• Journal of Korean Society of Environmental Engineers
• /
• v.29 no.8
• /
• pp.930-937
• /
• 2007

Korean pine(Pinus densiflora) bark was evaluated for its adsorption capacity of Cu(II) ions from aqueous solution by running a series of batch experiments. Prior to the tests, the milled barks were treated with 1 N NaOH or 1 N HCl to examine the effect of surface modification. For comparison, untreated bark was tested under same condition. Within the tested pH range between 3 and 6, NaOH treatment increased Cu(II) adsorption capacity by $139\sim184%$, while HCl treatment decreased it by $37\sim42%$. Maximum copper ion uptake by bark was observed at pH $5\sim6$, but pH of solution was not a potent influence. A pseudo second-order kinetic model fitted well for the sorption of copper ion onto bark. For NaOH-treated bark, the calculated sorption capacity$(q_e)$ increased from 6.58 to 12.77 mg/g, while the equilibrium rate constant$(k_2)$ decreased from 0.284 to 0.014 g/mg/min as initial Cu(II) concentration doubled from 100 mg/L. A batch isotherm test using NaOH-treated bark showed that equilibrium sorption data were represented by both the Langmuir model and the Freundlich model. It was confirmed that carboxylic acid of bark was involved in the Cu(II) adsorption. For NaOH-treated bark, in particular, carboxylate ion produced by hydrolysis or saponification appeared to be a major functional roup responsible for the enhanced Cu(II) sorption.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.1114-1115
• /
• 2006

The preparation of single-phase $CuLaO_2$ with delafossite-type structure by means of the solid-state reaction method was investigated using X-ray diffraction. The results showed that notwhistanding the fact that there was a trace of metallic copper, nearly single-phase $CuLaO_2$ was obtained by using $La(OH)_3$ as a lanthanum source and by firing the mixed powder with nonstoichiometric composition ratio of $La(OH)_3:Cu_2O=1:1.425$ in a vacuum at 1273 K for 10 h. The measurement of electrical conductivity and Seebeck coefficient showed that $CuLaO_2$ thus obtained was a p-type semiconductor and had a Seebeck coefficient of approximately $70{\mu}V/K$.

• Journal of Korean Society of Water and Wastewater
• /
• v.37 no.4
• /
• pp.177-186
• /
• 2023

Perfluorooctanoic acid(PFOA) was one of widely used per- and poly substances(PFAS) in the industrial field and its concentration in the surface and groundwater was found with relatively high concentration compared to other PFAS. Since various processes have been introduced to remove the PFOA, adsorption using GAC is well known as a useful and effective process in water and wastewater treatment. Surface modification for GAC was carried out using Cu and Fe to enhance the adsorption capacity and four different adsorbents, such as GAC-Cu, GAC-Fe, GAC-Cu(OH)₂, GAC-Fe(OH)₃ were prepared and compared with GAC. According to SEM-EDS, the increase of Cu or Fe was confirmed after surface modification and higher weight was observed for Cu and Fe hydroxide(GAC-Cu(OH)₂ and GAC-Fe(OH)₃, respectively). BET analysis showed that the surface modification reduced specific surface area and total pore volumes. The highest removal efficiency(71.4%) was obtained in GAC-Cu which is improved by 17.9% whereas the use of Fe showed lower removal efficiency compared to GAC. PFOA removal was decreased with increase of solution pH indicating electrostatic interaction governs at low pH and its effect was decreased when the point of zero charges(pzc) was negatively increased with an increase of pH. The enhanced removal of PFOA was clearly observed in solution pH 7, confirming the Cu in the surface of GAC plays a role on the PFOA adsorption. The maximum uptake was calculated as 257 and 345 ㎍/g for GAC and GAC-Cu using Langmuir isotherm. 40% and 80% of removal were accomplished within 1 h and 48 h. According to R², only the linear pseudo-second-order(pso) kinetic model showed 0.98 whereas the others obtained less than 0.870.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.1
• /
• pp.63-67
• /
• 2024

In this study, we successfully synthesized copper oxide (Cu₂O) particles through a hydrothermal method at a relatively low temperature (150℃). The synthesis involved the precise control of molar concentrations of NaOH. Notably, Cu₂O particles were effectively synthesized when NaOH concentrations of 0.15 M and 0.20 M were utilized. While attempts were made at different molar concentrations, the synthesis of pure Cu₂O particles was only achieved at concentrations of 0.15 M and 0.20 M. In this experimental investigation, Cu₂O synthesized under these specific conditions exhibited absorption characteristics within the wavelength range of 640 to 570 nm, consistently exhibiting a band gap energy of 1.9 eV. These Cu₂O particles, characterized by their small band gap energy and straightforward synthetic method, hold significant promise for various applications including semiconductors and solar cells.

