• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.3
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• pp.407-410
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• 1998

The characteristics of $(Ba,Sr)TiO_3$[BST] thin films with the variation of $O_2/Ar$ ratio in sputtering gas deposited on $RuO_2$ bottom electrode were investigated. Dielectric constant of BST film increases from 135 to 190 with increasing oxygen partial pressure from 10 to 50, which is mainly due to the improved crystallinity of BST film. The instability of $RuO_2$ surface in $BST/RuO_2$ interface and the increase in the surface roughness of BST thin films with higher $O_2/Ar$ ratio appeared to play an important roles on the degradation of the leakage current characteristics of $Al/BST/RuO_2$ capacitor with various $O_2/Ar$ ratio in sputtering gas. As a consequence, the leakage current of BST thin film showed the lowest value of $1.9{\times}10^{-7}\; A/{\textrm}{cm}^2$ at $O_2/Ar{\approx}1/9$.

• Journal of the Korean Vacuum Society
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• v.3 no.1
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• pp.117-121
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• 1994

SrTiO3(100) 단결정을 3keV 아르곤이온으로 에칭하면 표면원소의 산화 상태가 환원되고 표면의 거칠기가 증가하는 것이 XPS와 SEM으로 측정되었다. 그러나 3keV의 산소이온으로 에칭하면 표면원소 의 화학적 상태도 변하지 않고 표면도 평탄한 상태로 계속 유지된다. 산소 이온에 의하여 에칭된 SrTiO3 기판상에 off-axis rf 스퍼트링 방법으로 성장된 YBa2Cu3Ox 박막이 아르곤 이온에 의하여 에칭 된 SrTiO3 기판상에 성장된 YBa2Cu3Ox 박막보다 높은 Tc,zero and Jc를 보여주었다. 이논문은 YBCO초전 도 박막의 성장과 전자공학적 활용을 위한 리토그라피 공정에서 이온밀링 공정의 조건은 매우 주의하여 선택되어야 함을 보여준다.

• Journal of the Korean Ceramic Society
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• v.32 no.4
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• pp.516-524
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• 1995

In this study, to prepare the dielectric (Ba, Sr)TiO3 thin films by the sol-gel process, Titaminum (IV) sio-propoxide (Ti[OCH(CH3)2]4), Ba and Sr acetate were used for sol and thin films were prepared by dip-coating process. Stability of sol decreased with the increase of Sr, and thickness of thin films were obtained 0.13~0.17${\mu}{\textrm}{m}$ by 1 coating cycle. Transmittance of amorphous thin films heated at 500 and 55$0^{\circ}C$ was very good, and crystallization tendency of thin films according to heat-treatment temperature and crystallization characteristics of thin films heated at 11$0^{\circ}C$ for 3 hrs were analysed. As a result, good perovskite structure was obtained higher than 100$0^{\circ}C$, and tetragonality of thin film was decreased but pyrochlore was formed with increasing Sr. In case of addition to substitute 0.4mol% Sr for Ba, dielectric constant was 288 and loss factor (tan $\delta$) was 0.04.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.51-51
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• 1996

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.403-409
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• 1999

The dielectric and pyroelectric properties of $Ba_{0.66}$$Sr_{0.38}$$TiO_{3}$(BST) thin films growtn on Pt/Ti/NON/Si us-ing RF magnetron sputtering have been investigated. With increasing the substrate temperature during de-position of the BST film in the range of 300-$600^{\circ}C$ the dielectric and pyroelectric constants of the film were increased due to improved crystallinity of the film. In addition the dependence of the microstructural and electrical properties of BST films onthe deposition temperature of the bottom Pt electrode was studied. The preferred orientation of the BST films as well as the microstructure of the Pt film was greatly in-fluenced by the deposition temperature of the bottom Pt electrode was studied. The preferred orientation of the BSt films as well as the microstructure of the Pt film was greatly in-fluenced by the deposition temperature of the bottom Pt electrodes. and thus so were the pyrolelectric pro-perties of the BST film. The highest value of pyroelectric coefficient at room temperature obtained in this work was $nCcm^{-2}K^{-1}$ which is much higher than those previously reported on other perovskite fer-roelectric thin films.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.99-99
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• 2000

