• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.12 no.4
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• pp.275-286
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• 2014

This study evaluated the evolution stage and origin of chemical components of 12 boreholes at crystalline bedrock using multivariate statistical and groundwater quality analyses. Groundwater types are mostly belonged to Na(Ca)-$HCO_3$ and Ca-$HCO_3$ types, indicating that directly reaction of cation exchange ($Ca^{2+}{\rightarrow}Na^+$) prevailed. The degree of groundwater evolution is included the range from low to intermediate stage based on field and laboratory analytical conditions. As a result of multivariate statistical analysis, a typical indicator of groundwater contamination, $NO_3$-, has the positive correlation with $Na^+$ and $Cl^-$. The origin of sea spary ($Cl^-$) has the positive correlation with $Na^+$, $SO{_4}^{2-}$, $Mg^{2+}$, and $K^+$, while not correlation with $Ca^{2+}$, $Fe^{2+}$, $HCO_3{^-}$, $F^-$, and $SiO_2$. The concentration of $Cl^-$ and $NO_3{^-}$ belongs to general quality of groundwater and not exceeds over the Korean standard for drinking water. And the negative values of saturation index of minerals are calculated with chemical components in groundwater. Therefore, most of chemical components of groundwater in the study area are originated from natural process between rock and groundwater, whereas some of components are derived from sea spary and anthropogenic sources related to agricultural activities.

• Bulletin of the Korean Chemical Society
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• v.13 no.2
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• pp.187-192
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• 1992

The classical trajectory method, previously applied to the reactions of polyatomic molecules with fcc structured metal solids[S. C. Park, C. H. Cho, and C. H. Rhee, Bull. Kor. Chem. Soc., 11, $1(1990)]^1$ is extended to the collision energy dependence of the reaction of the Al solid by $SiCl_4$ molecules. We have calculated etching yields, degrees of anisotropy, kinetic energy distributions, and angular distributions for the reactions of the Al solid and compared with those for the reactions of the Cu solid. Over the range of collision energies we considered, the reactions of the Al soIid show higher etching yield and better anisotropy than the reactions of the Cu solid. Details of reaction mechanisms and the relevance of these calculations for the dry etching of CuAl alloy are discussed.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.153-161
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• 1992

A plasma has been used in a high vaccum, cold wall reactor for low temperature deposition of C54 TiSi2 and for in-situ surface cleaning prior to silicide deposition. SiH4 and TiCl4 were used as the silicon and titanium sources, respectively. The deposited films had low resistivities in the range of 15~25 uohm-cm. The investigation of the experimental variables' effects on the growth of silicide and its concomitant silicon consumption revealed that and were the dominant species for silicide formation and the primary factors in silicon consumption were gas composition ratio and temperature. Increasing silane flow rate from 6 to 9 sccm decreased silicon consumption from 1500 A/min to less than 30 A/min. Furthermore, decreasing the temperature from 650 to $590^{\circ}C$ achieved blanket silicide deposition with no silicon consumption. A kinetic model of silicon consumption is proposed to understand the fundamental mechanism responsible for the dependence of silicon consumption on SiH4 flow rate.

• Corrosion Science and Technology
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• v.11 no.4
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• pp.108-111
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• 2012

The effects of volume fraction (15-30%) of SiC particulate reinforcements on the corrosion behavior of SiCp/7091 Al composites in the 3.5% NaCl solution were studied by electrochemical techniques and scanning electron microscopy. The results showed that the amount of SiC particulate reinforcements did not cause much difference in the corrosion behavior of SiCp/7091 Al composites but the corrosion rate was proportional to the amount of SiCp reinforcement. And numerous pits and severe dissolution of the matrix was observed probably due to the discontinuities and galvanic effects between Al matrix and SiC reinforcements.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.182-185
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• 2002

자기정렬구조의 실리콘-게르마늄 이종접합 트랜지스터에서 $f_{max}$를 높이기 위한 방안으로 베이스의 저항 값을 감소시키고자 외부 베이스에 실리콘 및 실리콘-게르마늄 박막을 저온에서 선택적으로 성장할 수 있는 방법을 연구하였다. RPCVD를 이용하여 $SiH_{2}Cl_{2}$과 $GeH_{4}$를 소스 가스로 하고 HCI을 첨가하여 선택성을 향상시킴으로써 $675\sim725^{\circ}C$의 저온에서도 실리콘 및 실리콘-게르마늄의 선택적 에피성장이 가능하였다. 고온 공정에 주로 이용되는 $SiH_{2}Cl_{2}$를 이용한 실리콘 증착은 $675^{\circ}C$에서 열분해가 잘 이루어지지 않고 HCl의 첨가에 의한 식각반응이 동시에 진행되어 실리콘 기판에서도 증착이 진행되지 않으나 $700^{\circ}C$ 이상에서는 HCI을 첨가한 경우에 한해서 선택성이 유지되면서 실리콘의 성장이 이루어졌다, 반면 실리콘-게르마늄막은 실리콘에 비해 열분해 온도가 낮고 GeO를 형성하여 잠입시간을 지연하는 효과가 있는 게르마늄의 특성으로 인해 선택성이나 증착속도 모두에서 유리하였으나 실리사이드 공정시에 표면으로 게르마늄이 석출되는 현상 등의 저항성분이 크게 작용하여 실리콘-게르마늄막 만으로는 외부 베이스에의 적용은 적절하지 않았다. 그러나 실리콘막을 실리콘-게르마늄막 위에 Cap 층으로 증착하거나 실리콘막 만으로 외부 베이스에 선택적으로 증착하여 베이스의 저항을 70% 가량 감소시킬 수 있었다.

