• Journal of the Korean Ceramic Society
• /
• v.34 no.3
• /
• pp.241-248
• /
• 1997

RuO2 thin films were deposited on SiO2(1000$\AA$)/Si and MgO(100) single crystal substrates at low tem-peratures by hot-wall metalorganic chemical vapor deposition(MOCVD), and effects of deposition paramet-ers on the properties of the thin films were investigated. RuO2 single phase was obtained at lower de-position temperature of 25$0^{\circ}C$. RuO2 thin films deposited onto SiO2(1000$\AA$)/Si substrates showed a random orientation, and RuO2 films onto MgO(100) single crystals showed the (hk0) orientation. The crystallinity and resistivity of RuO2 thin films increased and decreased with increasing deposition temperature, respec-tively. The resistivity of RuO2 thin films decreased with decreasing the flow rate. The resistivity of the 2600$\AA$-thick RuO2 thin films deposited with O2 flow rate of 50 sccm at 35$0^{\circ}C$ was 52.7$\mu$$\Omega$-cm, and they could be applicable to bottom electrodes of high dielectric materals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.4
• /
• pp.281-288
• /
• 2001

PZT thin films (3500$\AA$) have been prepard on the Ru/Ru $O_2$ and Ru $O_2$ bottom electrodes with a RF magnetron sputtering system using P $b_{1.05}$(Z $r_{0.52}$, $Ti_{0.48}$) $O_3$ ceramic target. Ru/Ru $O_2$ bottom electrode was fabricated by in-situ processing controlled the $O_2$ partial pressure. The PZT thin films deposited on the Ru/Ru $O_2$ bottom electrode were preferred oriented (101) plane. The PZT thin films deposited on the Ru/Ru $O_2$ bottom electrodes showed better electrical properties than those with Ru $O_2$ bottom electrodes because Ru $O_2$ prevented oxygen vacancies and impurities from existing withing the interface and substrate.e.

• Journal of the Korean Vacuum Society
• /
• v.3 no.4
• /
• pp.442-448
• /
• 1994

용액분무법으로 RuO2 박막을 석영 기판위에 성장시켰다. RuO2 박막의 결정구조는 정방 구조이 며 격자상수 a0=4.508 A, c0=3.092 A 이였다. RuO2 박막은 금속성 전도성을 나타냈다. RuO2박마의 광흡 수도는 후열처리함에 따라 증가하였고 박막의 광흡수도의 최소값은 후열처리 온도에 의존하지 않으며 에너지로 환산하면 ∼2.0eV로 거의 일정하였다. RuO2 박막의 후열처리의 온도와 후열처리 분위기가 기 판위에 성장된 RuO2 박막의 표면형태 grain 크기 grain 경계폭 전기적특성등에 영향을 미쳤다. RuO2 박 막이 실험실내의 공기중에 노출됨으로서 시료의 표면에 S와 C가 물리 흡착되었으며 sputtering 시간이 증가함에 따라 Ar+ 이온 빔의 충겨으로 RuO2가 부분적으로 환원되어 O원자의 피크 대 피크 높이가 감 소하여 O/Ru 의피크 높이의 비가 낮게 관측되었다.

• Korean Journal of Materials Research
• /
• v.11 no.8
• /
• pp.671-678
• /
• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• 전자공학회논문지 IE
• /
• v.46 no.3
• /
• pp.1-5
• /
• 2009

In this paper, we study the electrical characteristics of $RuO_2$/n-GaN Schottky diodes fabricated by using electrochemical metallization. The solution for GaN Schottky electrodes of $RuO_2$ is perchloric acid($HClO_4$). Thickness of $RuO_2$ layer depend on supplied voltage and dipping time. We verified the possibility of the rectifying and non-rectifying devices' electrode which was depend on the thickness of $RuO_2$ layer.