본 논문에서는 RF Magnetron Sputtering 방법으로 Ba0.5Sr0.5TiO3 박막을 Pt/Ti/SiO2/Si 기판위에 증착하였다. Ar과 O2의 가스비는 90:10부터 50:50까지 O2의 함유비율을 10씩 증가시켰으며, 모든 조건에서 증착온도는 실온으로 설정하였다. Ba0.5Sr0.5TiO3 박막의 증착후 각 가스비에 따른 동일한 샘플에 대해 RTA(Rapid Thermal Anneal) 장비를 이용하여 $600^{\circ}C$에서 열처리는 하여 열처리 효과에 대한 특성도 조사하였다. 최종적으로 제작한 BST 커패시터는 Pt/BST/Pt 구조를 갖는 MIM(Metal-Insulator-Metal) 구조의 커패시터였으며 상.하부 전극은 전기적 특성이 우수한 Pt를 사용하였다. 제작된 BST 커패시터를 대해 유전 특성을 조사하기 위해 C-V 측정을 한 결과 산소 함유량이 증가함에 따라 유전율의 증가를 보여주었으며, 제작된 샘플 중 산소 함유량이 30인 샘플은 300이상의 우수한 유전율을 나타내었다. 또한 누설 전류특성에서는 모든 샘플에 대해 1.0V의 인가전압에서 1.0$\times$106A/cm2 이하의 누설 전류 밀도 값을 가져 전기적으로도 안정된 커패시터 구조임을 확인하였다. 또한 막의 증착상태와 미세구조관찰을 위해 SEM 측정을 하였고 구성성분 결정 구조를 알기 위해 XRD 측정도 시행하였다. 결과적으로 본 논문에서 제작된 커패시터 중 Sr/O의 비율이 70:30인 샘플이 가장 우수한 유전특성을 나타내었고, 이 샘플의 유전특성과 누설 전류 특성은 차세대 메모리인 1GigaByte급 DRAM에 적용 가능한 조건들을 만족시켰다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.933-938
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• 2002

(Ba,Sr)TiO$_{4}$ (BST) thin films on Pt/Ti/SiO$_{2}$/Si substrates were deposited by a sol-gel method and the etch characteristics of BST thin films have been investigated as a function of gas mixing ratio. The maximum etch rate of the BST films was 440 $AA$/min under such conditions as: CF$_{4}$(CF$_{4}$＋Ar) of 0.2, RF-power of 700 W, DC-bias voltage of -200 V, pressure of 15 mTorr and substrate temperature of 30 $^{circ}C$. The selectivities of BST to Pt, SiO$_{2}$ and PR were 0.38, 0.25 and 0.09, respectively. In the XPS (X-ray photoelectron spectroscopy) analysis, Barium (Ba) and Strontium (Sr) component in BST thin films formed low volatile compounds such as BaFx, SrFx, which are forms by the chemical reaction with F atoms and is removed by Ar ion bombardment. Titanium (Ti) is removed by chemical reaction such as TiF with ease. The result of secondary ion mass spectrometry (SIMS) analysis confirmed the existence of the BaFx, SrFK, TiFx.

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.33.2-33
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• 2002

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.355-357
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• 1995

Pt(80nm)/$SiO_2$(150nm)/Si 기판위에 $Ba_{0.7}Sr_{0.3}TiO_3$ 박막을 rf-magnetron Sputtering 방법을 이용하여 기판온도 590$^{\circ}C$에서 33nm 두께를 증착했을 때 비유전율은 268 이었다. 비유전율이 3.9인 $SiO_2$와 비교했을 때 유효 두께인 Tox는 0.45nm 이었다. 누설 전류 밀도는 1.5V 전압을 인가했을 때 $4.21\times10^{-7}A/cm^2$이었다.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.370-374
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• 2002

This paper describes the design and fabrication of distributed analog phase shifter circuit. The phase shifter consist of coplanar waveguide(CPW) lines that are periodically loaded with voltage tunable (Ba,Sr)TiO$_3$ thin film interdigital(IDT) capacitors deposited by the pulsed laser deposition(PLD) on (001) MgO single crystals. The phase velocity on these IDT loaded CPW lines is a function of applied bias voltage, thus resulting in analog phase shifting circuits. The measured differential phase shift is 48$^{\circ}$ and the insertion loss decreases from -5㏈ to -3㏈ with increasing bias voltage from 0 to 40 V at 100㎐.