• Title/Summary/Keyword: $N_2$ flow rate

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Role of gas flow rate during etching of hard-mask layer to extreme ultra-violet resist in dual-frequency capacitively coupled plasmas

  • Gwon, Bong-Su;Lee, Jeong-Hun;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.132-132
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    • 2010
  • In the nano-scale Si processing, patterning processes based on multilevel resist structures becoming more critical due to continuously decreasing resist thickness and feature size. In particular, highly selective etching of the first dielectric layer with resist patterns are great importance. In this work, process window for the infinitely high etch selectivity of silicon oxynitride (SiON) layers and silicon nitride (Si3N4) with EUV resist was investigated during etching of SiON/EUV resist and Si3N4/EUV resist in a CH2F2/N2/Ar dual-frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters, such as the CH2F2 and N2 flow ratio and low-frequency source power (PLF). It was found that the CH2F2/N2 flow ratio was found to play a critical role in determining the process window for ultra high etch selectivity, due to the differences in change of the degree of polymerization on SiON, Si3N4, and EUV resist. Control of N2 flow ratio gave the possibility of obtaining the ultra high etch selectivity by keeping the steady-state hydrofluorocarbon layer thickness thin on the SiON and Si3N4 surface due to effective formation of HCN etch by-products and, in turn, in continuous SiON and Si3N4 etching, while the hydrofluorocarbon layer is deposited on the EUV resist surface.

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System Design and Fundamental Experiment for Thrust Control of $GO_2$/PE Hybrid Rocket ($GO_2$/PE 하이브리드 로켓의 추력제어를 위한 시스템 설계 및 기초실험)

  • Lee, Yong-Wu;Kang, Wan-Kyu;Huh, Hwan-Il
    • Journal of the Korean Society of Propulsion Engineers
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    • v.14 no.1
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    • pp.40-47
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    • 2010
  • In this study, basic research on the thrust control by controling oxidizer mass flow rate of a $GO_2$/PE hybrid rocket is presented. For this purpose, hybrid rocket system including oxidizer flow control system and data acquisition system was developed. To control oxidizer mass flow rate, we used needle valve with stepping motor which was controled by LabVIEW program. During the fundamental experiments, this system managed to follow the pre-programmed (20 N - 10 N - 20 N - 0 N) thrust level.

Multi-layer resist (MLR) structure with a very thin DLC layer

  • Kim, H.T.;Kwon, B.S.;Park, S.M.;Lee, N.E.;Cho, H.J.;Hong, B.Y.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.04a
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    • pp.71-72
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    • 2007
  • In this study, we investigated the fabrication of MLR (multi-layer resist) with a very thin diamond-like carbon (DLC) layer. ArF PR/$SiO_2$/DLC MLR structure was investigated and etching characteristics of the DLC layer was patterned using $SiO_2$ hard-mask by varying the process parameters such as different high-frequency/low-frequency combination ($f_{LF}/f_{HF}$), HF/LF power ratio ($P_{HF}/P_{LF}$), $O_2$ flow and $N_2$ flow rate in $O_2/N_2$/Ar plasmas. The results indicated an increased etch rate of DLC for the higher $f_{LF}/f_{HF}$ combination and for the increased low-frequency power ($P_{LF}$). And the etch rate of DLC was decreased with increasing the $N_2$ flow rate in $O_2/N_2$/Ar plasmas. In order to confirm the application of DLC MLR for the etching process of silicon oxide, the stack of ArF PR/BARC/$SiO_2$/DLC/TEOS/Si was investigated.

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Optimization of the $POCI_3$ doping process according to the variation of deposition temperature, gas flow rate and doping time (온도, 가스량 및 도핑시간변화에 따른 $POCI_3$ 도핑 공정의 최적화)

  • 정경화;강정진
    • Electrical & Electronic Materials
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    • v.7 no.3
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    • pp.206-212
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    • 1994
  • In this paper, We discuss the $POCI_3$ doping process according to the variation of deposition temperature, gas flow rate and doping time. The factors acted with $POCI_3$ doping are gas flow rate deposition temperature and time etc. Among them the temperature is the most important factor. For the $POCI_3$ flow rate, it should not exceed the resistivity saturation point developed on poly surface by annealing treatment. Therefore, this study suggests the optimum conditions of Poly-silicon treatments with the $POCI_3$ flow rate.

