• The Korean Journal of Rheology
• /
• v.10 no.1
• /
• pp.14-23
• /
• 1998

비상용성 고분자 브렌드계인 PS/PP와 EPDM/PP의 유변학적 거동에 미치는 계면의 영향을 알아보았고 그실험 결과를 Park & Lee 모델과 비교하였다. PS/PP와 EPDM/PP 블 렌드계에서의 계면에 의한 전단응력과 법선 응력차에의 기여도는 $textsc{k}$와λ(1-$\mu$), 두 개의 변 수에 의해 잘설명되었다. 특히 계면의 탄성적인 효과와 관련있는 법선응력차 항이 전단 응 력 항보다 더 뚜렷하게 나타났다. 30PS/70PP 블렌드 조성에서는 블렌드의 유변학적 특성이 주로 연속상을 이루는 고분자의 의해 좌우된 반면에 50PS/50PP 블렌드조성에서는 계면에 의한 영향이 더두드러지게 나타났다. 이것은 50/50 블렌드 조성에서 계면의 넓이가 증가한 것과 관계 있다. 그러나 EPDM/PP 블렌드계에서 계면에 의한 응력 항들이 모두 PS/PP 블 렌드계의 그것보다 매우 큰 값을 가졌지만, 그 상대적인 비를 나타내는 $textsc{k}$값은 작았다. 이것 은 블렌드를 구성하고 있는 순수한 성분의 법선응력차 값의 차이가 크기 때문이다. 또한 PS/PP 블렌드계에 대한 동적 계면장력을 Park & Lee 모델을 이용하여 예측해 보았다.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.12 no.1
• /
• pp.116-122
• /
• 1988

Interfacial shear stresses have been determined for countercurrent stratified flow of air and water in a nearly-horizontal rectangular channel, based upon measurements of pressure drop, gas velocity profiles and mean film thickness. A dimensionless correlation for the interfacial friction factor has been developed as a function of the gas and liquid Reynolds numbers. Equivalent surface roughnesses for the interfacial friction factor have been calculated using the Nikuradse correlation and have been compared with the intensity of the wave height fluctuation on the interface. The results show that the interfacial shear stress is mainly affected by turbulent mixing near the interface due to the wave motion rather than by the roughened surface.

• Nuclear Engineering and Technology
• /
• v.27 no.2
• /
• pp.189-202
• /
• 1995

An improved method is presented for the prediction of heat transfer coefficients in turbulent fall-ing liquid films with or without interfacial shear for both heating or condensation. A modified Mudawwar and El-Masri's semi-empirical turbulence model, particularly to extend its use for the turbulent falling film with high interfacial shear, is used to replace the eddy viscosity model incorporated in the unified approach unposed by Yih and Liu. The liquid film thickness and asymptotic heat transfer coefficients against the film Reynolds number for wide range of interfacial shear predicted by both present and existing methods are compared with experimental data. The results show that in general, predictions of the modified model agee more closely with experimental data than that of existing models.

• Elastomers and Composites
• /
• v.36 no.4
• /
• pp.246-254
• /
• 2001

In this work, the stabilization of chlorosulfonated polyethylene (CSM) rubber emulsion with surfactants, i.e., nonionic (Span 60) or anionic (Sodium laurylsulfate, SLS) surfactants, was investigated. The phase inversion emulsification by interfacial chemical characteristics was used to emulsify the CSM rubber. As a result, the emulsion phase separation was observed in the case of any single surfactant. However, there was no phase separation in the mixture of Span 60 and SLS in the context of emulsion droplet size tests and rheological behaviors. The droplet size decreases by increasing the surfactant mixture, resulting in increasing the viscosity. The viscosity and shear stress determined from shear rate show a shear thinning and yield behaviors. It was then found that the emulsion stabilization can be improved using the phase inversion emulsification method and surfactant mixture.