• Applied Chemistry for Engineering
• /
• v.25 no.3
• /
• pp.312-317
• /
• 2014

Catalytic combustion of benzene over CuO-$CeO_2$ mixed oxides prepared by co-precipitation method were investigated. The CuO-$CeO_2$ mixed oxides were also prepared using different precipitant and CuO precursor. They were characterized by XRD, BET, XPS and $H_2-TPR$. In the CuO-$CeO_2$ catalysts, characteristic copper oxide peaks were shown at $2{\Theta}=35.5^{\circ}$ and $38.5^{\circ}$ regardless of the precipitant. The Cu0.35 catalyst prepared using $NH_4OH$ as a precipitant revealed the highest activity on the combustion of benzene. In addition, the pretreatment with hydrogen enhanced the catalytic activity and the catalyst reduced at $400^{\circ}C$ showed the highest activity on the combustion of benzene.

• Journal of the Korean Vacuum Society
• /
• v.21 no.1
• /
• pp.6-11
• /
• 2012

In order to understand a process of contaminants removal on surface of Cu seed layer (Cu seed/Ti/Si) by sputter deposition, we investigated the changed morphology and states of Cu seed surface after pretreatment in alkali degreasing Metex TS-40A solution according to dipping time. After TS-40A pretreatment, the surface morphology with clearer grains was observed by Field emission scanning electron microscope and the changed surface chemical states and impurities on surface of samples were checked by X-ray photoelectron spectroscopy. Dipping time in TS-40A solution had very little effect on surface of Cu seed layer. After pretreatment, much carbons and little oxygens on surface of Cu seed were eliminated and the decrease of peaks corresponded to O=C and $Cu(OH)_2$ was estimated. However, Si content (=silicate) was detected on sample surface. We think that the silicate impurity forms on Cu seed by chemical reaction of TS-40A solution included silicate component. By pretreatment of alkali degreasing Metex TS-40A solution, it showed an excellent effect in removal of O=C and $Cu(OH)_2$ on Cu seed layer, but the silicate was formed on surface of Cu seed. Therefore, another cleaning process such as acid cleaning is required for removal of this silicate in use of this alkali degreasing.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.1329-1330
• /
• 2006

The effect of Cu on the hydrogen reduction of $MoO_3$ powders was investigated by measuring the humidity change during a non-isothermal process of hydrogen reduction. The presence of Cu induced a shift in the reduction temperature and strongly affected the reduction processes of $MoO_3\rightarrowMo_4O_{11}\rightarrowMoO_2$, which comprised the contained chemical vapor transport of $MoO_x(OH)_2$. This study suggests that the surface of the Cu grains acts as a nucleation site for the reduction of $MoO_x(OH)_2$ to $MoO_2$ particles from $MoO_3$ or $Mo_4O_{11}$. Such an activated reduction process results in the deposition of Mo and $MoO_2$ particles on the surface of the Cu.

• 한국전기화학회:학술대회논문집
• /
• 2003.10a
• /
• pp.37-37
• /
• 2003

• Korean Journal of Materials Research
• /
• v.6 no.2
• /
• pp.158-165
• /
• 1996

열증착기(thermal evaporator)로 증착시킨 Cu를 상온에서 3.5M CuCl2+0.5M HCI+0.5MKCI 용액을 사용하여 습식각하고 2일간 대기중 노출시킨 후 X-선 광전자 분광기를 이용하여 표면의 결합상태를 관찰하였다. 그 결과 습식식각된 Cu 표면에서는 C, O, Ci 및 Cu가 존재함을 알 수 있었다. 표면원소에 대한 오제이 전자 스펙트라(Auger electron spectra)와 광전자 스펙트라(photoelectron spectra)의 정량적인 비교를 통하여 표면의 모든 결합상태를 확인할 수 있었고 그 상대적인 양까지도 얻어낼 수 있었다. 식각된 Cu의 표면에는 Cu-Cu, 2Cu-O, Cu-Ci, Cu-2(OH), 및 Cu-2Cl의 결합상태가 존재함을 알 수 있었고, CuLMMAuger line spectrum의 관찰을 통하여 계산된 각 결합의 정량적인 비교를 검증할 수 있었다. 따라서 chemical shift가 거의 관찰되지 않아 결합상태 분리가 불가능한 식각된 구리표면의 정량적 결합상태는 각 결합상태의 상대적 비교를 통하여 얻어질 수 있음을 알 수 있었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.75-81
• /
• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.