• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.7
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• pp.660-664
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• 2008

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness, chemical stability, low friction and good adhesion properties. In this study, we investigated the effect of DC power on the characteristics of TiN thin films deposited on Si and glass substrates by DC magnetron sputtering using TiN target. We made TiN films of 300 nm thickness with various DC powers. The structural properties of films are investigated by x-ray diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester. The rms roughness was measured by atomic forced microscopy (AFM). In the result, TiN films had the smooth surface and exhibited (111) directions with the increase of DC Power. Also, especially in case of 175 W DC power, TiN film exhibited the maximum hardness about 8 GPa, and the critical load near 25.

• Journal of the Korean Society for Heat Treatment
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• v.2 no.4
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• pp.1-10
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• 1989

To investigate the influence of temperature on the TiN film, it was deposited on the STC-3 steel and Si-wafer from $TiCl_4/N_2/H_2$ gas mixture by using the radio frequency plasma assisted chemical vapor deposition. The deposition was performed at temperature of $400^{\circ}C-500^{\circ}C$. The results showed that crystalline TiN film was deposited over $480^{\circ}C$, and all specimens showed the crystalline TiN X-ray diffraction peaks after vacuum heat treatment for 3 hrs, at $1000^{\circ}C$, $10^{-5}torr$. While the film thickness was increased above $480^{\circ}C$, it was decreased under $480^{\circ}C$ as temperature increased. And the contents of titanium were increased and it of chlorine were decreased as temperature increased. Because temperature increase was attributed to the increase in the density of TiN film, surface hardness of TiN film was increased with temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.1-5
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• 2013

In this paper, we investigated the etching characteristics of the TaN thin films and the surface reaction of TaN thin films after etching process. The etching characteristics of the TaN thin films were carried out using inductively coupled plasma (ICP). The etch rate and the selectivity of TaN to $SiO_2$ and TaN to PR were measured by varying the gas mixing ratio, RF power, DC-bias voltage, and process pressure in CF-based plasma. The surface reaction of TaN thin films were determined by x-ray photoelectron spectroscopy (XPS).

• Fire Science and Engineering
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• v.16 no.4
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• pp.15-19
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• 2002

This dissertation is about the development of $BaTiO_3$-type PTC(Positive Temperature Coefficient) thermistor by composition method. A multilayer-type PTC samples were fabricated under optimal conditions after setting the experimental composition equation as ($Ba_{0.95-x}$S $r_{0.05}$$Ca_{x}$ )$TiO_3$-$0.01TiO_2$-$0.01SiO_2$-$\alpha$$MnCO_3$-$\beta$N $b_2$ $O_{5}$.) and their testing results were analyzed. The optimal sin-tering and cooling temperatures were 13$50^{\circ}C$ for two hours and $100^{\circ}C$/h for an hour, respectively; By composing Ca and Mn, dopants to lower the resistivity at room temperature, and Nb, a dopant to raise peak resistivity(Ca:5 mol%, Mn:0.08 mol%, Nb:0.18 mol%), appropriately, a PTC thermistor, having the characteristics of relatively low resistivity at room temperature and high peak resistivity and a good temperature coefficient, has been developed. And we find that it is possible of application for fire detection sensor.r.r.

• Industrial Engineering and Management Systems
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• v.15 no.2
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• pp.123-130
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• 2016

We introduce a queueing system with general arrival stream and exponential service time under the N-policy, where customers may renege during idle period and arrival rates may vary according to the server's status. Probability distributions of the lengths of idle period and busy period are derived using absorbing Markov chain approach and a method to obtain the optimal control policy that minimizes long-run expected operating cost per unit time is provided. Numerical analysis is done to illustrate and characterize the method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.62-65
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• 1997

Indium nitride thin films were deposited on Si(100) substrates by reactive sputtering method. The metallic indium target was sputtered by nitrogen gas with rf sputtering equipment. The surface morphology and cross-section of the InN thin films were investigated by scanning electron microscopy. The crystal orientations were investigated by X-ray diffraction and the Hall effect were measured with van der Pauw method. The indium nitride thin film showed high Hall mobility(215$\textrm{cm}^2$/V-sec) at 5mTorr total pressure and rf power 60W.

