• 제목/요약/키워드: $In_xGa_{1-x}N$/GaN

검색결과 225건 처리시간 0.024초

Dislocation Density Estimation and mosaic Model for GaN/SiC(0001) by High Resolution x-ray Diffraction

  • Yang, Quankui;Li, Aizhen
    • 한국진공학회지
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    • 제6권S1호
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    • pp.43-46
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    • 1997
  • High resolution x-ray diffraction and two dimensional triple axis mapping were used to characterize a group of GaN layers of about 1.1$\mu$m grown by direct current plasma molecular beam epitaxy technique on 6H-SiC(0001). A FWHM of 11.9 arcmins for an $\omega$ scan and 1.2 arcmins for an $\omega$/2$\theta$ scan were observed. A careful study of the rocking curves showed there were some large mosaics in the GaN layer and a tilt of $0.029^{\circ}$ between the GaN layer and the SIC substrate was detected. The two dimensional triple axis mapping showed that the GaN mosaica were disoriented in the (0001) plane but rather uniformed in direction perpendicular to the plane. A mosaics were disoriented in the (0001) plane but rather uniformed in direction perpendicular to the plane. A mosaic model was deduced to explain the phenomenon and the dislocation density was estimated to be about~$10^9\;\textrm{cm}^{-2}$ acc ding to the model.

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이온주입된 Si(111)에 AlN 완충층을 이용하여 성장시킨 GaN 박막의 특성 (The characteristics of AlN buffered GaN on ion implanted Si(111))

  • 강민구;진정근;이재석;노대호;양재웅;변동진
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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    • pp.165-165
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    • 2003
  • The growth of GaN on Si is of great interest due to the several advantages low cost, large size and high-quality wafer availability as well as its matured technology. The crystal quality of GaN is known to be much influenced by the surface pretreatment of Si substrate [1]. In this work, the properties of GaN overlayer grown on ion implanted Si(111)and bare Si(111) have been investigated. Si(111) surface was treated ion implantation with 60KeV and dose 1${\times}$10$\^$16//$\textrm{cm}^2$ prior to film growth. GaN epilayers were grown at 1100$^{\circ}C$ for 1 hour after growing AlN buffer layers for 15-30 minutes at 1100$^{\circ}C$ with metal organic chemical vapor deposition (MOCVD). The properties of GaN epilayers were evaluated by X-Ray Diffraction (XRD), Scanning electron microscope (SEM) Photoluminescence (PL) at room temperature and Hall measurement The results showed that the GaN on ion implanted Si(111) markedly affected to the structural, optical and electrical characteristic of GaN layers.

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W/InGaN Ohmic 접촉의 전기적 구조적 특성 (Electrical and Structure Properties of W Ohmic Contacts to $\textrm{In}_{x}\textrm{Ga}_{1-x}\textrm{N}$)

  • 김한기;성태연
    • 한국재료학회지
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    • 제9권10호
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    • pp.1012-1017
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    • 1999
  • Si 도핑된 n-$\textrm{In}_{0.17}\textrm{Ga}_{0.83}\textrm{N}$($1.63\times10^{19}\textrm{cm}^{-3}$)에 W을 이용하여 낮은 접촉저항을 갖는 Ohmic 접촉을 형성시켰다. 열처리 온도를 증가시킴에 따라 비접촉 저항이 낮아졌으며, 가장 낮은 비접촉 저항은 $950^{\circ}C$의 질소분위기 하에서 90초간 열처리 해줌으로써 $2.75\times10^{-8}\Omega\textrm{cm}^{-3}$의 낮은 비접촉 저항값을 얻었다. 열처리 온도증가에 따른 $\textrm{In}_{0.17}\textrm{Ga}_{0.83}\textrm{N}$와 W의 계면반응과 W의 표면은 XRD와 SeM을 이용하여 분석하였다. XRD 분석을 통하여 W과 $\textrm{In}_{0.17}\textrm{Ga}_{0.83}\textrm{N}$이 반응하여 계면에 $\beta$-$W_2N$ 상을 형성시킴을 확인할 수 있었다. SEM 분석결과 W 표면은 $850^{\circ}C$의 높은 열처리온도에서도 안정한 상태를 유지하였다. W과 InGaN의 Ohmic 접촉에 있어 비접촉 저항은 열처리 온도를 증가시킴에 따라 낮아지게 되는 온도 의존성을 갖는데 이에 대한 가능한 기구를 제시하였다.

