• Journal of Energy Engineering
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• v.5 no.2
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• pp.123-130
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• 1996

Reduction, sulfidation, and regeneration reactions were performed using domestic and Australian iron ore in order to develop a desulfurizing sorbent for the high temperature desulfurization process that is one of major processes in the integrated coal gasification combined cycle (IGCC) system. A TGA (Thermogravimetric Analysis) reactor and a fixed-bed reactor were used. Some basic kinetic information was obtained from BET surface area measurements, SEM photos, cyclic reactions, reaction temperature changes and TGA curves of the sorbents. The rates of both desulfurization and regeneration increased with increasing reaction temperature in the range of 500-700$^{\circ}C$.

• Korean Journal of Environmental Agriculture
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• v.14 no.3
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• pp.338-344
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• 1995

The wet ash method has been used as an official standard procedure for the analysis of Cd in brown rice in Korea, but this method involves several disadvantages. Thus, four analytical methods were compared in this experiment in order to find a more efficient method for the Cd analysis in brown rice. Evaluation was made based on both the Cd recovery percentages from the Cd-spiked samples and the relationships between Cd contents obtained by the official procedure and other methods. Results showed that ashing 50g brown rice at $600^{\circ}C$(dry ash method) recovered nearly 80% of the spiked Cd. This recovery percentage was a little lower than that of the wet ash method(87%) but higher than those of other methods. The dry ash method had the lowest standard deviations and revealed the highest correlation coefficient($r=0.98^{\ast\ast}$) in Cd contents with the standard wet ash method. These results demonstrated that the dry ash method, ashing 50g brown rice at $600^{\circ}C$, would be as efficient as the wet ash method and could be employed as a recommended procedure for the Cd analysis of brown rice.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.684-685
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• 2013

p-형 반도체인 Cu(In,Ga)$Se_2$ (CIGS) 광 흡수 층은 이보다 에너지 밴드 간격이 큰 n-형 반도체와 이종 접합을 형성한다. 흡수층과 윈도우층 사이의 결정구조 차이와 밴드갭 에너지 차이를 완화시키기 위해 버퍼층이 필요하다. 버퍼층을 형성하는 물질로 화학적 용액 성장법(Chemical Bath deposition)을 사용한 CdS가 많이 적용되어 왔으나 Cd의 유해성 및 습식 공정으로 인한 연속공정에 대한 어려움이 있다. 따라서 버퍼층을 Cd을 포함하지 않는 ZnS, $In_2S_3$, (Zn, Mg)O 등과 같은 물질로 대체하여 원자층 증착법(Atomic Layer Deposition), 펄스레이져증착법(Pulsed Laser Deposition), 스퍼터링(sputtering) 등과 같은 건식으로 성장시키는 연구가 활발히 진행되고 있다. 본 연구에서는 $ZnO_{1-x}S_x$ ($0.2{\leq}x{\leq}0.4$)를 반응성 스퍼터링으로 증착하여 큰 밴드갭 에너지와 높은 광투과율를 갖는 버퍼층을 제작하였다. CIGS 박막의 손상을 줄여주기 위하여 RF 파워는 240, 200, 150, 100 W로 변화시켰다. CIGS 태양전지의 I-V 측정 결과, RF 파워가 150 W일 때 10.7%의 가장 높은 변환 효율을 보였고, 150 W 이상에서는 파워가 증가할 때 단락전류는 감소하였으며 개방전압은 다소 증가하였다. 반면 100 W에서 단락전류는 다소 증가하는 것에 반해 개방 전압이 급격히 낮아졌다. 이것은 파워에 따라 결합되는 산소의 양이 다르기 때문으로 생각된다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.10
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• pp.37-44
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• 1999

This paper report the implementation results of Monte Carlo numerical calculation for ion distributions in plasma dry etching chamber and of the surface evolution simulator using cell removal method for topographical evolution of the surface exposed to etching ion. The energy and angular distributions of ion across the plasma sheath were calculated by MC(Monte Carlo) algorithm. High performance MPP(Massively Parallel Processing) algorithm developed in this paper enables efficient parallel and distributed simulation with an efficiency of more than 95% and speedup of 16 with 16 processors. Parallelization of surface evolution simulator based on cell removal method reduces simulation time dramatically to 15 minutes and increases capability of simulation required enormous memory size of 600Mb.

• Resources Recycling
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• v.25 no.3
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• pp.49-54
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• 2016

In this study, zircon sand is separated into zirconia and silica by using the Ar-$H_2$ arc plasma refining. And then silica is removed from it by the microwave leaching method to produce a high pure zirconia. Plasma melting consist of two sequential processes; reduction process with Ar gas only followed by refining process with Ar-$H_2$ gas. After cooling in chamber. The solid phase obtained at $240^{\circ}C$ were found to be composed of 20% sulfuric acid solution. The solution was used as a leaching solution with microwave irradiation to obtain a high purity zirconia.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.418-418
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• 2010

