• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.107-110
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• 2002

The optical memory devices of BST thin films to composite $(Ba_{0.7}\;Sr_{0.3})TiO_{3}$ using sol-gel method were fabricated by changing of the depositing layer number on $Pt/Ti/SiO_{2}/Si$ substrate. The structural properties of optical memory devices to be ferroelectric was investigated by fractal analysis and 3-dimension image processing. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was $2500[\AA]$, $3500[\AA]$ and $3800[\AA]$. BST thin films exhibited the most pronounced grain growth. The surface morphology image was roughness with coating numbers. The thin films increasing with coating numbers shows a more textured and complex configuration.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.30.1-30.1
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• 2011

Multiferroic thin films with composition $0.9BiFeO_3-0.1Ba(Cu_{1/3}Nb_{2/3})O_3$ were epitaxially grown by pulsed laser deposition on $SrRuO_3(001)/SrTiO_3$ (000) substrate $0.9BiFeO_3-0.1Ba(Cu_{1/3}Nb_{2/3})O_3$, which is assumed to be morphotropic phase boundary (MPB), that showed superior dielectric, ferroelectric and magnetic properties in our study on polycrystalline films. The structures of epitaxially grown films were characterized by means of XRD. From P-E measurements, samples exhibited typical ferroelectric hysteresis loops and large remnant polarization, whose value is much larger than those of pure BFO film. The enhancement of dielectric, ferroelectric, magnetic properties was attributed to the structural distortion induced by the BCN addition and the high physical stress effect.

• 한국진공학회지
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• 제7권4호
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• pp.355-360
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• 1998

250$\AA$과 1340$\AA$두께의 에피탁시($Ba_{0.5}Sr_{0.5}$)$TiO_3$(혹은 BST)박막을 MgO(001)단결정기 판에 펄스형 레이저 증착법(pulsed laser deposition)으로 제조한 후 방사광 X선 산란을 이 용하여 분석하였다. 박막은 초기에 MgO(001)단결정 기판과cube-on-cube관계로 증착되며, 박막이 성장함에 따라 이 관계를 계속 유지하면서 성장하는 것으로 판단된다. 한편 박막이 성장함에 따라 박막의 표면은 급격하게 거칠어지는 반면 기판과 박막 사이의 계면의 거칠기 는 크게 변하지 않았다. 에피탁시 BST박막의 초기상태에서는 c축이 기판과 수직한 방향으 로 배향된 정방정구조를 지녔으며, 아울러 기판의 수직(out-of-plane) 및 평형(in-plane)방향 으로의 모자익(mosaic)분포가 좁아짐을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.266-267
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• 2007

$Ba_{0.5}Sr_{0.5}TiO_3$(BST) films with different deposition temperatures were deposited on $Al_2O_3$ substrate by Nd:YAG Pulsed Laser Deposition(PLD). The deposition conditions to achieve high crystal structures and dielectric properties were optimized for both techniques. The structural characterization on the BST thin films was performed by X-Ray Diffraction(XRD) and Atomic Force Microscopy (AFM). Effects of post-deposition annealing of BST films were investigated. The best dielectric properties were obtained on $800^{\circ}C$ deposited BST film with post-deposition annealing at $1100^{\circ}C$ in flowing $O_2$ atmosphere for 2hours.

• 대한전자공학회논문지SD
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• 제38권5호
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• pp.329-337
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• 2001

