• Journal of Adhesion and Interface
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• v.7 no.1
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• pp.16-22
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• 2006

In this work, the effect of cure temperature and time on the thermal stability and the exothermic cure reaction peak of a waterborne resol-type phenol-formaldehyde resin, which may be used for preparing phenolic sheet molding compounds (SMC), has been investigated using a thermogravimetric analyzer and a differential scanning calorimeter. The weight loss of waterborne phenol-formaldehyde resin was mainly occurred at three temperature stages: near $200^{\circ}C,\;400^{\circ}C$, and $500^{\circ}C$. The carbon yield at $750^{\circ}C$ for the cured resin was about 62%~65%. Their thermal stability increased with increasing cure temperature and time. Upon cure, the exothermic reaction was taken placed in the range of $120^{\circ}C{\sim}190^{\circ}C$ and the maximum peak was found in between $165^{\circ}C$ and $170^{\circ}C$. The shape and the maximum of the exothermic curves depended on the given cure temperature and time. To remove $H_2O$ and volatile components, the uncured resin needed a heat-treatment at $100^{\circ}C$ for 60 min at least prior to cure or molding. Curing at $130^{\circ}C$ for 120 min made the exothermic peak of waterborne phenol-formaldehyde resin completely disappeared. And, post-curing at $180^{\circ}C$ for 60 min further improved the thermal stability of the cured resin.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.257-262
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• 1992

The cure kinetics of a diglycidyl ether of bisphenol A (DGEBA) with 4, 4'-methylene dianiline (MDA) added succinonitrile was studied through the dynamic run method by applying the data to the Kissinger equation which analyses the effect of the heating rate on the temperature at maximum reaction rate using Differential Scanning Calorimetry (DSC) analyzer in the range of 3$0^{\circ}C$-35$0^{\circ}C$. In the DGEBA/MDA system with SN, the activation energy ($E_a$) and the pre-exponential factor (A) were calculated. From these results, the rate constants (k) were obtained according to the different SN contents.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6464-6471
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• 2014

The UV curing method is a popular process for lens molding on a unit wafer. This process, however, has several drawbacks including wafer adhesion during the ejection process after curing, errors in lens shape and wafer warpage due to material shrinkage during the curing process, and lens centering errors on both sides of a wafer. Among these, the lens shape error and warpage are influenced directly by the UV curing process due to factors including the UV radiation uniformity, the degree of cure according to UV intensity, and the shrinkage characteristics of the material. Therefore, a theory is needed not only to understand the change in the material characteristics, such as the shrinkage rate due to the curing reaction, but also to establish a model. In addition, an analysis system is needed to realize the model. This study proposes a new analysis method for the wafer lens molding process by Comsol modeling. This method was verified by comparing the results with those of the actual process.

• Polymer(Korea)
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• v.28 no.1
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• pp.35-40
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• 2004

The formation mechanism of void defect which deteriorate composite's property is various according to each composite process. In this paper, void formation and growth mechanism is analyzed by thermal analysis and GC/MS. We made a vacuum chamber for observing pressure effect. Thermal analysis has been done in various condition. Elements of volatiles during resin curing were turned out by GC/MS. The most of volatiles of polyester were composed of styrene (over 80%) and a small quantity of toluene. In case epoxy resin, butyl glycidyl ether was the main element of volatiles (over 90%). We concluded that the original sites of void growth existed in resin and they were eliminated by vacuum and heating process. And the growth of void was influenced by water, diluents, solvent, and reactants in resin.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.161-161
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• 2010

n-type 반도체 특성을 띄는 $SnO_2$ 나노선은 가스 센서, 투명 소자, 태양광 전지 등으로 널리 사용되고 있다. 본 연구에서는 화학기상증착법으로 성장한 $SnO_2$ 나노선으로 폴리이미드 (PMDA-ODA: PI) 박막을 게이트 절연막으로 이용한 전계효과트랜지스터를 플렉서블 기판에 제작하고 전기적 특성을 분석하였다. 전자 전달 특성 곡선으로부터 n-형의 반도체 특성을 확인하였으며, 대부분의 산화금속 나노선에서와 같이 매우 큰 전기적 히스테리시스가 관찰되었다. 산화금속계통 나노선 소자의 히스테리시스는 나노선 표면에 산소 및 물 분자가 흡착되어 생기는 전자 갇힘 현상이 가장 큰 원인으로 알려져 있는데, 이러한 히스테리시스를 조절하거나 없애는 것은 소자의 특성 향상에 있어 매우 중요하다. 한편 PI 절연막에는 느린 분극 현상을 만드는 OH 반응기가 존재하기 때문에 나노선과는 반대 방향의 히스테리시스를 보일 것으로 예상된다. 본 연구에서는 제작된 $SnO_2$ 나노선 FET에서 PI 게이트 절연막의 경화 정도에 따른 히스테리시스를 조사하였다. FT-IR 측정에 따르면, PI 필름에 존재하는 OH 반응기는 PI를 경화시킴에 따라 감소하였으며 전기적인 히스테리시스도 감소하였다. 따라서, 절연막을 경화시키지 않았을 때는 PI 내부에 다량의 OH 반응기가 존재하여, PI의 히스테리시스가 나노선 히스테리시스보다 더 크게 작용하여, 전체적으로는 PI의 특성인 반시계 (counterclockwise) 방향의 히스테리시스를 나타내었다. 한편, 절연막을 완전히 경화시키면, OH 반응기는 대부분 사라지고 나노선의 히스테리시스만 발현되어 소자는 시계방향의 히스테리시스를 보였다. 이러한 실험결과를 통해, PI 박막을 $250^{\circ}C$ 에서 약 7분간 경화시켰을 때 나노선과 절연막의 히스테리시스가 가장 이상적으로 상쇄되어 전체적으로 히스테리시스가 매우 작아진 것을 관찰할 수 있었다. 이는 향후 나노선 FET의 안정적인 응용에 매우 유용한 결과로 활용될 것으로 예측된다.

