• Journal of the Korean Wood Science and Technology
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• 제33권2호통권130호
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• pp.29-39
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• 2005

Formaldehyde emissions from wood-based panels bonded with pine and wattle tannin-based adhesives, urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), and co-polycondensed resin of urea-melamine-formaldehyde (UMF) were measured by the Japanese standard method using a desiccator (JIS A 1460) and the EN 120 (European Committee For Standardization, 1991) method using the perforator value. In formaldehyde emission, all particleboards made using the wattle tannin-based adhesive with three different hardeners, paraformaldehyde, hexamethylenetetramine, and tris(hydroxyl)nitromethan (TN), satisfied the requirements of grade $E_1$. But only those made using the pine tannin-based adhesive with the hexamine as hardener met the grade $E_1$ requirements. Hexamine was effective in reducing formaldehyde emission in tannin-based adhesives when used as the hardener. While the UF resin showed a desiccator value of $7.1mg/{\ell}$ and a perforator value of 12.1 mg/100 g, the MF resin exhibited a desiccator value of $0.6mg/{\ell}$ and a perforator value of 2.9 mg/100 g. According to the Japanese Industrial Standard and the European Standard, the formaldehyde emission level of the MDF panels made with UF resin in this study came under grade $E_2$. The formaldehyde emission level was dramatically reduced by the addition of MF resin. The desiccator and perforator methods produced proportionally equivalent results. Gas chromatography, a more sensitive and advanced method, was also used. The samples for gas chromatography were gathered during the experiment involving the perforator method. The formaldehyde contents measured by gas chromatography were directly proportional to the perforator values.

• Journal of the Korean Wood Science and Technology
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• 제35권5호
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• pp.24-37
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• 2007

The Korean Ministry of Environment started controlling indoor air quality (IAQ) in 2004 through the introduction of a law regulating the use of pollutant emitting building materials. The use of materials with formaldehyde emission levels above $1.25 mg/m^2{\cdot}h$ (JIS A 1901, small chamber method) has been prohibited. This level is equivalent to the $E_2$ grade ($>5.0mg/{\ell}$) of the desiccator method (JIS A 1460). However, the $20{\ell}$ small chamber method requires a 7-day test time to obtain the formaldehyde and volatile organic compound (VOC) emission results from solid building interior materials. As a approach to significantly reduce the test time, the field and laboratory emission cell (FLEC) has been proposed in Europe with a total test time less than one hour. This paper assesses the reproducibility of testing formaldehyde and TVOC emissions from wood-based composites such as medium density fiberboard (MDF), laminate flooring, and engineered flooring using three methods: desiccator, perforator and FLEC. According to the desiccator and perforator standards, the formaldehyde emission level of each flooring was ${\le}E_1$ grade. The formaldehyde emission of MDF was $3.48 mg/{\ell}$ by the desiccator method and 8.57 g/100 g by the perforator method. To determine the formaldehyde emission, the peak areas of each wood-based composite were calculated from aldehyde chromatograms obtained using the FLEC method. Formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde and benzaldehyde were detected as aldehyde compounds. The experimental results indicated that MDF emitted chloroform, benzene, trichloroethylene, toluene, ethylbenzene, m,p-xy-lene, styrene, and o-xylene. MDF emitted significantly greater amounts of VOCs than the floorings did.

• Journal of the Korean Wood Science and Technology
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• 제40권2호
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• pp.91-100
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• 2012

This study analysis the effect of various temperatures (20, 35 and $50^{\circ}C$) on the formaldehyde emission from wood composites, which were particleboard (PB), medium density fiberboard (MDF), high density fiberboard (HDF) and laminated HDF (L-HDF) by Japanese desiccator method. Also, to reduce formaldehyde emission by wood composites, it has been suggested that undergo a bake-out conditions. On average, the level of formaldehyde emission increased many times with a $15^{\circ}C$ increase in temperature from 20 to $35^{\circ}C$ for PB, MDF, HDF and L-HDF, respectively. Formaldehyde emissions from wood composites could be expected to increase with increasing ambient temperature. At $35$ for 28 days bake-out treatment of boards, the free formaldehyde emission reduced 67.8% (PB), 40.1% (MDF), 37.8% (HDF), and 35.2% (L-HDF). On the other hand, after the bake-out at $50^{\circ}C$ for 28 days, the formaldehyde concentration decreased by 88.2, 66.9, 62.2 and 59.3% of the concentration before the bake-out for PB, MDF, HDF and L-HDF, respectively. An interesting of the bake-out treatment at $50^{\circ}C$ after 14 days, formaldehyde emission grade of PB & MDF down $E_2$ to $E_1$, and HDF & L-HDF down $E_1$ to $E_0$.

