• 제목/요약/키워드: $C_2S/C_3S$ layer

검색결과 1,017건 처리시간 0.037초

Plasma nitriding on chromium electrodeposit

  • Wang Liang;K.S. Nam;Kim, D.;Kim, M.;S.C. Kwon
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2001년도 추계학술발표회 초록집
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    • pp.29-30
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    • 2001
  • This paper presents some results of plasma nitriding on hard chromium deposit. The substrates were C45 steel and $30~50{\;}\mu\textrm{m}$ of chromium deposit by electroplating was formed. Plasma nitriding was carried out in a plasma nitriding system with $95NH_3{\;}+{\;}SCH_4$ atmosphere at the pressure about 600 Pa and different temperature from $450^{\circ}C{\;}to{\;}720^{\circ}C$ for various time. Optical microscopy and X-ray diffraction were used to evaluate the characteristics of surface nitride layer formed by nitrogen diffusion from plasma atmosphere inward iCr coating and interface carbide layer formed by carbon diffusion from substrate outward Cr coating. The microhardness was measured using microhareness tester at the load of 100 gf. Corrosion resistance was evaluated using the potentiodynamic measurement in 3.5% NaG solution. A saturated calomel electrode (SiCE) was used as the reference electrode. Fig.1 shows the typical microstructures of top surface and cross-section for nitrided and unnitrided samples. Aaer plasma nitriding a sandwich structure was formed consisting of surface nitride layer, center chromium layer and interface carbide layer. The thickness of nitride and carbide layers was increased with the increase of processing temperature and time. Hardness reached about 1000Hv after nitriding while 900Hv for unnitrided hard chromium deposit. X-ray diffraction indicated that surface nitrided layer was a mixture of $Cr_2N$ and CrN at low temperature and erN at high temperature (Fig.2). Anodic polarization curves showed that plasma nitriding can greatly improve the corrosion resistance of chromium e1ectrodeposit. After plasma nitriding, the corrosion potential moved to noble direction and passive current density was lower by 1 to 4 orders of magnitude compared with chromium deposit(Fig.3).

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자동차 엔진부품용 Shaft에 플라즈마 산질화기술 적용 (The Application of Plasma Nitrocarburizing and Plasma Post Oxidation Technology to the Automobile Engine Parts Shafts)

  • 전은갑;박익민;이인섭
    • 한국재료학회지
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    • 제16권11호
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    • pp.681-686
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    • 2006
  • Plasma nitrocarburising and plasma post oxidation were performed to improve the wear and corrosion resistance of S45C and SCM440 steel by a plasma ion nitriding system. Plasma nitrocarburizing was conducted for 3h at $570^{\circ}C$ in the nitrogen, hydrogen and methane atmosphere to produce the ${\varepsilon}-Fe_{2-3}$(N, C) phase. Plasma post oxidation was performed on the nitrocarburized samples with various oxygen/hydrogen ratio at constant temperature of $500^{\circ}C$ for 1 hour. The very thin magnetite ($Fe_3O_4$) layer $1-2{\mu}m$ in thickness on top of the $15{\sim}25{\mu}m$ ${\varepsilon}-Fe_{2-3}$(N, C) compound layer was obtained by plasma post oxidation. A salt spray test and electrochemical testing revealed that in the tested 5% NaCl solution, the corrosion characteristics of the nitrocarburized compound layer could be further improved by the application of the superficial magnetite layer. Throttle valve shafts were treated under optimum plasma processing conditions. Accelerated life time test results, using throttle body assembled with shaft treated by plasma nitrocarburising and post oxidation, showed that plasma nitrocarburizing and plasma post oxidation processes could be a viable technology in the very near future which can replace $Cr^{6+}$ plating.

Pt/Ti/Si 기판위에 형성시킨 PZT박막의 특성 (Characterizations of Sputtered PZT Films on Pt/Ti/Si Substrates.)

