• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1997.04a
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• pp.215-220
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• 1997

본 연구는 추진제 연소관 내부에 도포 되는 내열재 라이닝 공정을 최적화하기 위해 라이너 Premix 반응성을 실험하고 그결과를 토대로 Premix 저장조건을 설정하였다. HX-계열의 Bonding agent를 사용하는 LH-2, LH-5, LH-6 라이너를 선택하여 각각 20, 30, $40^{\circ}C$하에서 5주간 저장후 경화제와 경화촉매를 주입하고 초기점도를 측정하여 반응성을 예측하였다. 그 결과 Bonding agent로 HX-868을 사용하는 LH-5, LH-6 라이너가 HX-752를 사용하는 LH-2보다 반응성이 빠르며, 경화제와 경화촉매로 DDI와 T-12를 사용하는 LH-5 라이너가 IPDI와 $Fe(AA)_3$를 사용하는 LH-6 라이너 보다 반응성이 빠르게 나타났다. 이러한 저장온도와 기간에 따른 반응성을 토대로 공정 적용시 급격한 점도 상승에 의한 작업의 불안정성을 피하기 위해 일정 점도를 초과하지 않는 라이너 Premix 저장조건을 설정하였고, 향후에는 Bonding agent로. HX-868을 사용하는 LH-5, LH-6 라이너는 보다 공정성이 양호한 HX-752로 바꾸어 주는 것이 바람직 할 것이다.

• Journal of the Korean Society of Propulsion Engineers
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• v.12 no.4
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• pp.24-32
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• 2008

We made a new propellant formulation to improve the productivity of Base Bleed Unit(aka BBU) by reducing of the curing time. We made an experiment with new propellant formulation such as binder characteristics and manufacturing process. In addition, we already tested several basic characteristics and the final performance of the new propellant. According to the test report, it was not only satisfied with all requirements in the specification, but it also contributed to improve productivity and reduced 53% of the curing time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1663-1668
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• 2011

Surface hardening treatment is required to improve the wear-resistance of press die because severe abrasion of die occurs during the drawing process in which the forming of the automotive body is completed and during the trimming process in which the unnecessary parts are cut. In this study, experiments on the laser surface treatment of press die are performed. Specimens are heat-treated separately at certain plate and edge position by using a diode laser to carry out suitable surface hardening treatment to reduce the wear during the drawing and the trimming processes, and the proper conditions for heat treatment are found. Spheroidal and flake graphite cast iron specimens are used, and the heat treatment characteristics of the two materials are compared. From the results of the study, it is confirmed that the heat treatment characteristics differed depending on the materials.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Composites Research
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• v.30 no.3
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• pp.202-208
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• 2017

Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi-channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.171.1-171.1
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• 2016

재료의 표면 강화 방법 중의 하나인 질화공정을 이용하여 탄소강 S45C 소재의 질화 거동에 대하여 연구하였다. $520^{\circ}C$ 온도에서 질화 공정을 진행하여 공정시간에 따른 Kn값을 수소 센서로 측정하여 공정시간에 따른 N-potential의 변화와 그에 따른 화합물층 성장 및 화합물층의 상변화에 대해 관찰하였다. 화합물 층의 미세구조 변화는 광학현미경 및 주사전자현미경을 통해 관찰하였다. 가스 질화 처리 후 표면경도는 약 600Hv의 경도값이 측정되었고, 공정 시간이 늘어남에 따라 화합물층 및 경화깊이가 증가되고 표면 화합물이 성장하여 porous가 감소하는 것을 확인 할 수 있다. 경화깊이는 1440분 일 때 약 0.5mm 경화 깊이를 얻었고, 화합물층의 성장은 ${\varepsilon}$상(Fe2-3N)과 ${\gamma}$'상(Fe4N)으로 두 개의 상으로 형성되는 것을 관찰할 수 있었다. 시험 결과를 바탕으로 S45C 소재의 탄소 함량에 따른 lehrer diagram을 열역학 적으로 계산하고 화합물층의 형성 기구에 대해 비교 분석하였다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.8
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• pp.1907-1914
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• 1995

An on-line measurement of the workpiece hardened depth in laser surface hardening processes is very much difficult to achieve, since the hardening process occurs in depth wise direction. In this paper, the hardened depth is estimated using a multilayered neural network. Input data of the neural network are the surface temperatures at arbitrary chosen five surface points, laser power and traveling speed of laser beam torch. To simulate the actual hardening process, a finite difference method(FDM) is used to model the process. Since this model yields the calculation results of the temperature distribution around the workpiece volume in the vicinity of the laser torch, this model is used to obtain the network's training data and laser to evaluate the performance of the neural network estimator. The simulation results show that the proposed scheme can be used to estimate the hardened depth with reasonable accuracy.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.2
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• pp.66-75
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• 1993

This paper proposes a monitoring method for nondestructive and in-process measurement of the case depth in LASER surface heat treatment process. The method is essentially an eddy-current method, and measures sensing coil's electrical impedance which varies with the changes of the material microstructure due to hardening. To investigate te validity of the proposed method a series of experiments were performed for various hardning depths. The results show that the relationship between the eddy- current sensor output and the changes in case depth is almost linear. This indicates that the eddy-current measuring method can be used as one of the possible monitoring method for mesauring the hardened depth in LASER heat treatment processes.