• Journal of the Mineralogical Society of Korea
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• v.2 no.1
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• pp.8-10
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• 1989

Sphene from the McDonald pegmatite near Bancroft, Ontario, Canada was analyzed using EPMA. It contains 4.3 to 6.3 weight percent of Nb2O5 with an average formula Ca1.02(Ti0.62Al0.22Nb0.07Fe0.06Ta0.01)Si0.99(O4.85F0.16). Three types of subtitutions are possible; 1)2Ti4+=(Nb, Ta)5+ + (Al, Fe3+), 2) Ti + O = (Al, Fe3+) + (F, OH), and 3) 2Ti + O = Fe2+ + (Nb, Ta)5+ + (F, OH). T재 different schemes of substitutions for balancing the analysis are considered when the iron is either all ferric or all ferrous. Assuming stoichiometry fo Ca and Si, a general formula derived from the two different schemes is Ca(Ti0.64Al0.22Fe3+0.06-X {{{{Fe_{x}^{2+} }} Nb0.01)Sio4.80-XF0.16(OH)0.04+x.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.1025-1028
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• 2006

Dense $0.95(Na_{0.5}K_{0.5})NbO_3-0.05LiTaO_3$ (NKN-5LT) ceramics were developed by conventional sintering process. Sintering temperature was lowered by adding $Na_2CO_3$ as a sintering aid. The electrical properties of NKN-5LT ceramics were investigated as a function of $Na_2CO_3$ concentration. When the sample sintered at $1000^{\circ}C$ for 4 h with the addition of 1 mol% $Na_2CO_3$, electro-mechanical coupling factor $(k_p)$ and piezoelectric coefficient $(d_{33})$ of NKN-5LT ceramics were found to reach the highest values of 0.43 and 190 pC/N, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.159-160
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• 2012

지난 30년 동안 플래시 메모리의 주류 역할을 하였던 부유 게이트 플래시 메모리는 40 nm 기술 노드 이하에서 셀간 간섭, 터널 산화막의 누설전류 등에 의한 오동작으로 기술적 한계를 맞게 되었다. 또한 기존의 비휘발성 메모리는 동작 시 높은 전압을 요구하므로 전력소비 측면에서도 취약한 단점이 있다. 그러나 이러한 문제점들을 기존의 Si기반의 소자기술이 아닌 새로운 재료나 공정을 통해서 해결하려는 연구가 최근 활발하게 진행되고 있다. 특히, 플래시 메모리의 중요한 구성요소의 하나인 터널 산화막은 메모리 소자의 크기가 줄어듦에 따라서 SiO2단층 구조로서는 7 nm 이하에서 stress induced leakage current (SILC), 직접 터널링 전류의 증가와 같은 많은 문제점들이 발생한다. 한편, 기존의 부유 게이트 타입의 메모리를 대신할 것으로 기대되는 전하 포획형 메모리는 쓰기/지우기 속도를 향상시킬 수 있으며 소자의 축소화에도 셀간 간섭이 일어나지 않으므로 부유 게이트 플래시 메모리를 대체할 수 있는 기술로 주목받고 있다. 특히, TBM (tunnel barrier engineered memory) 소자는 유전율이 큰 절연막을 적층하여 전계에 대한 터널 산화막의 민감도를 증가시키고, 적층된 물리적 두께의 증가에 의해 메모리의 데이터 유지 특성을 크게 개선시킬 수 있는 기술로 관심이 증가하고 있다. 본 연구에서는 Si3N4/Ta2O5를 적층시킨 staggered구조의 tunnel barrier를 제안하였고, Si기판 위에 tunnel layer로 Si3N4를 Low Pressure Chemical Vapor Deposition (LPCVD) 방법과 Ta2O5를 RF Sputtering 방법으로 각각 3/3 nm 증착한 후 e-beam evaporation을 이용하여 게이트 전극으로 Al을 150 nm 증착하여 MIS- capacitor구조의 메모리 소자를 제작하여 동작 특성을 평가하였다. 또한, Si3N4/Ta2O5 staggered tunnel barrier 형성 후의 후속 열처리에 따른 전기적 특성의 개선효과를 확인하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.115.2-115
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• 1993

• Journal of Applied Reliability
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• v.16 no.1
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• pp.1-6
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• 2016

Purpose: Fluorine doped tin oxide (FTO) bottom electrode for $Ta_2O_5$ based RRAM was studied to apply for transparent resistive switching memory devices owing to its superior transparency, good conductivity and chemical stability. Methods: $ITO/Ta_2O_5/FTO$ (ITF) and $ITO/Ta_2O_5/Pt$ (ITP) devices were fabricated on glass and Si substrate, respectively. UV-visible (UV-VIS) spectroscopy was used to examine transparency of the ITF device and its band gap energy was determined by conventional Tauc plot. Electrical properties, such as electroforming and voltage-induced RS characteristics were measured and compared. Results: The device with an FTO bottom electrode showed good transparency (>80%), low forming voltage (~-2.5V), and reliable bipolar RS behavior. Whereas, the one with Pt electrode showed both bipolar and unipolar RS behaviors unstably with large forming voltage (~-6.5V). Conclusion: Transparent and conducting FTO can successfully realize a transparent RRAM device. It is concluded that FTO electrode may form a stable interface with $Ta_2O_5$ switching layer and plays as oxygen ion reservoir to supply oxygen vacancies, which eventually facilitates a stable operation of RRAM device.

• Journal of the Korean Magnetics Society
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• v.13 no.5
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• pp.204-210
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• 2003

Electron magnetic resonance (EMR) of paramagnetic Cr$^{3+}$, Mn$^{2+}$, and Fe$^{3+}$ impurity ions in ferroelectric LiNbO$_3$ and LiTaO$_3$ single crystals has been studied. The actual sites location of paramagnetic impurity ions in the crystals was suggested from the experimental results and zero field splitting parameters calculated by superposition model. It turns out that Cr$^{3+}$ ions in LiNbO$_3$ crystal have two resonance centers and enter both the Li$^{+}$ and Nb$^{5+}$ ions. Mn$^{2+}$ and Fe$^{3+}$ impurity ions in LiNbO$_3$ substitute for Nb$^{5+}$ ions. However, both Cr$^{3+}$ and Fe$^{3+}$ ions in LiTaO$_3$ crystal reside at Li$^{+}$ ions.$ +/ ions.+/ ions.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.94-94
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• 2001

• Proceedings of the Korean Ceranic Society Conference
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• 2000.10a
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• pp.195.1-195
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• 2000

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.05a
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• pp.132-132
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• 1993

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.157-159
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• 2005

MOS capacitors were fabricated to study electrical and chemical properties of Ta-Mo metal alloy with $ZrO_2$. The work function of Ta-Mo alloy were varied from 4.1eV to 5.1eV by controlling the composition. When the atomic composition of Mo is 10%, good thermal stability up to $800^{\circ}C$ was observed and work function of MOS capacitor was 4.1eV, compatible for NMOS application. But pure Ta exhibited very poor thermal stability. After $600^{\circ}C$ annealing, equivalent oxide thickness of tantalum gate MOS capacitor was continuously decreased. Barrier heights of Ta-Mo alloy and pure metal that supported the work function values were calculated from Fowler-Nordheim analysis. As a result of these electrical?experiments, Ta-Mo metal alloy with $ZrO_2$ is excellent gate electrode for NMOS.