• Food Science and Preservation
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• v.12 no.6
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• pp.522-528
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• 2005

Effects of packaging and storage temperature on the quality and shelf life of mungbean sprouts(vigna radiata (L.) Wilczek) were studied Mungbean sprouts were packaged in polypropylene films(PP) and oriented polypropylene films(OPP) with 200 g, 250 g, and 300 g and stored at $4^{\circ}C,\;8^{\circ}C$ and $12^{\circ}C$, respectively. The deterioration of quality of mungbean sprouts during storage was caused by wilting of hypocotyl, abscission of cotyledon and softening of tissue. Total weight loss never exceeded $1\%$ and no visible signs of shrivelling of mungbean sprouts were observed. At $4^{\circ}C,\;30{\mu}m$ of OPP film per 250 g mungbean sprouts provided the optimal atmosphere composition(i.e. $3\%\;\O_2\;and\;5\%\;CO_2$). A shelf life of 6 days was achieved with these conditions. Hardness of hypocotyl, when deterioration in freshness began, was about 1,027.2 g when considerably deteriorated Hunter b value was 13 in deteriorated hypocotyl, vs. 11 for hypocotyl of fresh mungbean sprouts was accelerated by fluctuating storage temperature by the increment of storage time. It also was found that the optimum shelf life period was estimated to be 6, 2 and 2 days for 4, 8 and $12^{\circ}C$, respectively.

• Food Science and Preservation
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• v.19 no.3
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• pp.420-427
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• 2012

The objective of this research was to investigate the effect of immersion in Rhus verniciflua Stokes extract (RVSE) on the total reducing ability (TRA), protein oxidation and myoglobin oxidation of beef steak (Hanwoo longissimus muscle) stored with high oxygen-modified-atmosphere packaging (MAP) (HOMAP, 75% $O_2$+20% $CO_2$+5% $N_2$) and low oxygen-MAP (LOMAP, 0% $O_2$+20% $CO_2$+80% $N_2$) at $4^{\circ}C$ for nine days. RVSE induced TRA (p<0.05), metmyoglobin (MetMb) formation, and the CIE $H^{\circ}$ value but reduced the carbonyl content and R630-R580, as an index of the intensity of redness by oxymyoglobin, and the CIE $L^*$,$a^*$, and $C^*$ values. HOMAP maintained a lower TRA, MetMb concentration, and CIE $H^{\circ}$ value but had higher R630-R580 and CIE $L^*$, $a^*$, and $C^*$ values compared to LOMAP. Therefore, RVSE induced TRA and protein oxidation stability but reduced myoglobin stability in Hanwoo beef steak. In addition, the effects of HOMAP were opposite those of RVSE.

• Korean Journal of Food Science and Technology
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• v.31 no.5
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• pp.1227-1234
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• 1999

Modified atmosphere packaging of peaches(Prunus persica L. Batsch) was investigated to extend their freshness during distribution. Peaches were packaged in the PE film(20LD, 40LD), the PE film modified by addition of 5%(w/w) zeolite(20CK, 40CK), and the PE film containing $Purafil^{\circledR}$ sachet(20LP, 40LP). Quality indexes of peaches during storage at $20^{\circ}C$ were measured in terms of weight loss, soluble solids content, pH, titratable activity, firmness, color and sensory properties. Gas composition and ethylene content In the film bags changed rapidly at the early stage of storage. Within 8 days, weight loss of the unpacked control increased upto ll.8% but those of the packaged remained below 2%. There was no significant difference in soluble solids content and pH in all the treatments. Ethanol content of peaches packed in 40LD was 12.88 mL/kg and acetaldehyde content in 40CK was $160\;{\mu}L/kg$ for 8 days. Peaches packed in 20CK showed a good visual and sensory Quality. The result suggested that active packaging treatment such as 20CK could be used for extending freshness of peaches during transport period at ambient temperature.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Elastomers and Composites
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• v.50 no.3
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• pp.189-195
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• 2015

In this study, we prepared epoxidized poly ethylene-ter-1-decene-ter-divinylbenzene (Epo-PEHV) as a reactive compatibilizer to prevent phase separation phenomenon which occurs upon blending polypropylene (PP) and ethylene-vinyl alcohol copolymer (EVOH). Firstly, PEHV was prepared under high catalyst activity according to content of catalyst and cocatalyst. After then, we modified vinyl group of the terpolymer with epoxy group. We observed that the terpolymer was successfully epoxidized by 1H-NMR and FT-IR analysis. The Epo-PEHV was added by 2, 5, 10% in PP/EVOH blends. The morphologies and mechanical properties of PP/Epo-PEHV/EVOH blends were analyzed by SEM and UTM, respectively. Epo-PEHV enhanced the interfacial adhesion of PP and EVOH blends.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.43-47
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• 2004

A coupler or divider is a microwave passive component used for power coupling or dividing. Regarding the trend of current telecommunication systems monolithic integration of passive components is highly desirable. In this study by the LTCC(Low temperature co-fired ceramics) technology a 2012 size type dual band coupler with multi-layer structure was fabricated. To achieve the desired coupling values for both DCS and EGSM bands, broad side coupled patterns were used with multi-layer structure. Its characteristics such as coupling, insertion loss, isolation and directivity values were measured and compared with simulation results.

• Journal of the Korean Applied Science and Technology
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• v.27 no.4
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• pp.461-469
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• 2010

Polyurethane adhesive is used in various fields as flexible packaging materials including a food packaging field. Therefore, the purpose of this study is synthesis of polyurethane adhesive which uses aliphatic isocyanate, and compares with aromatic isocyanate. The isocyanates for this test are toluene-2,4-diisocyanate(TDI), hexamethylene diisocyanate(HDI), 4,4-dicyclohexyl ethane diisocyanate($H_{12}MDI$), and isophorone diisocyanate(IPDI). And, the effect of any other diisocyanate are evaluated by several methods as for curing rate test, accelerate weathering test, and peel strength test. The polyurethane adhesive using curing catalyst and HDI has adhesion strength of about 560 g/15 mm between aluminium foil and nylon, about 1,520 g/15 mm between nylon and CPP. Those parameters are similar to polyurethane adhesive with TDI. Also, in case of curing rate, those are similar to TDI type polyurethane adhesive. Moreover, data of ${\Delta}E$ as color variation by QUV tester is equal to 4.12, as 48% against those of TDI type.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.