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TGS법으로 성장한 $In_{l-x}Ga_{x}As$의 특성에 관한 연구 (A study on the Properties of $In_{l-x}Ga_{x}As$ Grown by the TGS Methods)

  • 이원상;문동찬;김선태;서영석
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1988년도 추계학술대회 논문집 학회본부
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    • pp.372-375
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    • 1988
  • The III-V ternary alloy semiconductor $In_{l-x}Ga_{x}As$ were grown by the temperature Gradient of $0.60{\leq}x{\leq}0.98$. The electrical properties were investigated by the Hall effect measurement with the Van der Pauw method in the temperature range of $90{\sim}300K$. $In_{l-x}Ga_{x}As$ were revealed n-type and the carrier concentration at 300K were in the range of $9.69{\times}10^{16}cm^{-3}{\sim}7.49{\times}10^{17}cm^{-3}$. The resistivity was increased and the carrier mobility was decreased with increasing the composition ratio. The optical energy gap determined by optical transmission were $20{\sim}30meV$ lower than theoretical valves on the basis of absorption in the conduction band tail and it was decreased with increasing the temperature by the Varshni rule. In the photoluminescence of undoped $In_{l-x}Ga_{x}As$ at 20K, the main emission was revealed by the radiative recombination of shallow donor(Si) to acceptor(Zn) and the peak energy was increased with increasing the composition, X. The diffusion depth of Zn increases proportionally with the square root of diffusion time, and the activation energy for the Zn diffusion into $In_{0.10}Ga_{0.90}As$ was 2.174eV and temperatures dependence of diffusion coefficient was D = 87.29 exp(-2.174/$K_{B}T$). The Zn diffusion p-n $In_{x}Ga_{x}As$ diode revealed the good rectfying characteristics and the diode factor $\beta{\approx}2$. The electroluminescence spectrum for the Zn-diffusion p-n $In_{0.10}Ga_{0.90}As$ diode was due to radiative recombation between the selectron trap level(${\sim}140meV$) and Zn acceptor level(${\sim}30meV$). The peak energy and FWHM of electroluminescence spectrum at 77K were 1.262eV and 81.0meV, respectively.

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MBE로 성장한 GaN 에피층의 급속 열처리 (Rapid Thermal Annealing of GaN EpiLayer grown by Molecular Beam Epitaxy)

  • 최성재;이원식
    • 한국인터넷방송통신학회논문지
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    • 제10권1호
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    • pp.7-13
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    • 2010
  • 질소 분위기하에서 분자선 에피탁시 장치로 성장한 GaN 에피층을 고온 열처리 하였다. 시료는 적절한 조건하에서 급속 열처리 후 구조적인 특성의 향상을 나타내었다. 시료의 결정성의 향상은 에피층의 격자 관련 요소들의 흐트러짐의 감소에 기인한다. 에피층의 열처리는 950도의 급속 열처리로를 이용하여 수행하였다. 고온 급속 열처리가 GaN 에피층의 구조적인 특성들에 미치는 효과는 x선 회절을 통하여 연구하였다. x선 회절 스펙트럼에 있어서 Bragg 피크는 열처리 시간이 증가할수록 각도가 큰 쪽으로 이동하였다. 또한 피크의 FWHM은 열처리 시간이 증가함에 따라 약간의 증가 후 감소하였으며 이후 다시 증가하였다. 이와 같은 결과는 급속 고온 열처리된 GaN 에피층에서 격자 상수에 영향을 미치는 인자들이 에피층의 품질을 좋게 하는 방향으로 일률적으로 변화하는 것이 아니라 에피 품질을 나쁘게 하는 방향으로도 변화한다는 것을 의미한다. 적절한 조건 하에서의 급속 열처리는 에피층의 격자 상수에 관여하는 인자들의 흐트러짐을 감소시켜 에피 결정의 질을 향상시킨다.