  • 황유상;백수현;백상훈;박치선;마재평;최진석;정재경;김영남;조현춘
    • 한국재료학회지
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    • 제4권2호
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    • pp.143-151
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    • 1994
  • $(PbZr_{52},Ti_{48})O_{3}$인 composite ceramic target을 사용하여 R. F. 마그네트론 스퍼터링 방법으로 기판온도 $300^{\circ}C$에서 Pt/Ti/Si 기판위에 PZT 박막을 증착하였다. 페롭스 카이트 PZT박막을 얻기 위하여 PbO분위기에서 로열처리를 행하였다. 하부전극으로 Pt를 사용하였으며 Pt(205$\AA$)/Ti(500 $\AA$)/Si 및 Pt(1000$\AA$)/Ti(500$\AA$)/Si기판을 준비하여 Pt두께화 Ti층이 산소의sink로 작용함으로서 이를 가속화하였다. Ti층의 상부는 산소의 확산으로 인하여 TiOx층으로 변태하였고 하부는 in diffused Pt와 함께 실리사이드층을 형성하였다. TiOx 층의 형성은PZT층의 방향성에 영향을 주었다. 유전상수 (10kHz), 누설전류, 파괴전압, 잔류분극 및 항전계는 각각 571, 32,65$\mu A /\textrm{cm}^2$, 0.40MV/cm, 3.3$\mu C /\textrm{cm}^2$, 0.15MV/cm이었다.

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YBCO coated conductor with a single $Y_2$O$_3$ buffer layer on biaxially textured Ni and NiW substrates

  • D. Q. Shi;R. K. Ko;K. J. Song;J. K. Chung;H. S. Ha;Kim, H. S.;Park, C.
    • 한국초전도ㆍ저온공학회논문지
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    • 제6권2호
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    • pp.7-10
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    • 2004
  • A study regarding the epitaxial growth of single $Y_2O_3$ buffer layer on biaxially textured Ni and NiW substrates using pulsed laser deposition is presented. Different deposition conditions were employed and compared in order to obtain good epitaxial $Y_2O_3$ film, furthermore importantly, to obtain good YBCO superconducting films. Following YBCO film deposited by PLD on the top of $Y_2O_3$ films have a good structure and superconducting properties. The J$_{c}$ of YBCO films on $Y_2O_3$ /Ni and $Y_2O_3$ /NiW were $1.0{\times}10^6 A/cm^2 and 1.1\times}10^6 A/cm^2$<.TEX> at 77K and self-field respectively, which indicated that $Y_2O_3$ is a suitable candidate as a single buffer layer for the fabrication of YBCO coated conductor.r.

Characterization of the Galvanizing Behavior Depending on Annealing Dew Point and Chemical Composition in Dual-Phase Steels

  • Shin, K.S.;Park, S.H.;Jeon, S.H.;Bae, D.C.;Choi, Y.M.
    • Corrosion Science and Technology
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    • 제9권6호
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    • pp.247-253
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    • 2010
  • The characteristics of selective oxidation prior to hot-dip galvanizing with the annealing atmosphere dew point and chemical composition in dual-phase steels and their effect on the inhibition layer formation relevant to coating adhesion have been studied using a combination of electron microscopic and surface analytical techniques. The annealed and also galvanized samples of 3 kinds of Si/Mn ratios with varied amounts of Si addition were prepared by galvanizing simulator. The dew point was controlled at soaking temperature $800^{\circ}C$ in 15%$H_2$ -85%$N_2$ atmosphere. It was shown that good adhesion factors were mainly uniformity of oxide particle distribution of low number density and low Si/Mn ratio prior to hot-dip galvanizing. Their effect was the greatly reduced coating bare spots and the formation of uniform inhibition layer leading to good adhesion of Zn overlay. The mechanism of good adhesion is suggested by two processes: the formation of inhibition layer on the oxide free surface uncovered with no $SiO_2$-containing particles in particular, and the inhibition layer bridging of oxide particles. The growth of inhibition layer was enhanced markedly by the delayed reaction of Fe and Al with the increase of Si/Mn ratio.

