• Title/Summary/Keyword: $H_2SiF_6:SiO_3H_2$

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A Study on the Retarding effects of Cememtn Mortar Setting (시멘트 모르타르의 응결 지연 효과에 관한 연구)

  • 이재한;이경희;김홍기
    • Journal of the Korean Ceramic Society
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    • v.33 no.3
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    • pp.307-312
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    • 1996
  • In following addition of 0.3, -0.6, 0.8, 1.0 and 5 weight percent MgSiF66H2O studies have been made of the setting and hardening characteristics of ordinary portland cement. MgSiF66H2O retarded the setting time of ordinary portland cement and extended the induction pariod of the hydration. In ordinary portland cement the setting characteristics were drastically altered especially at high MgSiF66H2O contents. Evidence was also obtained by the formation of a KSiF6 which was very fine particle. The results wee as follows. 1. Slump was slightly decreased when MgSiF66H2O added. 2. Setting time was retarded depending on the amount of retarding agent 2 to 8 hours 3. Compressive strength was almost same or some increased in comparision with opc. 4. When MgSiF66H2O was added to cement paste K2SiF6 were formed It was fine-sized distributed uniformly in cement grain and caused retardation of cement setting.

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Study on Improvement of Etch Rate and SiO2 Regrowth in High Selectivity Phosphoric Acid Process (고선택비 인산공정에서의 식각율 향상과 SiO2 재성장에 관한 연구)

  • Lee, Seunghoon;Mo, Sungwon;Lee, Yangho;Bae, JeongHyun
    • Korean Journal of Materials Research
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    • v.28 no.12
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    • pp.709-713
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    • 2018
  • To improve the etch rate of $Si_3N_4$ thin film, $H_2SiF_6$ is added to increase etching rate by more than two times. $SiO_3H_2$ is gradually added to obtain a selectivity of 170: 1 at 600 ppm. Moreover, when $SiO_3H_2$ is added, the etching rate of the $SiO_2$ thin film increases in proportion to the radius of the wafer. In $Si_3N_4$ thin film, there is no difference in the etching rate according to the position. However, in the $SiO_2$ thin film, the etching rate increases in proportion to the radius. At the center of the wafer, the re-growth phenomenon is confirmed at a specific concentration or above. The difference in etch rates of $SiO_2$ thin films and the reason for regrowth at these positions are interpreted as the result of the flow rate of the chemical solution replaced with fresh solution.

Synthesis of Single Crystalline Analcime and Its Single-crystal Structure, |Na0.94(H2O)|[Si2.06Al0.94O6]-ANA: Determination of Cation Sites, Water Positions, and Si/Al Ratios (결정성 아날심(|Na0.94(H2O)|[Si2.06Al0.94O6]-ANA)의 합성 및 단결정구조: 양이온 및 물 분자의 위치, Si/Al 비의 결정)

  • Seo, Sung-Man;Suh, Jeong-Min;Ko, Seong-Oon;Lim, Woo-Taik
    • Journal of the Korean Chemical Society
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    • v.55 no.4
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    • pp.570-574
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    • 2011
  • Large colorless single crystals of analcime with diameters up to 0.20 mm have been synthesized from gels with the composition of $3.00SiO_2$ : $1.50NaAlO_2$ : 8.02NaOH : $454H_2O$ : 5.00TEA. The fully $Na^+$-exchanged analcime have been prepared with aqueous 0.1 M NaCl (pH adjusted from 6 to 11 by dropwise addition of NaOH). The single-crystal structure of hydrated $|Na_{0.94}(H_2O)|[Si_{2.06}Al_{0.94}O_6]$-ANA per unit cell, a=13.703(3) ${\AA}$, has been determined by single-crystal X-ray diffraction technique in the orthorhombic space group Ibca at 294 K. The structure was refined using all intenties to the final error indices (using only the 1,446 reflections for which $F_o$ > $4{\sigma}(F_o))R_1/wR_2$ = 0.054/0.143. About 15 $Na^+$ ions are located at three nonequivalent positions and octahedrally coordinated. The chemical composition is $Na_{0.94}(H_2O)Si_{2.06}Al_{0.94}O_6$. The Si/Al ratio of synthetic analcime is 2.19 determined by the occupations of cations, 14.79, in the single-crystal determination work.