• The Korean Journal of Rheology
• /
• v.9 no.2
• /
• pp.81-87
• /
• 1997

비상용성 고분자는 그 계면의 특성에 의해서 복잡한 유변학적 거동을 갖는데 그러 한 거동을 해석하기 위해서 최근에 제안된 구성방정식을 토대로 소폭 진동 전단 흐름장에서 의 유변학적 물성과 몰폴로지 전개를 예측한 바 있다. Takahashi[2]등은 이런 흐름하에서의 계면은 거의 변하지 않음을 보여주었고 따라서 이경우는 상대적으로 쉬운편이었다. 본연구 에서는 정상전단흐름장하에서의 몰폴로지 전개에 대한 구성방정식을 간단한 형태로 표현함 으로써 실제 산업계에서 이용될수 있도록 하였다. 그러한 해석을 통하여 원래의 모델에서 제시되었던 3개의 실험변수를 2개로 줄일수 있었으며 계면의 특성을 잘 나타내 주는 새로운 변수($textsc{k}$)를 도입하였다. 계면의 특성을 잘 나타내 주는 이새로운 변수를 통하여 그 계면의 영향을 예측할수 있었다. 한편 분산상의 파괴, 변형, 합체 메카니즘을 모델에 제시되었던 변 수값들을 통하여 해석하였고 이를 실험적인 데이터와 비교해 보았다.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.12 no.6
• /
• pp.109-118
• /
• 2008

Carbon fiber reinforced polymer(CFRP) can be bonded to the soffit of a concrete beam as a means of repairing and strengthening the beam. In such beams, materials, concrete and carbon fiber sheets, are different in coefficient of thermal expansion. Consequently, interfacial shear stresses can be increased and debonding failure may occur at the plate ends due to temperature rising. This paper presents a method of approximate closed-form solutions for the interfacial shear stresses and conducts a beam test to compare the numerical results. In case of temperature rising over $30^{\circ}C$, interfacial stress of 0.91MPa is occurred at the end of sheet. Therefore, using carbon fiber sheet for strengthening the concrete beam, it is necessary to consider the thermal effects and to evaluate the long time behavior of the concrete beam by temperature change.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.4
• /
• pp.31-35
• /
• 2000

The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.4 s.37
• /
• pp.351-357
• /
• 2005

Comparison of shear strength and shear energy of the 48Sn-52In solder bumps reflowed on Cu UBM were made with variations of reflow temperature from $150^{\circ}C$ to $250^{\circ}C$ and reflow time from 1 min to 20 min to establish an evaluation method for the mechanical reliability of solder bumps. Compared to the shear strength, the shear energy of the Sn-52In solder bumps was much more consistent with the solder reaction behavior and the fracture mode at the Sn-52In/Cu interface, indicating that the bump shear energy can be used as an effective tool to evaluate the mechanical integrity of solder/UBM interface.

• Composites Research
• /
• v.13 no.4
• /
• pp.67-74
• /
• 2000

The general solution of the anti-plane shear problem for the curved interfacial crack between viscoelastic foam and composites was investigated with the complex variable displacement function. Kelvin-Maxwell three parameter model is used to present viscoelasticity and the Laplace transform was applied to treat the viscoelastic characteristics of foam in the analysis. The stress intensity factor near the interfacial crack tip was predicted by considering both anisotropic and viscoelastic properties of two different materials. The results showed that the stress intensity factor increased with increasing the curvature of the curved interfacial crack and it also increased and eventually converged to a specific value with increasing time. The stress intensity factor increased with increasing the ratio of stiffness coefficients between foam and composites and the effect of fiber orientation on the stress intensity factor decreased with increasing the ratio of stiffness coefficients between foam and composites.

• Journal of Power System Engineering
• /
• v.7 no.1
• /
• pp.25-33
• /
• 2003

섬유강화 복합재료의 계면 강도는 강화재와 메트릭스간의 계면특성, 강화용 섬유의 표면처리 및 섬유간의 거리 등에 많은 영향을 받는다. 본 연구에서는 섬유간의 거리가 섬유강화 복합재료의 계면특성에 미치는 영향을 고찰하기 위해, E glass fiber/epoxy 복합재료의 시험편을 제작하고, 섬유의 표면처리 및 섬유파괴가 이웃하는 섬유파괴에 영향을 미치는 거리에 대해 고찰하였다. E glass fiber/epoxy 복합재료의 계면 전단강도는 섬유간 거리 $0{\sim}50{\mu}m$ 사이에서는 섬유의 표면처리와는 관계없이 섬유간 거리가 증가할수록 증가하였고, 섬유간 거리 $50{\mu}m$ 이상에서는 섬유간거리에 관계없이 계면전단강도는 일정하였다.