• Title/Summary/Keyword: $Al_2O_3$ Paste

Search Result 74, Processing Time 0.024 seconds

고출력용 인쇄회로기판을 위한 무전해 니켈 도금막의 특성 연구

  • Yun, Jae-Sik;Jo, Yang-Rae;Kim, Hyeong-Cheol;Samuel, Tweneboah-Koduah;Lee, Yeon-Seung;Na, Sa-Gyun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.322-322
    • /
    • 2013
  • 최근 전자제품들의 소형화, 경량화, 다기능화가 활발히 진행됨에 따라, 고성능의 고출력용 인쇄회로기판(PCB)의 개발이 요구되고 있다. PCB는 전자제품의 각 부품을 전기적으로 연결하는 통로로서 전자제품의 소형화, 다기능화에 따라 고집적화가 요구되고 있다. 하지만 모든 전자장비의 고장의 85% 정도가 발열에 의한 것으로, PCB의 고집적화에 따른 발열문제가 매우 중요한 이슈가 되고 있다. 최근에는 이러한 문제점을 해결하기 위해 PCB의 방열층으로 양극 산화막을 금속 기판 위에 형성하고 이 절연층 위에 금속층을 회로로서 형성하는 방열 PCB 기판에 대한 연구가 활발히 진행되고 있다. 최근까지, 금속층 회로 형성을 위해 무전해 Ni 도금에 대한 연구가 활발히 이루어져 왔다. 하지만 주로 화학적, 전기화학적 관점에서 많은 연구자들에 의해 조사 연구되어 왔다. 본 실험에서는 anodized Al 절연층 위의 회로전극 부분으로 스크린 방법으로 Ag paste를 패턴 인쇄한 뒤, 무전해도금 방식으로 저렴한 Ni 전면 회로전극을 형성하여 전기전도도를 높이고, 저항을 낮출 수 있는 회로로서 기판의 손상을 최소화하고 선택적으로 Ag 패턴에만 Ni 전극회로를 형성시키는 것을 목표로 연구하였다. Ni-B 무전해 도금시 도금조의 온도는 $65^{\circ}C$, 무전해 도금액의 pH는 ~7 (중성)로 유지하였다. Al2O3 기판을 이용한 Ag Paste 패턴 위에 증착된 Ni-B 박막의 특성을 분석하기 위해 X-ray diffraction (XRD), AFM (Atomic Force Microscopy), SEM (Scanning Electron Microscope), XPS (X-ray Photoelectron Spectroscopy)을 이용하여 Ni-B 박막의 특성을 분석하였다.

  • PDF

Development of piezocapacitive thick film strain gage based on ceramic diaphragm (세라믹 다이어프램을 이용한 정전용량형 후막 스트레인 게이지)

  • Lee, Seong-Jae;Park, Ha-Young;Kim, Jung-Ki;Min, Nam-Ki
    • Proceedings of the KIEE Conference
    • /
    • 2003.07c
    • /
    • pp.1529-1531
    • /
    • 2003
  • Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

  • PDF

Heavy Metal Ion Immobilization Properties of Microporous Ettringite Body (에트린자이트 미세다공체의 중금속 이온 고정화 특성)

  • Na, Hyeon-Yeop;Song, Tae-Woong
    • Journal of the Korean Ceramic Society
    • /
    • v.46 no.6
    • /
    • pp.668-672
    • /
    • 2009
  • Heavy metal ion immobilization properties of microporous ettringite (3Ca$O{\cdot}Al_2O_3{\cdot}3CaSO_4{\cdot}32H_2$) body were examined using standard solutions of typical heavy metals. Microporous Ettringite body with desirable shape for an ionic adsorbent was obtained by the self hardening of the paste prepared from the mixture of tricalcium aluminate($C_3$A) and gypsum(CaS$O_4{\cdot}2H_2$O). Crushed grains of ettringite were soaked in each standard solutions of Pb, Co, Cd, Mn and Cr concentrated at 200 ppm. In order to evaluate the ionexchange and immobilization ability, the ionic concentration of the filtrate solution as well as the solution obtained after leaching test was measured. As a result, for the heavy metal ions excepting Cr, porous ettringite body was revealed to be excellent in ionic exchange and immobilization properties though some ions eluted at the severe condition of pH 2. The adsorption and keeping capacity for four heavy metals showed the order of $Pb{>}Co{>}Cd{>}$Mn.

