• Title/Summary/Keyword: 고주파 전송선로

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Development of Short-Wavelength Transmission Line Employing Periodically Perforated Ground Metal for Application to Miniaturized On-chip Passive Components on Si RFIC (Si RFIC상의 온칩 수동소자에의 응용을 위한 주기적 접지 금속막 선로를 이용한 단파장 전송선로 개발)

  • Joh, Han-Nah;Park, Young-Bae;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.2
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    • pp.330-335
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    • 2008
  • In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

Analysis and Design Optimization of Interconnects for High-Speed LVDS Applications (고속 LVDS 응용을 위한 전송선 분석 및 설계 최적화)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.10
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    • pp.70-78
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    • 2009
  • This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

Design of 24-GHz Power Amplifier for Automotive Collision Avoidance Radars (차량 추돌 방지 레이더용 24-GHz 전력 증폭기 설계)

  • Noh, Seok-Ho;Ryu, Jee-Youl
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.1
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    • pp.117-122
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    • 2016
  • In this paper, we propose 24-GHz CMOS radio frequency (RF) power amplifier for short-range automotive collision avoidance radars. This circuit contains common source stage with inter-stages conjugate matching circuit as a class-A mode amplifier. The proposed circuit is designed using TSMC $0.13-{\mu}m$ mixed signal/RF CMOS process ($f_T/f_{MAX}=120/140GHz$). It operates at the supply voltage of 2V, and it is designed to have high power gain, low insertion loss and low noise figure in the low supply voltage. To reduce total chip area, the circuit used transmission lines instead of the bulky real inductor. The designed CMOS power amplifier showed the smallest chip size of $0.1mm^2$, the lowest power consumption of 40mW, the highest power gain of 26.5dB, the highest saturated output power of 19.2dBm and the highest maximum power-added efficiency of 17.2% as compared to recently reported results.

Electrical Characteristics of Buried Type Inductor for MCM-C

  • Lim, W.;Yoo, C.S.;Cho, H.M.;Lee, W.S.;Kang, N.K.;Park, J.C.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.69-72
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    • 2000
  • 기판과의 동시소성에 의한 고주파 MCM-C(Multi-Chip-Module-Cofired)용 저항을 제작하고 6 GHz 까지의 RF 특성을 측정하였다. 기판은 저온 소성용 기판으로서 총 8층으로 구성하였으며, 7층에 저항체 및 전극을 인쇄하고 Via를 통하여 기판의 최상부까지 연결되도록 하였다 저항체 Pastes, 저항체의 크기, Via의 길이 변화에 따라서 저항의 RF 특성은 고주파일수록 더욱 DC 저항값에서부터 변화되는 양상을 보였다. 내부저항의 등가회로를 구현한 결과, 저항은 전송선로, Capacitance 성분이 혼재되어 있는 것으로 나타났으며 전극의 형태에 따라 Capacitance 성분이 많은 차이를 나타내었다.

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Characteristic Impedance Extraction Using TRL Calibration and a Additional Standard (TRL 오차 수정 방법을 개선한 특성 임피던스 추출)

  • 김유신;이창석
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2001.11a
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    • pp.275-278
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    • 2001
  • TRL 오차 수정방법은 기판 위에 제작된 고주파 소자를 측정할 때 많이 사용되는 방법이지만 오차수정을 위해 제작된 표준 전송선 패턴의 특성 임피던스를 알아야만 보다 정확하게 측정 오차를 수정할 수 있다. 기존의 방법에서는 저항을 종단 처리한 표준 패턴을 추가로 이용하여 전송선의 단위 길이 당 커패시턴스를 계산하고 주파수에 대해 fitting하는 방법으로 표준 전송선의 특성 임피던스를 계산하고 있으나 제작상의 부정확성에 의해 추출된 특성임피던스가 영향을 받고 있음을 확인하였다. 본 연구에서 제안하는 새로운 방법을 이용하면 fitting하는 과정 없이 각각의 측정주파수에서 직접 특성 임피던스 추출이 가능할 뿐 아니라 제작상의 부정확성을 측정결과로부터 처리할 수 있으며 검증 결과 기존 방법 보다 정확한 특성 임피던스를 추출할 수 있었다.