최근 친환경 저전력 차세대 조명소자로 발광다이오드가 각광을 받고 있다. 하지만 종래의 수평형 발광다이오드는 사파이어 기판의 열악한 열전도도 및 전기전도도 특성으로 인하여 효율적인 열방출의 저하가 생기게 되고, 양전극과 음전극의 수평배치에 기인한 심각한 전류쏠림현상 등이 수평형 발광다이오드의 고전력 소자로서의 응용에 걸림돌로 작용하고 있다. 근래에 수평형 발광다이오드의 대안 중 하나로 수직형 발광다이오드에 대한 연구가 활발히 진행되고 있다. 수직형 발광다이오드에서는, 수평형 발광다이오드에서의 전류쏠림현상을 향상시키기 위해 얀전극과 음전극을 수직으로 배치시킨다. 그리고 열전도도 및 전기전도도 특성이 떨어지는 사파이어를 제거하기 위해 LLO(Laser Lift Off)공정이 사용된다. LLO공정으로 인해 수직형 발광다이오드의 구조는 수평형 발광다이오드와 달리 n-GaN이 위로 배치되는 특성을 가진다. 본 연구에서는, 수직형 발광다이오드의 광추출 효율을 증가시키기 위해 SiO2 나노입자를 이용한 GaN 표면요철 형성기술을 개발, 적용 하였다. SiO2 나노입자를 n-GaN상에 단일층으로 분산시키기 위해 PR(PhotoResist), 나노입자, IPA(Isopropyl Alcohol)이 혼합된 용액을 스핀코팅시켰고 그 결과를 SEM으로 확인할 수 있었다. GaN 식각을 위해 SiO2 나노입자를 마스크로 사용하였고, BCl3가스를 사용한 건식식각을 진행하였다. 그 결과 조밀하고 균일한 크기의 Cylinderical Trapezoid 식각 형상이 n-GaN표면에 형성되었음을 SEM으로 확인할 수 있었다. 우리는 표면요철이 없는 발광다이오드와 SiO2 나노입자를 이용한 표면요철이 형성된 발광다이오드의 특성을 비교하였다. 그 결과 표면요철이 있을 때 광출력이 증가함을 확인할 수 있었다. 거기에 더하여 표면요철의 높이가 300nm~1000nm로 변화함에 따른 소자의 특성변화 또한 관찰할 수 있었다.

• Journal of Climate Change Research
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• v.2 no.2
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• pp.107-113
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• 2011

In this research, we described the experimental results for the improvement of Potassium based sorbents. These sorbents have been actually used in the 0.5 MW $CO_2$ capture plant located in Hadong #3 Power Plant. Firstly, we had shaped two kinds of sorbents using a spray dryer. These sorbents applied magnetite & copper oxide as an additive. And the magnetite sorbent was evaluated more excellent relatively in the attrition index. Secondly, We had obtained TGA multicycle experimental results of the improved Potassium based sorbent which applied magnetite as an additive. Consequently, $CO_2$ sorption capacity had been sustained 5.5 wt% after 2nd cycle and attrition index was very excellent as 0.5%. Finally, we had investigated the characteristics of the sorbent following in properties of supporters. As a result, the sorption capacity of the KMO sorbent used base material as a supporter was appeared as 7.2 wt%.

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.6
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• pp.1175-1180
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• 2022

STI has been studied a lot as a process technology for wide area planarization according to miniaturization and high integration of semiconductor devices. In this study, as methods for improving the STI profile, wet etching of pad oxide using hydrofluorine solution and dry etching of O₂+CF₄ after STI dry etching were proposed. This process technology showed improvement in profile imbalance and leakage current between patterns according to device density compared to the conventional method. In addition, as a result of measuring the HLD thickness after CMP for a device having the same STI depth and HLD deposition, the measured value was different depending on the device density. It was confirmed that this was due to the difference in the thickness of the nitride film according to the device density after CMP and the selectivity of the slurry.

• Resources Recycling
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• v.28 no.2
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• pp.31-39
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• 2019

The pelletizing of printed circuit board (PCB) sludge was researched for copper recovery in pyrometallurgical process. This pelletizing was carried out by using self-manufactured compression-type apparatus after pre-treatments (drying, water scrubbing, size classification) were proceeded. The physical properties (compression strength and drop-breakage test) were tested with a change of sludge sizing and the number of compression. In the case of using the undersized sludge of #140, its properties were improved to 0.6 MPa and 9.3 times. Moreover, they increased to 0.82 MPa and 19.0 times by using the #140 ~ 325 sludge. These imply that the packing density increases due to the elimination of large-sized sludge (#140), and also the weight of required binder decreases by the removal of fine-sized sludge (#325).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.129-132
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• 2003

Used cutting fluid from machining processes is harmful to both environment and human health. Chemical substances that provide the lubrication function in the machining process are toxtc to the environment if the cutting fluid is released to soil and water and caused serious health problems to workers who are exposed to the cutting fluid in both liquid and mist form. Recently. cost of using cutting fluid is increasing as the number and the extensiveness of environmental protection laws and regulations increase. Therefore, the use of cutting fluid in machining processes place an enormous burden on manufacturing companies to cover the additional costs associated with their use and protection of our environment. Current trends in manufacturing are focused on minimizing or eliminating the use of metalworking fluids in machining processes. And the increased costs for the disposal of waste products (swarf, coolants and lubricants), especially in industrially developed countries, has generated interest in dry machining. A variety of new techniques are testimony that new technology has rationalized further efforts to research and implement dry machining processes. This paper presents the developed equipment, the process optimization and the applications in the field of surface grinding for the new cryogenic dry machining using a compressed cooling air. The investigated new machining process method shows many advantages compared to conventional techniques with cutting fluid.