Structural and Electrical Properties of Pb(Zr0.4Ti0.6O3/PbZr0.6Ti0.4)O3 Heterolayered Thick Films

  • Park, Sang-Man;Lee, Sung-Gap;Yun, Sang-Eun;Noh, Hyun-Ji;Lee, Young-Hie;Bae, Seon-Gi
    • Transactions on Electrical and Electronic Materials
    • /
    • v.7 no.6
    • /
    • pp.279-282
    • /
    • 2006
  • [ $Pb(Zr_{0.4}Ti_{0.6}O_{3}\;and\;Pb(Zr_{0.6}Ti_{0.4})O_{3}$ ] paste were made and alternately screen-printed on the $Al_{2}O_{3}$ substrates. We have introduced a press-treatment to obtain a good densification of screen printed films. The porosity of the thick films was decreased with increasing the applied pressure and the thick films pressed at 60 MPa showed the dense microstructure and thickness of about $76\;{\mu}m$. The remanent polarization and coercive field increased with increasing applied pressure and the values for the PZT thick films pressed at 60 MPa were $17.04{\mu}C/cm^{2}$ and 78.09 kV/cm, respectively.

진공 원자층 증착법을 적용한 염료감응형 태양전지의 효율 향상 연구

  • Sin, Jin-Ho;Gang, Sang-U;Kim, Jin-Tae;Go, Mun-Gyu;Hwang, Taek-Seong;Yun, Ju-Yeong
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2011.08a
    • /
    • pp.175-175
    • /
    • 2011
  • 최근 석유 자원의 고갈로 인하여 요구되는 대체 에너지 개발의 필요성이 대두되고 있다. 그중 태양에너지는 지구의 생명체가 살아가는 에너지의 근원으로서 매초 800~1,000 W에 달하는 에너지양으로 볼 때 태양은 인류가 가장 풍부하게 활용할 수 있는 에너지원이다. 태양에너지를 이용한 염료감응형 태양전지(Dye-Sensitized Solar Cells, DSSCs)는 제조원가를 낮출 수 있고, 유리 전극을 이용한 투명한 태양전지를 제조할 수 있어 건물의 유리창등으로 응용할 수 있는 장점이있다. 이러한 광변환 효율을 증가시키기 위한 방법으로 전기방사 TiO2 Nanofiber를 기계적으로 갈아서 제조한 TiO2 Nanorod 와 TiO2 Nanoparticle를 섞어서 만든 paste를 이용하여 넓은 표면적과 빠른 전자수송도를 갖게 하였고, 흡착된 염료에서 발생되는 광전자가 전해질의 산화, 환원되는 요오드 이온(I-/I3-)과의 재결합(recombination)현상을 TiO2 전극 위에 높은 밴드갭(band-gap)을 가지는 Al2O3 박막을 TriMethylAluminium (TMA) 전구체를 이용한 원자층 증착(Atomic Layer Deposition, ALD) 공정을 사용하여 진공증착 통해 광전변환효율이 떨어지는 현상을 방지하여 효율을 높였다.

  • PDF

Investigation of alumina(Al2O3) 3D nozzle printing process (알루미나(Al2O3)를 활용한 3D 노즐 프린팅 기술 연구)

  • An, Tae-Kyu;Han, Kyu-Sung;Kim, Ji-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.20 no.12
    • /
    • pp.247-253
    • /
    • 2019
  • 3D printing technology has attracted considerable attention because of its potential to fabricate the intricate design of ceramic products. In this study, ceramic 3D nozzle printing was introduced to manufacture complex alumina products with a ceramic pigment. The alumina paste was formulated by incorporating an elastomer to impart viscoelastic properties. Viscoelastic pastes play an essential role in ceramic 3D nozzle printing. The effects of the viscoelastic properties of the ceramic pastes on their printability were assessed using comprehensive rheological analysis, and various shapes were printed. As a result, the paste with a high yield stress showed better printability. In addition, a ceramic pigment was added to the developed pastes to increase the aesthetics of the printed ceramic structure. The printed ceramic parts were sintered in air at 1300 ℃. The stability of the ceramic pigment was confirmed even after high-temperature sintering.