• Corrosion Science and Technology
• /
• v.2 no.4
• /
• pp.189-193
• /
• 2003

The Ru etching using $O_2/C_{12}$ plasmas has been studied by employing the helicon etcher. The changes of Ru etch rate, Ru to $SiO_2$ etch selectivity and Ru electrode etching slope with varied process variables were investigated. The Ru etching slope at the optimized etching condition was measured to be $84^{\circ}$. We reveal that the Ru etching using $O_2/C_{12}$ plasma generates the $RuO_2$ thin film. Possible mechanism of Ru etching is discussed.

• Korean Journal of Materials Research
• /
• v.8 no.12
• /
• pp.1090-1098
• /
• 1998

$RuO_2$ thin films were deposited on Si and Ru/Si substrates by rf magnetron reactive sputtering and annealed in oxygen atmosphere(1atm) to investigate their thermal stability and diffusion barrier property. $RuO_2$ thin films were thermally stable up to 700\ulcorner for 10min. in oxygen atmosphere and showed excellent barrier property against the interdiffusion of silicon and oxygen. After annealing at $750^{\circ}C$ , however, volatilization to higher oxide occurred at the surface and inside of $RuO_2$ thin film and diffusion barrier property was also deteriorated. When annealed at $800^{\circ}C$, $RuO_2$thin film showed a different microstructure from that of $RuO_2$ thin film annealed at 75$0^{\circ}C$. It is likely that surface defect structure of $RuO_2$, $RuO_3$, and excess oxygen had an influence on the mode of volatilization with increasing annealing temperature.

• Journal of the Korean Ceramic Society
• /
• v.33 no.9
• /
• pp.969-976
• /
• 1996

RuO2 thin films were deposited on SiO2(1000 $\AA$)/Si by hot-wall Metal Organic Chemical Vapor Depositon. The crystallinity of RuO2 thin films increased with increasing deposition temperature and the preferred orienta-tion of RuO2 films converted (200) plane to (101) plane with increasing film thicknesses. Such a change in preferred orientation was influenced on the crystallographic structure and the residual stress of RuO2 thin films. The resistivity of the 2700$\AA$-thick RuO2 thin films deposted at 30$0^{\circ}C$ was 52.7$\mu$$\Omega$-cm and they could be applicable to bottom electrodes of high dielectric materials. However the resistivity of RuO2 thin films increased with decreasing film thicknesses. The grain size and the resistivity of RuO2 thin films were densified with increasing the annealing temperature and showed the decrease of resistivity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.717-720
• /
• 2001

Ferroelectric lead ziroconate titanate (PZT) thin film were fabricated on the different bottom electrodes. Both Ru and Ru/RuO$_2$bottom electrodes were deposited by RF-magnetron sputteirng method. The structure phase and surface morphology of the PZT thin film were largely affected by the bottom electrode. It was observerd that used of Ru/RuO$_2$double electrode reduced leakage current and better ferroelectric properties compare with RuO$_2$bottom electrode. From these results, Ru/RuO$_2$hybride bottom electrode is thought to be the available structure for the bottom electrode.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.37 no.3
• /
• pp.1-5
• /
• 2000

Inductively coupled plasma (ICP) excited by a spiral planar antenna is used to etch elctrodes for PZT capacitors. Pt/RuO$_{2}$ bilayers are tested as bottom electrodes for PZT capacitors in order to utilize better leakage characteristics of Pt and easy etch characteristics of RuO$_{2}$ at the same time. The etch rates and selectivities to SiO$_{2}$ hard mask have been measured for each of Pt and RuO$_{2}$ in terms of various plasma conditions. As Cl$_{2}$ ratio increases in $O_{2}$/Cl$_{2}$ mixture, the etch rate of Pt increases while that of RuO$_{2}$ reaches the highest near 10 ％ of Cl$_{2}$. Optimum gas mixture ratio has been determined for etching Pt and RuO$_{2}$ bilayers sequentially, and sub-half micron patterning is demonstrated.