The recombination velocity at III-V compound heterojunctions with applications to Al/$_x$/Ga/$_1-x$/As-GaAs/$_1-y$/Sb/$_y$/ solar cells

  • 김정순
    • 전기의세계
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    • 제28권4호
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    • pp.53-63
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    • 1979
  • Interface recombination velocity in $Al_{x}$G $a_{1-x}$ As-GaAs and $Al_{0.85}$, G $a_{0.15}$ As-GaA $s_{1-y}$S $b_{y}$ heterojunction systems is studied as a function of lattice mismatch. The results are applied to the design of highly efficient III-V heterojunction solar cells. A horizontal liquid-phase epitaxial growth system was used to prepare p-p-p and p-p-n $Al_{x}$G $a_{1-x}$ As-GaA $s_{1-y}$S $b_{y}$-A $l_{x}$G $a_{1-x}$ As double heterojunction test samples with specified values of x and y. Samples were grown at each composition, with different GaAs and GaAs Sb layer thicknesses. A method was developed to obtain the lattice mismatch and lattice constants in mixed single crystals grown on (100) and (111)B oriented GaAs substrates. In the AlGaAs system, elastic lattice deformation with effective Poisson ratios .mu.$_{eff}$ (100=0.312 and .mu.$_{eff}$ (111B) =0.190 was observed. The lattice constant $a_{0}$ (A $l_{x}$G $a_{1-x}$ As)=5.6532+0.0084x.angs. was obtained at 300K which is in good Agreement with Vegard's law. In the GaAsSb system, although elastic lattice deformation was observed in (111) B-oriented crystals, misfit dislocations reduced the Poisson ratio to zero in (100)-oriented samples. When $a_{0}$ (GaSb)=6.0959 .angs. was assumed at 300K, both (100) and (111)B oriented GaAsSb layers deviated only slightly from Vegard's law. Both (100) and (111)B zero-mismatch $Al_{0.85}$ G $a_{0.15}$As-GaA $s_{1-y}$S $b_{y}$ layers were grown from melts with a weight ratio of $W_{sb}$ / $W_{Ga}$ =0.13 and a growth temperature of 840 to 820 .deg.C. The corresponding Sb compositions were y=0.015 and 0.024 on (100) and (111)B orientations, respectively. This occurs because of a fortuitous in the Sb distribution coefficient with orientation. Interface recombination velocity was estimated from the dependence of the effective minority carrier lifetime on double-heterojunction spacing, using either optical phase-shift or electroluminescence timedecay techniques. The recombination velocity at a (100) interface was reduced from (2 to 3)*10$^{4}$ for y=0 to (6 to 7)*10$^{3}$ cm/sec for lattice-matched $Al_{0.85}$G $a_{0.15}$As-GaA $s_{0.985}$S $b_{0.015}$ Although this reduction is slightly less than that expected from the exponential relationship between interface recombination velocity and lattice mismatch as found in the AlGaAs-GaAs system, solar cells constructed from such a combination of materials should have an excellent spectral response to photons with energies over the full range from 1.4 to 2.6 eV. Similar measurements on a (111) B oriented lattice-matched heterojunction produced some-what larger interface recombination velocities.ities.ities.s.

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Hybrid Monte Carlo 시뮬레이션에 의한 고속 InAlGaAs/InGaAs HBT의 구조 설계 (Design of high speed InAlGaAs/InGaAs HBT structure by Hybrid Monte Carlo Simulation)

  • 황성범;김용규;송정근;홍창희
    • 전자공학회논문지D
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    • 제36D권3호
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    • pp.66-74
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    • 1999
  • HMC(Hybrid Monte Carlo)시뮬레이션을 이용하여 InAlGaAs/InGaAs HBT의 비평형 고속전송을 해석하였고, 전송시간 및 차단주파수를 향상시키기 위하여 에미터-베이터 이종접합과 콜렉터 구조를 최적 설계 하였다. 시뮬레이션 결과, 에미터 조성경사영역에서 Al 몰비를 xf=1.0에서 xf=0.5로 변화시킬 경우 베이스 전송시간이τb=0.21ps로 가장 짧았다. 콜렉터 전송시간을 단축시킬 목적으로 콜렉터와 베이스 사이에 n\sup +\형 (콜렉터-Ⅰ), I형(콜렉터-Ⅱ), p형(콜렉터-Ⅲ), 콜렉터를 삽입하여 베이스-콜렉터 공간전하영역의 전계분포를 전자의 비평형고속전송을 유지하도록 설계하였다. 콜렉터-Ⅲ 구조에서는 전자의 음이온화된 억셉터가 콜렉터의 전계를 감소시킴으로써 전자가 Γ 밸리에서 먼 거리까지 전송을 가능하게 하여 가장 짧은 콜렉터 전송시간을 나타내었다. 결론적으로 가장 짧은 전송시간 τec는 Al 몰비가 xf=0.5인 에미터 구조와 콜렉터-Ⅲ에서 0.87psec이었고, 차단주파수 ft=183GHz를 나타내었다.