Cu/In 비에 따른 CuInS2 박막의 특성에 관한 연구 (A Study on Properties of CuInS2 Thin Films by Cu/ln Ratio)

  • 양현훈;박계춘
    • 한국전기전자재료학회논문지
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    • 제20권7호
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    • pp.594-599
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    • 2007
  • [ $CulnS_2$ ] thin films were synthesized by sulfurization of Cu/In Stacked elemental layer deposited onto glass Substrates by vacuum furnace annealing at temperature $200^{\circ}C$. And structural and electrical properties were measured in order to certify optimum conditions for growth of the ternary compound semiconductor $CuInS_2$ thin films with non-stoichiometry composition. $CuInS_2$ thin film was well made at the annealed $200^{\circ}C$ of SLG/Cu/In/S stacked elemental layer which was prepared by thermal evaporator, and chemical composition of the thin film was analyzed nearly as the proportion of 1 : 1 : 2. Physical properties of the thin film were investigated at various fabrication conditions substrate temperature, annealing and temperature, annealing time by XRD, FE-SEM and Hall measurement system. The compositional deviations from the ideal chemical formula for $200^{\circ}C$ material can be conveniently described by non-molecularity$({\Delta}x=[Cu/In]-1)$ and non-stoichiometry $({\Delta}y=[{2S/(Cu+3In)}-1])$. The variation of ${\Delta}x$ would lead to the formation of equal number of donor and accepters and the films would behave like a compensated material. The ${\Delta}y$ parameter is related to the electronic defects and would determine the type of the majority charge carriers. Films with ${\Delta}y>0$ would behave as p-type material while ${\Delta}y<0$ would show n-type conductivity. At the sane time, carrier concentration, hall mobility and resistivity of the thin films was $9.10568{\times}10^{17}cm^{-3},\;312.502cm^2/V{\cdot}s\;and\;2.36{\times}10^{-2}\;{\Omega}{\cdot}cm$, respectively.

율무 지질의 Triglyceride 조성에 관한 연구 (Studies on the Triglyceride Composition of Job's Tears)

  • 이희자;조광연;배정설;장순욱
    • 한국식품조리과학회지
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    • 제6권4호통권13호
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    • pp.27-32
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    • 1990
  • Triglyceride는 구성지방산의 종류에 따라 분자종이 다양하게 존재하여 식품의 가공, 저장중에 있어서 유지의 물성변화 및 산화특성을 효과적으로 규명하기 위해서는 구성 triglyceride 분자종의 상세한 해석이 요구된다고 하겠다. 율무 지질의 triglyceride를 reverse phase HPLC UV detector 210nm에서 분석한 결과 6개의 peak로 분획되었다. 각 획분을 GC로 acycl 탄소수별로 분획하고, 다시 DEGS column을 이용하여 fatty acid 조성을 분석하였다. 이 세가지 결과로부터 triglyceride 조성을 산정한 결과 11개의 TG 조성을 추산하였으며, 그 중 주요 triglyceride로는 C18 : 1 C18 : 2 C18 : 2(OLL)이 38.2%, C16 : 0 C18 : 2 C18 : 3(PLLn)이 15.7%, C18 : 1 C18 : 1 C18 : 2(OOL)이 12.6%였다. 한편 capillary GC와 GC-MS로 같은 시료를 분석하여 분자종을 확인하는 작업을 계속하고 있으며 위의 결과와 비교하여 다음에 보고하고자 한다.

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Cu/In 비에 따른 $CuInS_{2}$ 박막의 특성에 관한 연구 (A Study on Properties of $CuInS_{2}$ thin films by Cu/In ratio)

  • 양현훈;김영준;정운조;박계춘
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2007년도 춘계학술대회
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    • pp.326-329
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    • 2007
  • $CuInS_{2}$ thin films were synthesized by sulpurization of Cu/In Stacked elemental layer deposited onto glass Substrates by vacuum furnace annealing at temperature 200[$^{\circ}C$]. And structural and electrical properties were measured in order to certify optimum conditions for growth of the ternary compound semiconductor $CuInS_{2}$ thin films with non-stoichiometry composition. $CuInS_{2}$ thin film was well made at the heat treatment 200[$^{\circ}C$] of SLG/Cu/ln/S stacked elemental layer which was prepared by thermal evaporator, and chemical composition of the thin film was analyzed nearly as the proportion of 1 : 1 : 2. Physical properties of the thin film were investigated at various fabrication conditions substrate temperature, annealing and temperature, annealing time by XRD, FE-SEM and Hall measurement system. At the same time, carrier concentration, hall mobility and resistivity of the thin films was $9.10568{\times}10^{17}$ [$cm^{-3}$], 312.502 [$cm^{2}/V{\cdot}s$] and $2.36{\times}10^{-2}$ [${\Omega}{\cdot}cm$], respectively.