고충전 polymer/ceramic composite에서 유전 특성의 mixing rule

  • Lee, Ji-Ae;Sin, Hyo-Sun;Hong, Yeon-U;Yeo, Dong-Hun;Kim, Jong-Hui;Yun, Ho-Gyu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.06a
    • /
    • pp.309-309
    • /
    • 2008
  • 전자 산업의 발달로 인해 전자기기에 소형화, 경량화 및 다기능화가 요구되면서 고밀도화, 고집적화가 필요하게 되었다. 이와 같은 부품의 고집적화 기술로 최근 제시되고 있는 방법 중 하나는 ceramic powder로 구성된 유전층에 polymer를 infiltration시키고 cure 과정을 거쳐 소결공정 없이 유전층을 완성하는 것이다. 그리고 이 유전층을 layer 단위로 build up하는 방법을 이용하여 반복적으로 형성하는 기술이 연구되고 있다. 그러나 고충전된 polymer/ceramic composite에서 유전 특성은 기존에 알려진 저충전 구조에서의 mixing 이론을 따를 것인지에 대한 실증적인 연구는 이루어지지 않았다. 본 연구에서는 ceramic powder $Al_2O_3$를 이용하여 polymer의 함량을 최소화하여 paste 를 제조하고, 스크린 프린팅 방법으로 인쇄하여 ceramic layer를 제작하였다. 그리고 이 위에 polymer infiltration 과정을 동하여 고충전 ceramic/polymer composite layer를 제작하였다. 또한, $Al_2O_3$를 filter로 사용한 저충전 polymer/ceramic composite에서의 mixing rule과 비교하여 복합체의 유전 특성을 설명하였다.

  • PDF

Electrical Properties of Thick-Film Resistor Prepared by Using RuO2-Glass Composite Powder (RuO2-유리 복합분말을 이용하여 제조된 후막 저항의 전기적 특성 연구)

  • Kim, Min-Sik;Ryu, Sung-Soo
    • Journal of the Korean institute of surface engineering
    • /
    • v.50 no.5
    • /
    • pp.301-307
    • /
    • 2017
  • The purpose of this study is to investigate the electrical properties of thick-film resistor (TFR) prepared from $CaO-ZnO-B_2O_3-Al_2O_3-SiO_2$ (CZBAS) glass containing $RuO_2$ particles. $RuO_2$-glass composite powder was made by mixing and melting oxide powders of constituents. For comparison, $RuO_2$ powder was simply mixed with glass powder. $RuO_2$-40wt% glass composite and mixture were dispersed in an organic binder to obtain printable resistor paste and then thick-film was formed by screen printing, followed by sintering at the range between $750^{\circ}C$ and $900^{\circ}C$ for 10 min with a heating rate of $50^{\circ}C/min$ in an ambient atmosphere. $RuO_2$-glass composite sample showed much higher resistance compared to the simple mixed sample. This could be attributed to the difference in conducting mechanism. After sintering at $850^{\circ}C$, temperature coefficient of resistance of composite sample was lower than that of simple-mixed sample. TFR with dense and homogeneous microstructure could be obtained by using $RuO_2$-glass composite powder.

Manufacture of Ordinary Portland Cement Clinker Using Cement Paste of the Waste Concrete (폐콘크리트로부터 회수된 시멘트 페이스트 미분말의 시멘트 원료화 연구)

  • Ahn, Ji-Whan;Kim, Hyung-Seok;Cho, Jin-,Sang;Han, Gi-Chun;Han, Ki-Suk;Kim, Hwan
    • Journal of the Korean Ceramic Society
    • /
    • v.40 no.8
    • /
    • pp.804-810
    • /
    • 2003
  • The fine powder produced by heating and grinding of the waste concrete in the waste construction was investigated whether utilize as substitution raw material of SiO$_2$, CaO, and Al$_2$O$_3$ source for OPC clinker manufacture is possible or not. In order to synthesize OPC clinker, limestone, shale, converter slag and fly ash were used as main raw materials, and modulus was fixed LSF 91.0, SM 2.60, IM 1.60. The synthesized clinkers were characterized. The Main products of synthesized clinker were C$_3$S, ${\beta}$-C$_2$S, C$_3$A, C$_4$AF as OPC clinker at 1,43$^{\circ}C$. As a result of TG-DTA and burnability index(B.U) analysis of each raw mixtures, the formation temperature of clinker phases was similar and B.I was showed easy burning as 48.6∼51.4.

Influence of Bath Temperature on Electroless Ni-B Film Deposition on PCB for High Power LED Packaging

  • Samuel, Tweneboah-Koduah;Jo, Yang-Rae;Yoon, Jae-Sik;Lee, Youn-Seoung;Kim, Hyung-Chul;Rha, Sa-Kyun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.323-323
    • /
    • 2013
  • High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

  • PDF