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GaOOH로부터 GaN 분말 형성의 반응역학에 관하여 (On the Reaction Kinetics of GaN Particles Formation from GaOOH)

  • 이재범;김선태
    • 한국재료학회지
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    • 제15권5호
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    • pp.348-352
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    • 2005
  • Gallium oxyhydroxide (GaOOH) powders were heat-treated in a flowing ammonia gas to form GaN, and the reaction kinetics of the oxide to nitride was quantitatively determined by X-ray diffraction analysis. GaOOH turned into intermediate mixed phases of $\alpha-\;and\;\beta-Ga_2O_3$, and then single phase of GaN. The reaction time for full conversion $(t_c)$ decreased as the temperature increased. There were two-types of rapid reaction processes with the reaction temperature in the initial stage of nitridation at below $t_c$, and a relatively slow processes followed over $t_c$ does not depends on temperatures. The nitridation process was found to be limited by the rate of an interfacial reaction with the reaction order n value of 1 at $800^{\circ}C$ and by the diffusion-limited reaction with the n of 2 at above $1000^{\circ}C$, respectively, at below $t_c$. The activation energy for the reaction was calculated to be 1.84 eV in the temperature of below $830^{\circ}C$, and decreased to 0.38 eV above $830^{\circ}C$. From the comparative analysis of data, it strongly suggest the rate-controlling step changed from chemical reaction to mass transport above $830^{\circ}C$.

Demonstration of Nonpolar a-plane Light Emitting Diodes on r-plane Sapphire Substrate by MOCVD

  • Son, Ji-Su;Baik, Kwang-Hyeon;Song, Hoo-Young;Kim, Ji-Hoon;Kim, Tae-Geun;Hwang, Sung-Min
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.147-147
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    • 2011
  • High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

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Heat Treatment of Carbonized Photoresist Mask with Ammonia for Epitaxial Lateral Overgrowth of a-plane GaN on R-plane Sapphire

  • Kim, Dae-sik;Kwon, Jun-hyuck;Jhin, Junggeun;Byun, Dongjin
    • 한국재료학회지
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    • 제28권4호
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    • pp.208-213
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    • 2018
  • Epitaxial ($11{\bar{2}}0$) a-plane GaN films were grown on a ($1{\bar{1}}02$) R-plane sapphire substrate with photoresist (PR) masks using metal organic chemical vapor deposition (MOCVD). The PR mask with striped patterns was prepared using an ex-situ lithography process, whereas carbonization and heat treatment of the PR mask were carried out using an in-situ MOCVD. The heat treatment of the PR mask was continuously conducted in ambient $H_2/NH_3$ mixture gas at $1140^{\circ}C$ after carbonization by the pyrolysis in ambient $H_2$ at $1100^{\circ}C$. As the time of the heat treatment progressed, the striped patterns of the carbonized PR mask shrank. The heat treatment of the carbonized PR mask facilitated epitaxial lateral overgrowth (ELO) of a-plane GaN films without carbon contamination on the R-plane sapphire substrate. Thhe surface morphology of a-plane GaN films was investigated by scanning electron microscopy and atomic force microscopy. The structural characteristics of a-plane GaN films on an R-plane sapphire substrate were evaluated by ${\omega}-2{\theta}$ high-resolution X-ray diffraction. The a-plane GaN films were characterized by X-ray photoelectron spectroscopy (XPS) to determine carbon contamination from carbonized PR masks in the GaN film bulk. After $Ar^+$ ion etching, XPS spectra indicated that carbon contamination exists only in the surface region. Finally, the heat treatment of carbonized PR masks was used to grow high-quality a-plane GaN films without carbon contamination. This approach showed the promising potential of the ELO process by using a PR mask.