• Journal of the Korean Ceramic Society
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• v.29 no.2
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• pp.143-151
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• 1992

Partially stabilized alpha-sialon composition (X=0.1) powder was hot-pressed at 1800~200$0^{\circ}C$ for 0~90 min with 30 MPa. Sintering behavior, phase changes and mechanical properties for the specimens were studied. As sintering temperature was raised from 1800 to 190$0^{\circ}C$, the relative density tended to increase and reached 99% of theoretical at 190$0^{\circ}C$. However the amount of alpha-sialon decreased because alpha-sialon transformed to beta-Si3N4 and yttrium rich silicate glass. In the case of hot-pressing at 190$0^{\circ}C$ for various times, densification increased with sintering time and full densification above 99% of theoretical was attained by 30 min. The amount of alpha-sialon decreased with sintering time. The maximum strength of 825 MPa was obtained by hot-pressing at 190$0^{\circ}C$ for 60 min.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.512-518
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• 1996

Amorphous carbon nitride (a-C:N) multilayerfilms are formed by using altermating conditions during film deposition in are ion plating process. Because hard a-C:N films prepared with suitable megative bias voltages have large compressive stress, it is difficult to increase film thickness more than 200nm. Preparing multilayer films composed of hard layers and soft layers, we can grow thick multilayer films on Si and SKH steel substrate. The total thickness of multilayer films is more than 1$\mu\textrm{m}$. The multilayer films are several times thicker than the single layer films and almost equal in hardness and internal stress to the single layer ones. X-ray photoelectron spectroscopy(XPS) and Raman spectroscopy reveal that multilayer films equal to single layer films in structure, which is similar to the structure of DLC films.

• Journal of the Korean Institute of Gas
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• v.16 no.5
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• pp.14-20
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• 2012

Biogas can be obtained from biogenic materials through an anaerobic digestion process. Since biogas has low calorific value and its composition significantly varies, appropriate combustion strategies need to be established to obtain stable combustion in engine applications. In this study, efforts have been made to investigate the effects of inert gas composition variations on engine performance and emissions. Results show that the MBT spark timing was advanced and $NO_x$ was reduced as the inert gas in the biogas rose. Moreover, $NO_x$ emission drop in $CO_2$ diluted biogas was more significant than that of $N_2$ due to higher heat capacity of $CO_2$, while THC emissions showed the opposite tendency. Thermal efficiency was increased in $N_2$ case with elevation of $N_2$ due to the decreased heat loss and PMEP. However, there is no difference in $CO_2$ case because of deteriorated flame propagation speed.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.812-818
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• 2000

We studied the effects of Ge preamorphization (PAM) on 0.25$\mu\textrm{m}$ Ti-salicide junctions using comparative study with As PAM. For each PAM schemes, ion implantations are performed at a dose of 2E14 ion/$\textrm{cm}^2$ and at 20keV energy using $^{75}$ /As+and GeF4 ion sources. Ge PAM showed better sheet resistance and within- wafer uniformity than those of As PAM at 0.257m line width of n +/p-well junctions. This attributes to enhanced C54-silicidation reaction and strong (040) preferred orientation of the C54-silicide due to minimized As presence at n+ junctions. At p+ junctions, comparable performance was obtained in Rs reduction at fine lines from both As and Ge PAM schemes. Junction leakage current (JLC) revels are below ~1E-14 A/$\mu\textrm{m}^{2}$ at area patterns for all process conditions, whereas no degradation in JLC is shown under Ge PAM condition even at edge- intensive patterns. Smooth $TiSi_2$ interface is observed by cross- section TEM (X- TEM), which supports minimized silicide agglomeration due to Ge PAM and low level of JLC. Both junction break- down voltage (JBV) and contact resistances are satisfactory at all process conditions.