• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.133-136
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• 2004

In this study, the characteristics of 3C-SiC ohmic contact were investigated. Titanium-tungsten(TiW) films were used for contact metalization. The ohmic contact resistivity between 3C-SiC and TiW was measured by HP4155 and then calculated with the circular transmission line method(C-TLM). And also the physical properties of TiW and the interface between TiW and 3C-SiC were analyzed using XRD and AES. TiW films make a good role of a diffusion barrier and their contact properties with 3C-SiC are stable at high temperature.

• Journal of the Korean Ceramic Society
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• v.33 no.4
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• pp.418-424
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• 1996

(Ti.W)C complex carbide was synthesized by self-propagating high temperature synthesis (SHS) chemical furnace. Attempt to find the optimal condition for synthesis of (Ti.W)C the effects of molar ratio of Ti:W:C on the synthesized powders and mechanical properties were investigated, Optimum molar ratio of these synthe-sized powder was Ti:W:C=0.7:0.2:1.0 The bulk density M,O.R Hardness Fracture toughness of (Ti.W)C complex carbide sintered at 200$0^{\circ}C$ for 60 min by hot-pressing under the pressure of 20 MPa were 7.6g/cm3, 475 MPa, 17,.7 GPa respectively.

• Journal of the Korean Ceramic Society
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• v.31 no.1
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• pp.25-30
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• 1994

W-Ti-C-N based multiphase hard materials have been prepared from WC/TiN powder mixture. By sintering at and above 190$0^{\circ}C$, the two phases of powder mixture has transformed into intermixed W, W2C and Ti(C, N) phases. For the temperature range between 180$0^{\circ}C$ and 210$0^{\circ}C$, the sintered or hot pressed samples show maximum density and hardness. The seems that metallic W grains enhance the fracture toughness of materials. The wear resistance of the material is found to increase with increasing hardness.

• Journal of Powder Materials
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• v.14 no.3 s.62
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• pp.208-214
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• 2007

The microstructure and hardness of (W,Ti)C cemented carbides with a different metallic binder composition of Ni and Co fabricated by powder technology were investigated. The densifications of the prepared materials were accomplished by using vacuum sintering at $1450^{\circ}C$. Nearly full dense (W,Ti)C cemented carbides were obtained with a relative density of up to 99.7% with 30 wt.% Co and 99.9% with 30 wt.% Ni as a metallic binder. The average grain size of the (W,Ti)C-Co and the (W,Ti)C-Ni was decreased by increasing the metallic binder content. The hardness of the dense (W,Ti)C-15 wt%Co and (W,Ti)C-15 wt%Ni, was greater than that of the other related cemented carbides; in addition, the cobalt-based cemented carbides had greater hardness values than the nickel-based cemented carbides.

• Analytical Science and Technology
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• v.15 no.1
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• pp.15-19
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• 2002

The pretreatment of tungsten added $BaTiO_x$ ceramics was performed to improve the recovery of Ba, Ti and W. $BaTiO_x$ ceramics were digested with HF : HCl ( 1 : 2 ) mixture in an acid digestion bomb at $220^{\circ}C$ for 3 hrs. The concentration of Ba, Ti and W were determined by ICP-AES. Recoveries of Ba, Ti and W were 99.6%, 99.8% and 99.2%, respectively. And their C.V. values were 1.02%, 0.73% and 1.79%. Using this method, the analytical results of Ba, Ti and W for a real sample were obainted to be 25.9% (w/w), 38.8% (w/w) and 3.31% (w/w), respectively.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.131-135
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• 2005

This paper describes the ohmic contact formation of single crystalline 3C-SiC thin films heteroepitaxially grown on Si(001) wafers. In this work, a TiW (Titanium-tungsten) film as a contact matieral was deposited by RF magnetron sputter and annealed with the vacuum and RTA (rapid thermal anneal) process respectively. Contact resistivities between the TiW film and the n-type 3C-SiC substrate were measured by the C-TLM (circular transmission line model) method. The contact phases and interface the TiW/3C-SiC were evaulated with XRD (X-ray diffraction), SEM (scanning electron microscope) and AES (Auger electron spectroscopy) depth-profiles, respectively. The TiW film annealed at $1000^{\circ}C$ for 45 sec with the RTA play am important role in formation of ohmic contact with the 3C-SiC substrate and the contact resistance is less than $4.62{\times}10^{-4}{\Omega}{\cdot}cm^{2}$. Moreover, the inter-diffusion at TiW/3C-SiC interface was not generated during before and after annealing, and kept stable state. Therefore, the ohmic contact formation technology of single crystalline 3C-SiC using the TiW film is very suitable for high temperature MEMS applications.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1311-1312
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• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using 4he C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}{\cdot}cm^2$ of was obtained due to the improved interfacial adhesion.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.4
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• pp.133-137
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• 2001

The properties of TiC/Al surface alloy prepared using a high power $CO_2$-laser was investigated. To analyze this process, the physical properties between substrate [Al] and TiC powder were measured. Surface layer size profiles, optical absorption rate and powder efficiency were measured as afunction of the laser output in TiC/Al matrix. Regardless of TiC powder existence, the absorption rate in substrate Al was decreased when laser output increased. When the laser output increased in the range of 2kW to 4.5 kW, the powder efficiency increased from 4% to 12%. However, TiC powder were not melted in molten aluminum. As a result, increased powder particles easily penetrated to the surface layer and created a two phase states in the metal matrix.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.117-125
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• 1996

The variation of the interfacial and the electrical properties of SiO$_{2}$TiW layers as a function of anneal temperature was extensively investigated. During the deposition of SiO$_{2}$ on TiW chemical bonds such as SiO$_{2}$, TiW, WO$_{3}$, WO$_{2}$ TiO$_{2}$ Ti$_{2}$O$_{5}$ has been created at the SiO$_{2}$/TiW interface. At the anneal temperature of 300$^{\circ}C$, WO$_{3}$ and TiO$_{2}$ bonds started to break due to the reduction phenomena of W and Ti and simultaneously the metallic W and Ti bonds started to create. Above 500$^{\circ}C$, a part of Si-O bonds was broken and consequently Ti/W silicide was formed. Form the current-voltage characteristics of Al/Sico$_{2}$(220$\AA$)/TiW antifuse structure, it was found that the breakdown voltage of antifuse device wzas decreased with increasing annealing temperature for SiO$_{2}$(220$\AA$)/TiW layer. When r, the insulating property of antifuse device of the deterioration of intermetallic SiO$_{2}$ film, caused by the influw of Ti and W.W.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.406-407
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• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.