• Journal of the Korean Wood Science and Technology
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• 제32권1호
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• pp.80-87
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• 2004

천연접착제인 분말상 탄닌수지를 사용한 파티클보드의 물리·기계적 성질의 개선을 위하여 분말상 탄닌수지와 액상 탄닌수지를 혼합하여 사용한 결과, 30:70 (분말 : 액상)의 혼합비가 최적조건이었으며 분말상 탄닌 수지의 비율이 높으면 물성이 저하되는 현상을 볼 수 있었으며 또한 포름알데히드 방산량이 E₀ 수준의 고내수성 제품을 제조할 수 있었다. 한편 요소수지 및 멜라민수지와 분말상 탄닌 수지와의 혼합방법은 물리·기계적 성질의 개선에 영향을 주지 못했으며, 유리포름알데히드 방산에 대한 scavenger의 역할만을 하였다.

• Journal of the Korean Wood Science and Technology
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• 제48권2호
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• pp.136-153
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• 2020

In this paper, the influence of initial formaldehyde/urea (F/U) molar ratios on the performance of low molar ratio (1.0) urea-formaldehyde (UF) resin adhesives has been investigated. Two initial F/U molar ratios, i.e., the first and second initial molar ratios were used for the alkaline addition reaction. Three levels of the first initial F/U molar ratios (2.0, 3.0, and 4.0) and two levels of the second initial molar ratios (2.0 and 1.7) were employed to prepare a total of six UF resins with an identical final molar ratio (1.0). The basis properties, functional groups, molecular weight, crystallinity, and thermal curing properties of the UF resins were characterized in detail. Higher levels (3.0 and 4.0) of the first initial F/U molar ratio provided the UF resins with better properties (non-volatile solids content, viscosity, gelation time, pH, and specific gravity) than those of the resins prepared with the conventional level F/U molar ratio of 2.0. Statistical analysis suggested that combining the first and second initial molar ratio of 4.0 with 1.7 would result in UF resins with greater adhesion strength and lower formaldehyde emission than those of the resins prepared with other molar ratios. The results showed that higher levels of the first initial molar ratio resulted in a more branched structure, as indicated by GPC, FTIR, DSC, XRD, and greater adhesion strength than those of the other UF resins with an identical final molar ratio of 1.0.

• Journal of the Korean Wood Science and Technology
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• 제37권4호
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• pp.388-396
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• 2009

본 연구에서는 두부비지 가수분해물과 페놀수지로 조제된 마루판 화장용 접착제의 접착성능을 확인하기 위하여 수행하였다. 먼저 두부비지를 황산과 수산화나트륨으로 화학적으로 개량한 후 가교제로 phenol formaldehyde (PF) prepolymer와 혼합하여 접착제를 조제하였는데, 이 접착제는 고형분 함량을 기준으로 35%의 황산 가수분해물(AC), 35%의 수산화나트륨 가수분해물(AK) 그리고 30%의 PF로 조제하였다. 이렇게 조제된 접착제를 고밀도섬유판에 $300g/m^2$의 비율로 도포한 후 참나무 무늬목을 접착시켜 $7kg/m^2$의 압력으로 $120^{\circ}C$에서 열압하여 마루판을 제조하였다. 제조된 마루판에 대하여 formaldehyde/phenol 몰비(1.8, 2.1, 2.4), 퇴적시간(0분, 10분, 20분), 열압시간(90초, 120초)이 평면인장강도, 준내수 박리율, 포름알데히드 방산량에 미치는 영향에 대해 조사하였다. 두부비지 접착제를 이용하여 제조된 목질마루판의 평면인장강도는 KS 규격의 최소값을 상회하였으며, 대부분의 포름알데히드 방산량 값은 KS 규격의 E0 기준에 근접하는 것으로 나타났다. 따라서 두부비지 접착제가 마루판 화장용 접착제로 사용될 수 있다는 가능성을 보여 주었으나, 상용화를 위하여 내수성의 향상과 포름알데히드 방산량의 저감을 위한 연구가 필요할 것으로 생각한다.

• Journal of the Korean Wood Science and Technology
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• 제30권1호
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• pp.11-17
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• 2002

본 연구는 요소수지(고형분함량 60%)를 사용, 분죽 3개월생 국산 대나무를 이용하여 대나무 파티클 3층 보드를 제조하고 3년생과 그 보드의 물리 기계적 성질을 비교 검토하였다. 분죽의 수령이 파티클 보드의 비중과 기건 함수율에 미치는 차이는 없었고, 제품의 두께 팽윤율은 함지율 11%부터 KS기준을 만족시켰으며 3개월생 보드가 3년생 보드보다 높은 수치를 나타냈다. 3개월생 파티클 보드의 휨강도가 함지율 3수준(9%, 11%, 13%)에서 모두 3년생보다 훨씬 높게 나타났고, 박기강도도 3개월생 보드가 3년생 보드보다 월등히 높았다. 3개월생, 3년생 보드 모두 KS기준강도보다 월등하였다. 보드의 포름알데히드 방산량값은 모두 E2 등급을 만족시켰다.