• Korean Journal of Optics and Photonics
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• v.5 no.4
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• pp.499-504
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• 1994

Ti-doped BSG (borosilicate glass) soot films on the silicone substrate have been deposited in the mixture of $SiCl_{4}$, TMB, $TiCL_{4}$ by flame hydrolysis deposition technique. The soot films are melted to form integrated fine glass films. We can fabricate thick films of serveral $10{\mu}m$ with deposition rate,more than $0.5{\mu}m$/min. Refractive index difference of BSG films are increased to more than 0.3% as function of the amount of Ti dopant. As a result of the process an optical waveguide which is simmilar with dimmension and refractive difference of optical fiber is produced. $BCl_{3}$ is widely used for B dopant, but we abtained the good results by the use of TMB in place of $BCl_{3}$. The melting point of silica soot glass is reduced to $1200^{\circ}C$ increasing B dopant. From FTIR analysis $B_2O_3$ content up to about lOmol% in BSG films. films.

• ETRI Journal
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• v.25 no.4
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• pp.247-252
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• 2003

This paper presents results from experiments on laser-annealed SiGe-selective epitaxial growth (LA-SiGe-SEG). The SiGe-SEG technology is attractive for devices that require a low band gap and high mobility. However, it is difficult to make such devices because the SiGe and the highly doped region in the SiGe layer limit the thermal budget. This results in leakage and transient enhanced diffusion. To solve these problems, we grew in situ doped SiGe SEG film and annealed it on an XMR5121 high power XeCl excimer laser system. We successfully demonstrated this LA-SiGe-SEG technique with highly doped Ge and an ultra shallow junction on p-type Si (100). Analyzing the doping profiles of phosphorus, Ge compositions, surface morphology, and electric characteristics, we confirmed that the LA-SiGe-SEG technology is suitable for fabricating high-speed, low-power devices.

• Journal of the Korean Ceramic Society
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• v.48 no.3
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• pp.236-240
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• 2011

In order to deposit a homogeneous and uniform ${\beta}$-SiC films by chemical vapor deposition, we demonstrated the phase stability of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure, temperature and gas composition as variables. The ${\beta}$-SiC predominant region over other solid phases like carbon and silicon was changed gradually and consistently with temperature and pressure. Practically these maps provide necessary conditions for homogeneous ${\beta}$-SiC deposition of single phase. With the thermodynamic analyses, the CVD apparatus for uniform coating was modeled and simulated with computational fluid dynamics to obtain temperature and flow distribution in the CVD chamber. It gave an inspiration for the uniform temperature distribution and low local flow velocity over the deposition chamber. These calculation and model simulation could provide milestones for improving the thickness uniformity and phase homogeneity.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.229-235
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• 2002

This paper presents the fabrication of polycrystalline thin film transistor(TFT) using sequential lateral solidification(SLS) of amorphous silicon. The fabricated SLS TFT showed high Performance suitable for active matrix liquid crystal display(AMLCD). The SLS process involves (1) a complete melting of selected area via irradiation through a patterned mask, and (2) a precisely controlled pulse translation of the sample with respect to the mask over a distance shorter than the super lateral growth(SLG) distance so that lateral growth extended over a number of iterative steps. The SLS experiment was performed with 550$\AA$ a-Si using 308nm XeCl laser having $2\mu\textrm{m}$ width. Irradiated laser energy density is 310mJ/$\textrm{cm}^2$ and pulse duration time was 25ns. The translation distance was 0.6$\mu$m/pulse, 0.8$\mu$m/pulse respectively. As a result, a directly solidified grain was obtained. Thin film transistors (TFTs) were fabricated on the poly-Si film made by SLS process. The characteristics of fabricated SLS p -type poly-Si TFT device with 2$\mu\textrm{m}$ channel width and 2$\mu\textrm{m}$ channel length showed the mobility of 115.5$\textrm{cm}^2$/V.s, the threshold voltage of -1.78V, subthreshold slope of 0.29V/dec, $I_{off}$ current of 7$\times$10$^{-l4}$A at $V_{DS}$ =-0.1V and $I_{on}$ / $I_{off}$ ratio of 2.4$\times$10$^{7}$ at $V_{DS}$ =-0.1V. As a result, SLS TFT showed superior characteristics to conventional poly-Si TFTs with identical geometry.y.y.y.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.05a
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• pp.11-11
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• 2002