되는 경우에 pinning을 통해 결정립계면의 이동을 저하시킬 수 있으므로 결정립의 성장 억제가 가능해진 것으로 판단된다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.2
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• pp.114-118
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• 2013

Separation/recovery of valuable metals such as nickel or tin from copper based alloys has recently attracted from the viewpoints of environmental protection and resource recycling. In this report, preliminary study on concentration and separation of nickel from copper based alloy dross using selective adsorption by chelate resin was performed. The chelate resin used in this study has absorbed copper ions more easily than nickel ions in the metal solution, which could allow the concentration/separation of the nickel from the copper base alloy solution. The final molar ratios of Ni and Cu ions in the two concentrated solutions were 70 and 99 % respectively after three-time flowing the solution through the chelate resin column.