The crystallinity of silicon films deposited at low temperatures with Remote Plasma Enhanced Chemical Vapor Deposition(RPECVD) (원거리 플라즈마 화학증착을 이용한 규소 박막의 결정성)

  • 김동환;이일정;이시우
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.1-6
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    • 1995
  • Polycrystalline Si films have been used in many applications such as thin film transistors(TFT), image sensors and LSI applications. In this research deposition of Si films at low temperatures with remote plasma enhanced CVD from Si2H6-SiF4-H2 on SiO2 was studied and their crystallinity was investigated. It was condluded that growth of crystalline Si films was favorable with (1) low Si2H6 flow rates, (2) moderate plasma power, (3) moderate SiF4 flow rates, (4) moderate substrate temperature, and (5) suitable method of surface cleaning.

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The Effects of Hydration Retarding of Portland Cement by $MgSiF_6.6H_2O$ (규불화마그네슘에 의한 포틀랜드 시멘트의 수화 지연효과)

  • 한상호;이경희;정성철;김남호
    • Journal of the Korean Ceramic Society
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    • v.34 no.2
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    • pp.163-170
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    • 1997
  • The retarding effects of MgSiF6.6H2O on the hydration of portland cement were studied. The setting time, flow value and compressive strength of mortar were measured and the mechanism of retardation was also studied by ion concentration in solution, SEM, BET, and X-ray diffraction. The results are as follows ; 1. Setting time was delayed by the addition of MgSiF6.6H2O. 2. The flow value of mortar decreases depending upon the amount of MgSiF6.6H2O. 3. The compressive strength was almost same or some increase on 28 days hydration. 4. The main retardation mechanism of MgSiF6 on the hydration of portland cement may be explained by the following hypothesis. MgSiF6 depressing the Ca++ and K+ ion concentration of cement paste solution be-cause of the recrystalization of K2SiF6 and CaF2 phase. The new products of K2SiF6 and CaF2 deposit on the surface of unhydrated cement powder and harzard the mass transfer through these layer. The low con-centration of Ca++, K+ ion in solution was decreasing the hydration rate of portland cement.

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Preparation of Silicon Oxide Thin Film using Hydrofluorosilicic Acid (규불화수소산을 이용한 실리콘 산화물 필름 제조에 관한 연구)

  • Park, Eun-Hui;Jeong, Heung-Ho;Im, Heon-Seong;Hong, Seong-Su;No, Jae-Seong
    • Korean Journal of Materials Research
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    • v.9 no.4
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    • pp.414-418
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    • 1999
  • Typical metal oxide thin films having optical and electrical properties are widely used as inorganic functional materials. Liquid phase deposition(LPD) method, a new low temperature process, has been developed for the several advantages of no vacuum system, low cost, high throughput, and low processing temperature(<$50^{\circ}C$). Silica powder was added to 40wt% hydrofluoro-silicic acid($H_2$SiF\ulcorner) to obtain an immersing solution of silica-saturated hydrofluorosilicic acid solution. Boric acid solution was continuously added in the range from 0 to 0.05M to prepare supersaturated hydrofluorosilicic acid solution. LPD $SiL_2$film was formed with the variation of added amount of $H_2$O. The SiO$_2$thin film could be prepared from hydrofluorosilicic acid by LPD method. The thickness of LPD $_SiO2$film was influenced by the boric acid concentration and added amount of $H_2$O. Silicon in thin film existed as SiF\ulcorner by Raman spectrum.

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Preparation of Mesoporous Molecular Sieve by the Reaction of Na2SiO3 and H2SiF6 in the Presence of an Aqueous Nonionic Surfactant Solution (비이온성 계면활성제 수용액에서 Na2SiO3와 H2SiF6의 반응을 통한 메조포러스 실리카의 제조)

  • Kim, Jin-Yeong;Kwon, Oh-Yun
    • Applied Chemistry for Engineering
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    • v.29 no.1
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    • pp.122-126
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    • 2018
  • Mesoporous molecular sieves were prepared by the reaction of $Na_2SiO_3$ and $H_2SiF_6$ using nonionic micelle templates in an aqueous solution. Well-crystalline mesoporous molecular sieves were obtained after several seconds at atmospheric conditions. Powder samples exhibited d-spacing of 3.8-5.1 nm with the sharpness of the d00l peak, showing well-crystalline mesoporous molecular sieves, pore size distributions of 2.5-3.1 nm and large specific surface areas of $290-1,018m^2/g$, depending on types of surfactants. SEM images of samples showed well-divided spherical particles with an uniform size of ${\sim}0.5{\mu}m$ and TEM images demonstrated uniform pores with a worm hole shape.

