• Korean Journal of Materials Research
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• v.7 no.9
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• pp.733-737
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• 1997

고분자 재료의 가격을 낮추거나 물리적, 열적 성질을 향상시키기 위해 고분자 복합재료 분야에서 무기 첨가제의 사용이 크게 증가하고 있다. 본 연구에서는 DBEBA/MDA/GN 계의 경화특성에 미치는 천연 Zeolite의 영향을 고찰하였다. DGEBA/MDA/GN 계의 경화 매카니즘과 DGEBA/MDA/GN/natural zeolite계의 경화 메카니즘은 매우 유사하였다. Zeolite의함량이 20phr까지 증가함에 따라 속도 상수는 증가하였으나 Zeolite의 함량이 증가함에 따라 속도 상수는 감소하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.6
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• pp.251-255
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• 2007

We made $(1-x)BCB-xBNT(BaNd_2Ti_4O_{12})$ (x=20, 30, 40, 50 vol%) composite thick film with a high dielectric constant and low loss by the hand casting method. Dielectric constant and dielectric loss of prepared thick film are measured at 1MHz and curing behavior of the film are observed through thermal analysis such as DSC. We investigated the effect of contents of BNT filler and curing behavior of film on dielectric properties of BCB-BNT composite. Dielectric constant increased with increasing BNT filler from 20 to 50 vol% and dielectric loss ($tan{\delta}$) decreased with increasing BNT filler. Dielectric constant and loss ($tan{\delta}$) of composite material was not nearly dependent on the curing behavior. But as a result of TCC (Temperature Characteristics of Coefficient) decreased with increasing the curing temperature, we confirmed that the curing of these composite system is most stable above $250^{\circ}C$.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.200-204
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• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.59-65
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• 2001

Epoxy/$BaTiO_3$composite capacitor films with excellent stability at room temperature, uniform thickness, and electrical properties over a large area ware successfully fabricated. The composite capacitor films with good film formation capability and easy process ability were made from epoxy resin developed for ACF as a matrix and two kinds of $BaTiO_3$powders as fillers to increase the dielectric constant of the composite film. The crystal structure of the powders and its effects on dielectric constant of the films were investigated by X-ray diffraction (XRD). And the optimum amount of dispersant, phosphate ester, was determined by viscosity measurement of suspension. DSC and dielectric property tests were conducted to decide the right curing temperature and the optimum amount of the curing agent. As a result, the capacitors of 7 $\mu \textrm{m}$ thick film with 10 nF/$\textrm{cm}^2$ and low leakage current were successfully demonstrated.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1996.11a
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• pp.137-144
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• 1996

The kinetic coefficients far decomposition of the cured phenol resin (SC-1008) using a modified Arrhenius relationship have been determined from thermogavimetric analyses (TGA). The kinetic parameters were determined by multiple heating rate technique developed by Freideman and Henderson. Weight loss (decomposition) and weight loss rate (decomposition rate)were measured and recorded for three heating rates; $5^{\circ}C$/min ,$10^{\circ}C$/min, and $20^{\circ}C$/min. Relatively good agreement was obtained between measured and calculated decomposition as a function of temperature. By separating the reaction, the reaction order and pre exponential factor become empirical parameters which provide a "best fit" of the data. However, this method yields an extremely accurate reproduction of the thermograms over a wide range of heating rates. This is the desired result for kinetic parameters used in thermal models.al models.

• Applied Chemistry for Engineering
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• v.5 no.6
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• pp.1030-1035
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• 1994

Curing behavior and glass transition temperatures of epoxy resins into which reactive diluents were added to control processability were investigated. Heat of cure generated of the epoxy resin was reduced with butyl glycidyl ether(BGE) and phenyl glycidyl ether(PGE) contents. $T_g$ of the resin was decreased with the amount of reactive diluents and it was attributed to increased molecular weight between crosslink points. Cure kinetics of the resins was studied employing autocatalytic reaction model and found that reaction constants decreased as the contents of reactive diluent was increased.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.29 no.2
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• pp.105-114
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• 2016

When impact load is applied to a plate structure, a common phenomenon that occurs in structures is plastic deformation accompanied by a large strain and eventually it will experience a fracture accordingly. In this study, for the rational design against accidental limit state, the plastic material constants of steel plate which is formed by line heating and by cold bending procedure have been defined through the numerical simulation for the high speed tension test. The usefulness of the material constants included in Cowper-Symonds model and Johnson-Cook model with the assumption that strain rate can be neglected when strain rate is less than the intermediate speed is verified through comparing the present numerical results with those in references. This paper ends with describing the future study.

• Korean Journal of Materials Research
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• v.5 no.5
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• pp.606-610
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• 1995

Diglycidyll ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA)계에 반응성 첨가제 malononitrile(MN)을 첨가하면 내충격성은 크게 향상되나 반응속도는 감소하게 된다. 에폭시 수지의 경화반응은 에폭시기가 개환되어 생성되는 히드록시기가 촉매로 작용하는 자촉매 반응이며, 외부에서도입된 히드록시기도 같은 효과를 나타낸다. 따라서 본 연구에서는 DGEBA/MDA/MN 계의경화 반응속도를 증가시키기 위해 히드록시기를 가진 촉매로서 hydroquinone(HQ)을 도입하였고 이들 계의경화특성 및 열적성질을 고찰하였다. HQ가 첨가됨으로 인해 활성화 에너지는 감속하고 속도상수는 증가하였으며, 발열곡선에서 반응 시작온도가 낮아졌다. 이 결과로부터 HQ가 반응 가속제로 작용하고 있음을 알 수 있다.

• Transactions of Materials Processing
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• v.1 no.1
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• pp.42-51
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• 1992

The ring compression test has been widely employed as an experimental means to determine the friction factor. The calibration curves are obtained by the rigid-plastic finite element analysis for various work-hardening exponent and strain-rate hardening exponent. The effects of work-hardening exponent and strain-rate hardening exponent are thoroughly studied and discussed from the finite element computation. The change of friction factor during height reduction in ring compression is also discussed. Then, the method to estimate the change of friction factor during ring compression is proposed.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.257-262
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• 1992

The cure kinetics of a diglycidyl ether of bisphenol A (DGEBA) with 4, 4'-methylene dianiline (MDA) added succinonitrile was studied through the dynamic run method by applying the data to the Kissinger equation which analyses the effect of the heating rate on the temperature at maximum reaction rate using Differential Scanning Calorimetry (DSC) analyzer in the range of 3$0^{\circ}C$-35$0^{\circ}C$. In the DGEBA/MDA system with SN, the activation energy ($E_a$) and the pre-exponential factor (A) were calculated. From these results, the rate constants (k) were obtained according to the different SN contents.