• Journal of the Korean Ceramic Society
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• v.27 no.8
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• pp.1004-1010
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• 1990

SnO2-ThO2-PdCl2-In2O3 gas sensing ceramic systems were studied in order to lowr the operating temperatures and reduce the dependence of ambient temperatures and humidities. Sensing materials were coated by brush on the alumina tube followed by the impregnation of solidfier(ethylsilicate). Coated species were dried and sintered at 75$0^{\circ}C$ for 30min. carbon monoxide gas detecting sensitiviteis were measured in various ambinet temperatures and humidities. In the composition of 94SnO2-5ThO2-PdCl2 system carbon monoxide gas detecting sensors showed the highest detecting sensitivities and the lowest operating temperature(15$0^{\circ}C$). As the ambient temperatures and humidities were increased, sensitivities were decreased. Because the oscillation effects were observed at high humidities, it was suggested that the sensitivities of sensors depend greatly on the humidities.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.184-187
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.973-980
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• 2003

The effects of additives in n-type semiconducting SnO$_2$-based gas sensors on oxidizing gases were investigated. The resistivity of SnO$_2$ sensors decreased when exposed to reducing gases, which act as electronic donors. However, the resistivities of the SnO$_2$ sensors increased when exposed to oxidizing gases, which act as electronic accepters. The products formed from the reaction of oxidizing gases ever SnO$_2$-based powders were analyzed by gas chromatography as compared with those formed from the reaction of reducing gases of alcohols. The SnO$_2$ sensors doped with PdCl$_2$ or A1$_2$O$_3$ showed unique dual response patterns toward oxidizing gases of $CH_3$CN and $CH_3$NO$_2$ depending on the operating temperature. The combination of these two sensors along with proper pattern recognition technique could enhance the selectivity for the gases with electron-accepting groups.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.2 s.17
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• pp.81-87
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• 2004

Semiconductor thick film gas sensors based on tin oxide are fabricated and their gas response characteristics are examined for four simulant gases of chemical warfare agent (CWA)s. The sensing materials are prepared in three different sets. 1) The Pt or Pd $(1,\;2,\;3\;wt.\%)$ as catalyst is impregnated in the base material of $SnO_2$ by impregnation method.2) $Al_2O_3\;(0,\;4,\;12,\;20\;wt.\%),\;In_2O_3\;(1,\;2,\;3\;wt.\%),\;WO_3\;(1,\;2,\;3\;wt.\%),\;TiO_2\;(3,\;5,\;10\;wt.\%)$ or $SiO_2\;(3,\;5,\;10\;wt.\%)$ is added to $SnO_2$ by physical ball milling process. 3) ZnO $(1,\;2,\;3,\;4,\;5\;wt.\%)$ or $ZrO_2\;(1,\;3,\;5\;wt.\%)$ is added to $SnO_2$ by co-precipitation method. Surface morphology, particle size, and specific surface area of fabricated sensing films are performed by the SEM, XRD and BET respectively. Response characteristics are examined for simulant gases with temperature in the range 200 to $400^{\circ}C$, with different gas concentrations. These sensors have high sensitivities more than $50\%$ at 500ppb concentration for test gases and also have shown good repetition tests. Four sensing materials are selected with good sensitivity and stability and are fabricated as a sensor array A sensor array Identities among the four simulant gases through the principal component analysis (PCA). High sensitivity is acquired by using the semiconductor thick film gas sensors and four CWA gases are classified by using a sensor array through PCA.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.186-187
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• 2009

단일 나노선 적용 센서의 단점을 극복하고 신뢰성이 높은 센서를 구현하고자 vapor-liquid-solid (VLS) 법을 이용하여 $SnO_2$ 나노선의 선택적 성장을 통한 나노선 네트워크 구조의 센서를 제조하였다. 분리된 전극층의 변화에 따른 나노선의 접합 특성 변화에 이에 따른 나노선 네트워크 센서의 가스감지 특성을 고찰하였다.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.190.2-190
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• 2003

• Korean Journal of Materials Research
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• v.33 no.5
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• pp.195-204
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• 2023

Micro-electronic gas sensor devices were developed for the detection of carbon monoxide (CO), nitrogen oxides (NO_x), ammonia (NH₃), and formaldehyde (HCHO), as well as binary mixed-gas systems. Four gas sensing materials for different target gases, Pd-SnO₂ for CO, In₂O₃ for NO_x, Ru-WO₃ for NH₃, and SnO₂-ZnO for HCHO, were synthesized using a sol-gel method, and sensor devices were then fabricated using a micro sensor platform. The gas sensing behavior and sensor response to the gas mixture were examined for six mixed gas systems using the experimental data in MEMS gas sensor arrays in sole gases and their mixtures. The gas sensing behavior with the mixed gas system suggests that specific adsorption and selective activation of the adsorption sites might occur in gas mixtures, and allow selectivity for the adsorption of a particular gas. The careful pattern recognition of sensing data obtained by the sensor array made it possible to distinguish a gas species from a gas mixture and to measure its concentration.