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Analysis and Design Optimization of Interconnects for High-Speed LVDS Applications (고속 LVDS 응용을 위한 전송 접속 경로의 분석 및 설계 최적화)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.761-764
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    • 2007
  • This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

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MEMS를 이용한 이동통신용 RF 부품 기술

  • 김건욱;육종관
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.12 no.3
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    • pp.60-68
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    • 2001
  • 본 논문에서는 최근 초소형 기술로 각광받고 있는 MEMS(MicroElectroMechanical System) 기술을 이용한 무선통신 분야의 응용을 제고한다. RF ME- MS 기술은 기존의 기술들에 비해 크기나 전력소모, 삽입손실 등에서 우수한 고주파 특성을 갖는 소자 나 부품을 만들 수 있으며 특히 휴대용 단말기에 적 용 가능한 RE 부품들 즉 저손실 전송선로, 스위치, High Q inductor, 안테나 등의 주요 부품에 대한 연 구가 많이 이루어지고 있다.

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Cable Identification Technology based on Power Line Communication (전력선 통신을 활용한 케이블 식별 기술)

  • Byun, Hee-Jung;Choi, Sang-jun;Shon, Sugoog
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.05a
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    • pp.880-883
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    • 2015
  • Power-line communication technology is proposed to identify cables of power distribution systems. It can extend the application area of power-line communication. Distribution line cable circuits have only a limited ability to carry higher frequencies. Typically power transformers in the distribution system prevent propagating the higher frequency carrier signal. The proposed method uses the limited propagation ability to identify the cable. A novel power cable identification system is designed and implemented. The system consists of a transmitter and a receiver with power-line communication module. Some experiments are conducted to verify the theoretical concepts. Also some simulations are done to help and understand the concepts by using Simulink simulator.

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An Efficient Analysis Method for Planar Microstrip Transmission Line (플라나 마이크로스트립 전송선의 효율적 해석 방법)

  • Kim, Tae-Won
    • 전자공학회논문지 IE
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    • v.45 no.2
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    • pp.13-19
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    • 2008
  • The main advantage of the TLM analysis method is the ease with which even the most complicated transmission line structures. In this paper, using symmetrical condensed node(SCN), the TLM numerical technique has been successfully a lied to microstrip meander line. A detailed technique of the symmetrical condensed node(SCN) may be used to model planar microstrip transmission line is presented. Also, the S-parameters $S_{11}$ and $S_{21}$ of two types of microstrip meander line have been computed. From obtained results, TLM analysis is shown to be an efficient method for modeling complicated structure of planar microstrip transmission line. The TLM results presented here are useful in the design of microwave integrated circuits at higher frequencies region.

A Study on the High Frequency Wireless Power Transfer Cable (고주파 무선전력 케이블 개발)

  • Kim, Young-Sun;You, Sung-Han;Yang, Hoon-Chul
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.7-8
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    • 2015
  • 2007년 MIT에서의 자기공진 기술 시연 이후 무선전력 시스템 기술에 있어서 많은 부분들이 다수의 연구자들에 의해 연구되고있다. 하지만, 무선전력 시스템의 효율에 큰 영향을 미치는 급집전 코일 및 선로용 케이블에 대한 연구는 매우 미진한 상황이다. 다만, 최근 들어 국내에서는 KAIST와 동원OLEV의 무선충전 전기버스와 철도기술연구원의 무가선 철도, 물류 분야의 무선전력 기술의 실용화가 점진적으로 이루어지기 시작하면서 무선전력 전용의 고주파 대전력 케이블에 대한 연구 필요성이 대두되고 있다. 본 연구에서 대전력 무선 전송 분야의 적용을 위해 100 kHz이하 대역에서의 고주파 전력 케이블 최적화를 위한 단위 집합 도체 특성을 실험적으로 평가하였다.

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