• Applied Chemistry for Engineering
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• v.19 no.5
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• pp.471-476
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• 2008

The thermal and mechanical properties and morphology of epoxy/polyamide/DDS/2E4MZ-CNS reactive blends with various amounts of polyamide were investigated. The amount of polyamide was 10, 20, and 30 phr and 2 phr of catalyst was added to the blend to cure at $180^{\circ}C$ for 30 min. By adding the catalyst, 2E4MZ-CNS, to the blend, the cure reaction occurred at a lower temperature. From the SEM images, it was found that the boundary of separated-phase was unclear and the phase was co-continuous. Without the catalyst, however, the boundary of separated-phase was clear. The control of cure temperature and morphology could be achieved by using a proper catalyst and consequently the mechanical strength increased by 20% compared to the blend without the catalyst due to the strong interaction between epoxy matrix and phase-separated polyamide at the interface.

• The Korean Journal of Rheology
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• v.10 no.4
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• pp.227-233
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• 1998

The effects of 1 mol% N-benzylpyrazinium hexafluoroantimonate(BPH) as a thermal latent initiator and blend compositions composed of cycloaliphatic and DGEBA epoxies were investigated in the rheological properties and cure kinetics. Latent properties were performed by measurement of the conversion as a function of reaction time using isothermal DSC at $150^{\circ}C$ and $50^{\circ}C$ Rheological properties of the blend systems were investigated in terms of isothermal experiments using a rheometer. The gelation time was obtained from the evaluation of storage modulus (G'), loss modulus (G") and damping factor (tan$\delta$)). Cross-linking activation energy ($E_c$) was also determined from the Arrhenius equation based on gel time and curing temperature. As a result, the gel time and cross-linking activation energy increased with increasing DGEBA composition. The cure activation energies ($E_a$) were obtained by Kissinger method using dynamic DSC thermograms. In this work, the cure activation energy decreased with increasing CAE concentration, which might be resulted from the short repeat units, simple side-groups and viscosity of reaction media.edia.

• Journal of Life Science
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• v.1 no.1
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• pp.2-14
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• 1991

활성산소 및 그의 반응산물들에 의해 노화가 진행되고, 특히 혈관의 노화인 동맥경화가 활성산소 및 지질과산화에 의해 유발된다면, 생체 내에서 끊임없이 생성되고 있고 경우에 따라 필수 불가결한 활성산소를 어떻게 잘 처리하는 가가 중요하다. 즉, 활성산소 발생정도에 대한 항산화능의 유도가 미치지 못한다면, 체내의 활성산소 및 그 생산물에 의해 노화, 동맥경화가 진행될 것이다. 활성산소의 생성계와 제거계의 balance가 잘 유지된다면 정상적인 노화로 자연사에 이르게 될 것이고, 이 balance가 깨어져 과도한 활성산소의 축적에 대해 제거계가 따르지 못할 경우에는 활성산소와 그 생산물에 의해 동맥경화와 비정상적인 노화가 진행될 것이다.

• Composites Research
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• v.35 no.4
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• pp.288-297
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• 2022

This study investigated the effect of addition of zirconia(zirconium oxide) powder on the curing behavior of phenolic resins. The heating rate controlled curing and isothermal curing behaviors of the phenol resin according to the content of the zirconia powder were analyzed. The viscosity and thermal decomposition characteristics of the phenolic resin with the zirconia content were also examind. From the DSC analysis, the degree of cure and the rate of cure were obtained. Finally, the activation energy for the cure reaction were calculated from the DSC data of the zirconia added phenolic resin. As a found, the higher the zirconia content, the longer the curing was delayed and the greater the activation energy required for curing. Additionally, the TGA result that as the content of zirconia increased, less weight loss was observed. The surface tackiness of the Carbon/Phenol prepreg was partially changed according to the zirconia content, but had no significant effect.

• Cement Symposium
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• no.23
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• pp.220-225
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• 1995