1 |
C. S. Mccandish and A. L. Dow, Outlook for thick film hybrids 1985 - 90, Am. Ceram. Soc. Bull., 63 (1985) 547.
|
2 |
T. Inokuma, Y. Taketa and M. Haradome, The Microstructure of thick film resistors and the Influence of glass particle size on their electrical properties, IEEE Trans. Component, Hybrid. Manuf Tech., CHMT-7 [2] (1984) 166-75.
|
3 |
F. Miyashiro, N. Iwase, A. Tsuge, F. Ueno, M. Nakahashi and T. Takahashi, High thermal conductivity aluminum nitride ceramic substrates and packages, IEEE trans. Components, Hybrids and Manufacturing Technology, 13 (1990) 313-319.
DOI
|
4 |
G. Reppe, C. Kretzschmar, A. Scheffel, H. Thust, T. Kirchner and M. Grobe, Realization of attenuators and termination in thick film technology on AlN-substrates, 11th European Microelectronics conference (1997) 69-76.
|
5 |
O. Abe, Y. Taketa and M. Haradome, The effect of various factors on the resistance and TCR of thick film resistors-Relation between the electrical properties and particle size of constituents, the physical properties of glass and firing temperature, Active and Passive Elec., 13 (1988) 67-83.
DOI
|
6 |
M. Hrovat, Z. Samardzija and J. Holc, The development of microstructural and electrical characteristics in some thick-film resistors during firing, J. Mater. Sci., 37 (2002) 2331-39.
DOI
|
7 |
M. V. H. Rao, V. D. Giramkar, G. J. Phatak, D. P. Amalnerkar, K. S. Sastri and V. N. Krishnamurthy, Microstructure and electrical properties of 'pre-sintered bismuth ruthenate-glass composite' based thick film paste for resistor application, International Journal of Electronics, 92 (2005) 451-466.
DOI
|
8 |
C. Kretzschmar, P. Otschik, K. Jaenicke-Rossler and D. SchlAfer, The reaction between ruthenium dioxide and aluminium nitride in resistor pastes, J. Mater. Sci., 28 (1993) 5713-16.
DOI
|
9 |
L. S. Chen, S. L. Fu and J. H. Wu, Electrical properties of and -doped thick film resistors on AlN substrates, Jpn. J. Appl. Phys., 41 (2002) 2969-73.
DOI
|
10 |
M. S. Kim, H. J. Kim, H. T. Kim, D. J. Kim, Y. D. Kim and S. S. Ryu, Electrical properties of eco-friendly -based thick-film resistors containing CaO-ZnO- system glass for AlN substrate, Journal of the Korean Ceramic Society, 47 (2010) 467-473.
DOI
|
11 |
R. W. Vest; Ceramic Materials for Electronics: Processing, Properties and Application, ed. R. C. Buchanan, Marcel Dekker 2nd ed., New York (1991) 473.
|
12 |
T. Yamaguchi and K. Iizuka, Microstructure development in -glass thick film resistors and its effect on the electrical resistivity, J. Am. Ceram. Sci., 73 (1984) 166-75.
|