고유전 (Ba, Sr)TiO/sub 3/ (BST) 박막을 이용한 DRAM storage capacitor의 저전계 영역에서의 전하손실을 발생시키는 커패시터의 누설전류는 유전완화전류와 진성 누설전류로 이루진다고 알려져 있다. 특히, 기가급 DRAM의 동작 전압(~IV)에서 유전완화전류가 진성 누설전류에 비해 훨씬 크기 때문에 이에 대한 심도 있는 연구가 필요하다. 본 연구에서는 thermally stimulated current (TSC) 측정법을 BST 박막에 처음으로 적용하여 트랩의 에너지 level 및 공정변화에 따른 트랩 밀도의 상대적 평가를 하였다. 그리고, 기존에 사용되던 전류-전압(I-V) 측정이나 전류-시간(I-t) 측정과 비교 및 분석함으로써 유전완화 전류의 원인을 규명하고 TSC 측정법의 신뢰성을 살펴보았다. 먼저 안정적인 TSC 측정을 위해 전계, 시간, 온도 및 승온속도에 따른 polarization condition을 알아보았다 이 조건을 이용한 TSC 측정으로부터 BST 박막에서의 트랩의 energy level이 0.20(±0.01) eV와 0.45(±0.02) eV임을 알 수 있었다. Rapid thermal annealing (RTA)을 이용한 후속 열처리에 따른 TSC 측정을 통하여 이 트랩들이 산소결핍(oxygen vacancy)에 기인함을 확인할 수 있었다. MIM BST 커패시터의 열처리에 대한 TSC 특성은 전류-전압(I-V) 및 전류-시간(I-t) 특성과 같은 경향성을 보인다. 이것은 TSC 측정이 BST 박막내의 트랩을 평가하는데 있어서 매우 효과적인 방법이라는 것을 보여준다.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 춘계총회,특별강연,심포지움,연구발표회
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• pp.51.2-51.2
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• 2000

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.63-70
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• 2004

The structural, electrical properties of $(Ba, Sr)TiO_3[BSTO]/RuO_2$ thin films were examined by the addition of amorphous BSTO layer between crystlline BSTO film and $RuO_2$ substrate. We prepared BSTO films with double-layered structure, that is, amorphous layers deposited at $60^{\circ}C$ and crystalline films. Crystalline films were prepared at 550 on amorphous BSTO layer. The thickness of the amorphous layers was varied from 0 to 170 nm. During the deposition of crystalline films, the crystallization of the amorphous layers occurred and the structure was changed to circular while crystalline BSTO films showed columnar structure. Due to insufficient annealing effect, amorphous BSTO phase was observed when the thickness of the amorphous layers exceeded 30 nm. Amorphous BSTO layer could also prevent the formation of oxygen deficient region in $RuO_2$ surface. Leakage current of total BSTO films decreased with increasing amorphous layer thickness due to structural modifications. Dielectric constant showed maxi-mum value of 343 when amorphous layer thickness was 30 nm at which the improvement by grain growth and the degradation by amorphous phase were balanced.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.866-869
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• 2001

In this study, (Ba,Sr)TiO$_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP). Etching characteristics of BST thin films including etch rate and selectivity were evaluated as a function of the etching parameters such as gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 $\AA$/min at Ar(90)/CF$_4$(10), 600 W/350 V and 5 mTorr. The selectivity of BST to PR was 0.6, 0.7, respectively. To analyze the composition of surface residue remaining after the etching, samples etched with different CF$_4$/Ar gas mixing ratio were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). From the results of XPS and SIMS, there are chemical reaction between Ba, Sr, Ti and C, F radicals during the etching and remained on the surface.

• 한국전기전자재료학회논문지
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• 제17권10호
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• pp.1061-1067
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• 2004

In this study, ferroelectric (Ba,Sr)TiO$_3$ and high temperature superconductor YBCO thin films were fabricated by PLD (Pulsed Laser Deposition) method and tuneable bandstop filters were implemented with two different IDC(Interdigital Capacitance) gap patterns, 20${\mu}{\textrm}{m}$ and 30${\mu}{\textrm}{m}$ using these two thin film layers. The resonant frequency was changed by DC bias voltage. By comparing measured results with simulation, the dielectric properties of ferroelectric thin film have been extracted. The permittivity was 820 ～ 900 at 30 K and had an acceptable error range but the loss tangent had a great difference, 0.018 in 30${\mu}{\textrm}{m}$ IDC gap pattern and 0.037 in 20 ${\mu}{\textrm}{m}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.