• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.5-10
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• 2003

• Composites Research
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• v.14 no.1
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• pp.47-56
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• 2001

In order to enhance high speed stability the composite air spindle system composed of a high modulus carbon fiber composite shaft, powder contained epoxy composite squirrel cage rotor and aluminum tool holder was designed and manufactured. For the optimal design of the composite air spindle system, the stacking sequence and thickness of the composite shaft were selected by considering the fundamental natural frequency and deformation of the system. The analysis gave results that the composite air spindle system had 36% higher natural frequency relative to a conventional air spindle system. The dynamic characteristics of the composite spindle system were compared with those of a conventional steel air spindle system. From the calculated and test results, it was concluded that the composite shaft and the power contained composite rotor were able to enhance the dynamic characteristics of the spindle system effectively due to the low inertia and high speific stiffness of the composite materials.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1767-1776
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• 2001

For the stable operation of high speed air spindle, the low rotational inertia and high damping ratio of spindle shafts as well as high fundamental natural frequency are indispensable. Conventional steel spindles are net appropriate for very high speed operation because of their high rotational inertia and low damping ratio. In this study, a high speed spindle composed of carbon fiber epoxy composite shaft and steel flange was designed for maximum critical speed considering minimum static deflection and radial expansion due to bending load and centrifugal force during high speed relation. The stacking angle and the stacking thickness of the composite shaft and the adhesive bonding length of the 7teel flange were selected through vibrational analysis considering static and thermal loads due to temperature rise.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.39-40
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• 2013

• Tribology and Lubricants
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• v.6 no.2
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• pp.60-67
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• 1990

최근 전자 및 광학 분야에 있어서의 눈부신 발전은 다면경 가공기나 초정밀 연삭기와 같은 초정밀 가공기계의 개발과 실용화에 힘입은 바 크다. 이러한 초정밀 가공기의 성능을 좌우하는 핵심 요소로서 추축계를 들수 있으며, 비교적 소형 경량의 공박물을 가공하는 기계의 주축용 베어링으로는 오일 베어링을 대신하여 공기 베어링이 점차 널리 사용되고 있다. 이러한 가공기에 많이 사용되는 외부 가압 공기 베어링은 동압 공기 베어링과는 달리, 외부에서 가압된 압축공기에 의하여 공기막을 형성하므로, 시동과 정지시 마멸이 없고 저속에서도 비교적 높은 하중 지지력을 얻을 수 있으며, 오일 베어링과 비교하여서는 발열이 적고 윤활제의 유출에 의한 오염의 위험이 없다는 특성외에 공기막에 의한 평균화 효과에 의하여 고정도의 운전이 가능하다는 장점이 있다. 본 연구에서는 점급기원의 가정하게 직접 수치해법을 사용하는 해석 프로그램을 작성하여, 무차원화된 설계 변수들에 대한 외부가압 공기베어링의 정$\cdot$동특성수들을 구하고자 한다.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.134-138
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• 1999

For the stable operation of high speed aerostatic spindle, the low rotational inertia and high damping ratio of spindle shafts as well as high fundamental natural frequency are indispensable. Conventional steel spindles are not appropriate for very high speed operation because of their high rotational inertia and low damping ratio. In this study, the composite spindles with aerostatic bearing were designed and manufactured with carbon fiber/epoxy composite. The fundamental natural frequency of the composite spindle was evaluated through the modal testing.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.