X-ray Scattering Study of Reactive Sputtered Ta-N/Ta/Si(001)Film as a Barrier Metal for Cu Interconnection (구리배선용 베리어메탈로 쓰이는 Ta-N/Ta/Si(001)박막에 관한 X-선 산란연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2001.05b
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- pp.79-83
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- 2001