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Comparison of Egress Modeling and Experiments for Flow Rate in the Bottleneck (병목현상 시 유동률에 대한 피난실험 및 모델링 비교)

  • Hwang, Eun-Kyoung;Woo, Sujin;Kim, Jong-Hoon;Kim, Woon-Hyung
    • Fire Science and Engineering
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    • v.28 no.6
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    • pp.35-40
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    • 2014
  • Bottleneck occurs as many people crowd into narrow doorway or corridor. Delaying egress time is occurred by bottleneck effect, and it is very important phenomenon on the egress analysis for building fire. An analysis of egress time should includes flow rate for considering bottleneck. Flow rate is numbers of people who pass the narrow gate as door or start point of corridor per unit length and unit time. The flow rate resulted from egress modeling should be approached to the result of experiments. In this study, flow rates from modeling by 'Pathfinder' and experiments was compared. The difference between the result from egress modeling and the one from experiments was verified. The average value of experiments is $4.25N/m{\cdot}s$, and the maximum average value of modeling is $1.55N/m{\cdot}s$.

Effects of Cooling Flow Rate on Gas Foil Thrust Bearing Performance (냉각 유량이 가스 포일 스러스트 베어링의 성능에 미치는 영향)

  • Sung Ho Hwnag;Dae Yeon Kim;Tae Ho Kim
    • Tribology and Lubricants
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    • v.39 no.2
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    • pp.76-80
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    • 2023
  • This paper describes an experimental investigation of the effect of cooling flow rate on gas foil thrust bearing (GFTB) performance. In a newly developed GFTB test rig, a non-contact type pneumatic cylinder provides static loads to the test GFTB and a high-speed motor rotates a thrust runner up to the maximum speed of 80 krpm. Force sensor, torque arm connected to another force sensor, and thermocouples measures the applied static load, drag torque, and bearing temperature, respectively, for cooling flow rates of 0, 25, and 50 LPM at static loads of 50, 100, and 150 N. The test GFTB with the outer radius of 31.5 mm has six top foils supported on bump foil structures. During the series of tests, the transient responses of the bearing drag torque and bearing temperature are recorded until the bearing temperature converges with time for each cooling flow rate and static load. The test data show that the converged temperature decreases with increasing cooling flow rate and increases with increasing static load. The drag torque and friction coefficient decrease with increasing cooling flow rate, which may be attributed to the decrease in viscosity and lubricant (air) temperature. These test results suggest that an increase in cooling flow rate improves GFTB performance.

Study on Flow-Supply Characteristics of the Liquid Oxidizer $N_2O$ Reserved in a Tank (탱크 내 $N_2O$액체산화제의 유량공급특성에 관한 연구)

  • Cho, Min-Gyoung;Heo, Jun-Young;Cho, Seung-Hyoung;Sung, Yoo-Jin;Kim, Jin-Kon;Moon, Hee-Jang;Sung, Hong-Gye
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2007.11a
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    • pp.389-392
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    • 2007
  • The study focused on the flow-supply characteristics of the liquid oxidizer $N_2O$ reserved in a tank without any pressurization devices. It was taken accounted that the change of material properties to temperature in the oxidizer tank and the discharge coefficients of both liquid and gas for more precise prediction of the supply mass-flow rate of $N_2O$ oxidizer. To validate the prediction model derived in the study, the experiments were conducted and compare with the theoretical results.

