• 한국세라믹학회지
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• 제36권2호
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• pp.145-150
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• 1999

고체산화물 연료전지의 양극재료로서 Gd1-xSrxMnO3을 구연산법으로 합성하였으며, 이의 결정구조, 전기전도도 및 열팽창률을 조사하였다. 또한 합성한 Gd1-xSrxMnO3을 8mol% yttria stabilized zirconia(8YSZ) 혹은 Ce0.8Gd0.2O1.9(CGO) 전해질과의 반응성을 조사하였다. Gd1-xSrxMnO3의 결정구조는 Sr함량이 증가함에 따라 orthorhombic (0$\leq$X$\leq$0.3)에서 cubic(0.4$\leq$X$\leq$0.5)을 거쳐 tetragonal (X=0.6)로 변하였다. Sr 함량이 증가함에 따라 Gd1-xSrxMnO3의 전기전도도는 증가하였다. 열팽창률은 Sr 함량이 30mol% 이상인 경우 함량이 증가함에 따라 증가하는 경향을 보이는 8YSZ, CGO와 비슷한 거동을 보였다. 8YSZ 및 CGO와의 반응성을 보기 위하여 Gd1-xSrxMnO3과 이들을 각각 혼합하여 130$0^{\circ}C$에서 48시간 동안 열처리했을 경우 8YSZ와는 SrZrO3의 반응물을 형성하였으나 CGO와는 반응을 하지 않았다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.16-16
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• 2012

Mg and its alloys have been of great interest because of their low density of 1.7, 30% lighter than Al, but their wide applications have been limited because of their poor resistances against corrosion and/or abrasion. Corrosion resistance of Mg alloys can be improved by formation of anodic films using anodic oxidation method in aqueous electrolytes. Plasma electrolytic oxidation (PEO) is one of anodic oxidation methods by which hard anodic films can be formed as a result of micro-arc generation under high electric field. PEO method utilize not only substrate elements but also chemical components in electrolytes to form anodic films on Mg alloys. PEO films formed on AM50 magnesium alloy in an acidic fluozirconate electrolyte were observed to consist of mainly $ZrO_2$ and $MgF_2$. Liu et al reported that PEO coating on AM30 Mg alloy consists of $MgF_2$-rich outer porous layer and an MgO-rich dense inner layer. PEO films prepared on ACM522 Mg die-casting alloy in an aqueous phosphate solution were also reported to be composed of monoclinic $Mg_3(PO_4)_2$. $CeO_2$-incorporated PEO coatings were also reported to be formed on AZ31 Mg alloys in $CeO_2$ particle-containing $Na_2SiO_3$-based electrolytes. Magnesium tin hydroxide ($MgSn(OH)_6$) was also produced on AZ91D alloy by PEO process in stannate-containing electrolyte. Effects of $OH^-$, $F^-$, $PO{_4}^{3-}$ and $SiO{_3}^{2-}$ ions and alloying elements of Al and Sn on the formation of PEO films on pure Mg and Mg alloys and their protective properties against corrosion have been investigated in this work. $PO{_4}^{3-}$, $F^-$ and $SiO{_3}^{2-}$ ions were observed to contribute to the formation of PEO films but $OH^-$ ions were found to break down the surface films under high electric field. The effect of pulse current on the formation of PEO films will be also reported.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.109-109
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• 2000

AC형 PDP에서 보호막은 방전시 내구성(내 sputter)이 약한 유전체를 보호함으로써 panel이 장시간동안 안정된 동작을 하게 하며, 방전시 2차 전자를 많이 방출함으로써 방전전압을 낮추는 기능을 갖는다. 또한 패널의 전압특성을 결정하고 수명을 크게 좌우하며 방전전극을 플라즈마 발광에 의한 이온 스퍼터로부터 보호하고 벽전하에 의한 메모리 기능을 가지도록 하는 역할도 하는 것으로 알려져 있다. 일반적으로 보호막의 재료로는 MgO, ZrO, CeO2등이 있으며 특히 MgO는 보호막으로 널리 쓰이고 있다. 일반적으로 MgO의 증착방법의 전자빔 증착, 스퍼터링, 이온 플레이팅법이 있으며 많은 연구자들이 이러한 증착방법에 성장된 박막들을 연구하고 있다. 그러나 Cs을 이용한 MgO의 증착방법은 그리 널리 알려져 있지는 않다. 따라서 본 연구에서는 Ar/O2/Cs을 이용하여 MgO박막을 sputtering 방법으로 증착하였으며 이들의 특성에 관하여 연구하였다. Target으로는 Mg을 사용하였으며 DC sputtering법으로 MgO를 증착하였다. 기판으로는 실리콘과 유리를 이용하였으며 가스로는 Ar과 O2를 이용하고 Cs의 첨가 유무에 따라 증착하였다. 또한 입력 전력, 공정압력, 그리고 O2 가스량에 따라 박막을 증착하였으며 이에 따른 증착속도, 결정성, 조성비를 $\alpha$-step, XRD, 그리고 XPS를 이용하여 측정하였다. CS 참가할 경우 Ar/O2 가스만을 이용하여 증착했을 때보다 증착속도는 증가하였으며 XRD 분석시 (111), (200) 방향으로 우선 성장하는 것을 관찰할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.601-602
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.605-606
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2233-2234
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2235-2236
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2237-2238
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.378-379
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1267-1268
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2,CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.