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플라즈마 화학 증착법에 의한 $Al_2$ $O_3$ 단층피막과 $Al_2$ $O_3$/( $Ti_{0.5}$ $Al_{0.5}$)N 이중피막의 제조 및 특성에 관한 연구 (A Study on the Properties of $Al_2$ $O_3$ and $Al_2$ $O_3$/( $Ti_{0.5}$ $Al_{0.5}$)N Coatings Produced by Plasma Enhanced Chemical Vapor Deposition)

  • 손경석;이승훈;이동각;임주완;이후철;이정중
    • 한국표면공학회지
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    • 제34권2호
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    • pp.105-114
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    • 2001
  • $Al_2$$O_3$ coatings were deposited on M2 high speed steels by the plasma enhanced chemical vapor deposition (PECVD) process, using a gas mixture of AlC1$_3$, $H_2$, $CO_2$ and Ar $Al_2$$O_3$ coatings had interference color and showed amorphous phase. $A1_2$X$A1_3$/($Ti_{0.5}$ /$Al_{0.5}$ )N double layer coatings were produced in the sequence of substrate $NH_3$ plasma pretreatment, ($Ti_{0.5}$$Al_{0.5}$)N depoition process, $Al_2$$O_3$ deposition process. $Al_2$ $O_3$/( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings showed NaCl structure in ( $Ti_{0.5}$A $l_{0.5}$)N layer and amorphous phase in A1$_2$ $O_3$ layer. It was shown that $Al_2$ $O_3$ columns continuously grew onto ( $Ti_{0.5}$A $l_{0.5}$)N columns. ( $Ti_{0.5}$A $l_{0.5}$)N single coating and $Al_2$ $O_3$/( $Ti_{0.5}$A $l_{0.5}$)N double layer coating were oxidized at $700^{\circ}C$, 80$0^{\circ}C$, 90$0^{\circ}C$ for 1hr, 3hr in atmosphere. At 80$0^{\circ}C$, single layer coatings were oxidized, which were examined substrate oxide particle. But $Al_2$ $O_3$/ ( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings maintained the asdeposited state. Therefore, $Al_2$ $O_3$/ ( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings have moreexcellent oxidation resistance than ( $Ti_{0.5}$A $l_{0.5}$)N single layer coatings.X> 0.5/)N single layer coatings.s.

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3C-SiC 버퍼층이 AlN 박막형 SAW 특성에 미치는 영향 (Effect of a 3C-SiC buffer layer on SAW properties of AlN films)

  • 황시홍;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.235-235
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    • 2009
  • This paper describes the influence of a polycrystalline (poly) 3C-SiC buffer layer on the surface acoustic wave (SAW) properties of poly aluminum nitride (AlN) thin films by comparing the center frequency, insertion loss, the electromechanical coupling coefficient ($k^2$), andthetemperaturecoefficientoffrequency(TCF) of an IDT/AlN/3C-SiC structure with those of an IDT/AlN/Si structure, The poly-AlN thin films with an (0002)-preferred orientation were deposited on a silicon (Si) substrate using a pulsed reactive magnetron sputtering system. Results show that the insertion loss (21.92 dB) and TCF (-18 ppm/$^{\circ}C$) of the IDT/AlN/3C-SiC structure were improved by a closely matched coefficient of thermal expansion (CTE) and small lattice mismatch (1 %) between the AlN and 3C-SiC. However, a drawback is that the $k^2(0.79%)$ and SAW velocity(5020m/s) of the AlN/3C-SiC SAW device were reduced by appearing in some non-(0002)AlN planes such as the (10 $\bar{1}$ 2) and (10 $\bar{1}$ 3) AlN planes in the AlN/SiC film. Although disadvantages were shown to exist, the use of the AlN/3C-SiC structure for SAW applications at high temperatures is possible. The characteristics of the AlN thin films were also evaluated using FT-IR spectra, XRD, and AFM images.

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