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Infinite Selectivity Etching Process of Silicon Nitride to ArF PR Using Dual-frequency $CH_2F_2/H_2/Ar$ Capacitively Coupled Plasmas (Dual-frequency $CH_2F_2/H_2/Ar$ capacitively coupled plasma를 이용한 실리콘질화물과 ArF PR의 무한 선택비 식각 공정)

  • Park, Chang-Ki;Lee, Chun-Hee;Kim, Hui-Tae;Lee, Nae-Eung
    • Journal of the Korean institute of surface engineering
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    • v.39 no.3
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    • pp.137-141
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    • 2006
  • Process window for infinite etch selectivity of silicon nitride $(Si_3N_4)$ layers to ArF photoresist (PR) was investigated in dual frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters such as low frequency power $(P_{LF})$, $CH_2F_2$ and $H_2$ flow rate in $CH_2F_2/H_2/Ar$ plasma. It was found that infinite etch selectivities of $Si_3N_4$ layers to the ArF PR on both blanket and patterned wafers can be obtained for certain gas flow conditions. The etch selectivity was increased to the infinite values as the $CH_2F_2$ flow rate increases, while it was decreased from the infinite etch selectivity as the $H_2$ flow rate increased. The preferential chemical reaction of the hydrogen with the carbon in the polymer film and the nitrogen on the $Si_3N_4$ surface leading to the formation of HCN etch by-products results in a thinner steady-state polymer and, in turn, to continuous $Si_3N_4$ etching, due to enhanced $SiF_4$ formation, while the polymer was deposited on the ArF photoresist surface.

Processing and Characterization of RF Magnetron Sputtered TiN Films on AISI 420 Stainless Steel (AISI 420 stainless steel 기판위에 D.C magnetron sputtering 법으로 제조한 TiN 박막의 특성 평가)

  • Song, Seung-Woo;Choe, Han-Cheol;Kim, Young-Man
    • Journal of the Korean institute of surface engineering
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    • v.39 no.5
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    • pp.199-205
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    • 2006
  • Titanium nitride (TiN) coatings were produced on AISI 420 stainless steel by DC magnetron sputtering of a Ti target changing the processing variables, such as the flow rate of $N_2/Ar$, substrate temperature and the existence of Ti interlayer between TiN coatings and substrates. The hardness and residual stress in the films were investigated using nanoindentation and a laser scanning device, respectively. The stoichiometry and surface morphology were investigated using X-Ray Diffraction and SEM. The corrosion property of the films was also studied using a polarization method in NaCl (0.9%) solution. Mechanical properties including hardness and residual stress were related to the ratio of $N_2/Ar$ flow rate. The corrosion resistance also was related to the processing variables.

Compensation of Peak Expiratory Air Flow Rate Considering Initial Slope in Velocity Type Air Flow Transducer (속도계측형 호흡기류센서에서 상승시간을 고려한 최고호기유량의 교정 기법)

  • Cha, Eun-Jong;Lee, In-Kwang;Kim, Seong-Sik;Kim, Wan-Suk;Park, Kyung-Soon;Kim, Wun-Jae;Kim, Kyung-Ah
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.4
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    • pp.867-872
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    • 2009
  • Peak expiratory flow rate(PEF) is one of the most important diagnostic parameters in spirometry. PEF occurs in a very short duration during the forced expiratory maneuver, which could lead to measurement error due to non-ideal dynamic characteristic of the transducer. In such case the initial slope of the flow rate signal determines the accuracy of the measured PEF. The present study considered this initial slope as a parameter to compensate PEF. The 26 standard flow rate signals recommended by the American Thoracic Society(ATS) were flown through the air flow transducer followed by simultaneous measurements of PEF and maximum transducer output$(N_{PEF})$. $N_{PEF}$-PEF satisfied a quadratic equation in general, however, two signals (ATS #2 and #26) having large initial slopes deviated from the fitting equation to a significant degree. The relative error was found to be in a linear relationship with the initial slope, thus, $N_{PEF}$ was appropriately compensated to provide accurate PEF with mean relative error less than only 1%. The 99% confidence interval of the mean relative error was less than a half of the error limit of 5% recommended by ATS. Therefore, PEF can be very accurately determined by compensating the transducer output based on the initial slope, which should be a useful technique for air flow transducer calibration.