Reactive Ion Etching of a-Si for high yield and low process cost

  • Hur, Chang-Wu
    • Journal of information and communication convergence engineering
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    • v.5 no.3
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    • pp.215-218
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    • 2007
  • In this paper, amorphous semiconductor and insulator thin film are etched using reactive ion etcher. At that time, we experiment in various RIE conditions (chamber pressure, gas flow rate, rf power, temperature) that have effects on quality of thin film. The using gases are $CF_4,\;CF_4+O_2,\;CCl_2F_2,\;CHF_3$ gases. The etching of a-Si:H thin film use $CF_4,\;CF_4+O_2$ gases and the etching of $a-SiO_2,\;a-SiN_x$ thin film use $CCl_2F_2,\;CHF_3$ gases. The $CCl_2F_2$ gas is particularly excellent because the selectivity of between a-Si:H thin film and $a-SiN_x$ thin film is 6:1. We made precise condition on dry etching with uniformity of 5%. If this dry etching condition is used, that process can acquire high yield and can cut down process cost.

Fabrication and Characteristics of PIN Type Amorphous Silicon Solar Cell (PIN形 非晶質 硅素 太陽電池의 製作 및 特性)

  • Park, Chang-Bae;Oh, Sang-Kwang;Ma, Dae-Yeong;Kim, Ki-Wan
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.6
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    • pp.30-37
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    • 1989
  • The PIN type a-SiC:H/a-Si:H heterojunction solar cells were fabricated by using the rf glow discharge decomposition of $SiH_4$ mixed with $CH_4,B_2,H_6\;and\;PH_3.$ The efficiency of the solar cell of the $SnO_2/ITO$ was higher than that of ITO transparent oxide layer by 1.5%. The P layer was prepared with the thickness of $100{\AA}$ and $CH_4/SiH_4$ ration of 5. The I layer has been deposited on the P layer and it is not pure intrinsic but near N type. So $SiH_4$ mixed with $B_2H_6$ of 0.3ppm was used to change this N type nature to intrinsic having the thickness of 5000${\AA}$. And consecutively, the N layer was deposited with t ethickness of $400{\AA}$ using $SiH_4/PH_3$ mixtures. The solar cell demonstrated 0.94V of $V_{oc'}$ 14.6mA/cm of $J_{sc}$ and 58.2% of FF, resulting the efficiency of 8.0%. To minimize loss by the reflection of light, $MgF_2$ layer was coated on the lgass and the efficiency was improved by 0.5%. Therefore, the solar cell indicated overall efficiency of 8.5%.

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The Characteristics of Residual Films on Silicon Surface $CHF_3/C_2F_6$ Reactive Ion Etching ($CHF_3/C_2F_6$ 플라즈마에 의한 실리콘 표면 잔류막의 특성)

  • 권광호;박형호;이수민;강성준;권오준;김보우;성영권
    • Journal of the Korean Vacuum Society
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    • v.1 no.1
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    • pp.145-152
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    • 1992
  • Si surfaces exposed to CHF3/C2F6 gas plasmas ih reactive ion etching (RIE) have been characterized by X-ray photoelectron spectroscopy (XPS). CHF3/C2F6 gas plasma exposure of Si surface leads to the deposition of residual film containing carbon and fluorine. The narrow scan spectra of C 1s show various bonding states of carbon as C-Si, C-F/H, C-CFx(x $\leq$ 3), C-F, C-F2, and C-F3. The chemical bonding states of fluorine are described with F-Si, F-C and F-O. And the oxygen and silicon are also detected. The effects of parameters for reactive ion etching as CHF3/C2F6 gas ratio, RF power, and pressure are investigated.

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