• 대한기계학회논문집A
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• 제20권4호
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• pp.1301-1308
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• 1996

In order to save the energy and protect the environment, it were studied about ecomaterials with the developed countries as central figure. In the Metal Matrix Composites(MMCs), this trends appeared the development of the MMCs which had excellent mechanical properties in spite of the low volume fraction of reinforcement. Therefore, in this study, fatigue crack growth test, tensile and hardness test were conducted in order to investigate the mechanical and fatigue properties of 5 %, and 10 % $SiC_{p}$/Al composites. As the results, in the tensile and hardness test, tensile strength and hardness increased but fatigue crack growth rate decreased with $SiC_{p}$/Al volume fraction. And in the view of fatigue failured surface through the SEM, fatigue crack initiated around the SiC particle and in low $\Delta{K}$ regions, fatigue creck detoured the SiC particle but crack propagated through the SiC particle in the high $\DeltaK$ regions.

• 소성∙가공
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• 제7권2호
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• pp.158-167
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• 1998

Hot restoration mechanism flow stress and stain of the Al2024 composites reinforced with 1,8,15,36, and $44{\mu}m\;SiC_p$(10 vol. %) were studied by hot torsion tests. The hot restoration mechanism of all the composites was found to be dynamic recrystallization(DRX) at $320^{\circ}C$ while that of the composites reinforced with 1 and $8{\mu}m\;SiC_p$ was found to be dynamic recovery(DRX) at $480^{\circ}C$. It was found that the Al2024 composite with $15{\mu}m\;SiC_p$ showed the highest flow stress(${\sim}$223 MPa) at $320^{\circ}C$ under a strain rate of 1.0/sec. Also the highest flow strain of the composites was obtained at $430^{\circ}C$. The com-posites reinforced with 1 and $8{\mu}m\;SiC_p$ showed lower flow stress and higher flow strain at $480^{\circ}C$ than those of the composites reinforced with 15, 36, and $44\;{\mu}m\;SiC_p$ These result were discussed in relation to the transition of the hot restoration mechanism. $DRX{\leftrightarrow}DRV$. The dependence of flow stress on strain rate and temperature was attempted to fit with the hyperbolic sine equation ($\dot{\varepsilon}=A[sinh({\alpha}{\cdot}{\sigma}_p]^n$ exp(-Q/RT)and Zener-Hollomon parameter($Z=\;\dot{\varepsilon}\;exp(Q/RT))$.

• Composites Research
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• 제16권1호
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• pp.1-12
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• 2003

본 연구는 보강재의 부피분율이 49%, 56%, 63%첨가된 패키징용 SiC/Al복합재료를 가압주조법을 통해 개발하였다. SiC/Al복합재료는 0.8%의 무기성형제와 $Al_2$O$_3$섬유가 SiC입자에 비해 부피비 1:10의 비율로 첨가되었으며 새로이 고안된 몰드에서 제조되었다. 제조된 SiC/Al복합재료에 대해 30-300 구간에서 열팽창 계수를 측정하고, FEM수치해석과 비교하여 온도에 따른 특성을 분석하였다. 실험결과 SiC/Al복한재료의 열팽창계수는 혼합법칙, Turner모델의 중간값을 가졌으며 상온에서는 Turner모델에 가깝다가 온도가 높아질수록 혼합법칙에 가까와졌다. 이러한 특성은 모재의 소성변형 및 잔류응력에 의한 것으로 본 연구에서 제안한 모재와 보강재 사이에 작용하는 평균응력 차이로부터 분석이 된다. 해석결파 모재의 소성변형이 시작되는 온도에서 SiC/Al복합재료의 열팽창계수가 급격히 증가하였으며, 가공 잔류응력은 이러한 소성변형의 시작온도를 고온으로 이동시킴으로써 열팽창계수에 영향을 끼침을 밝혔다. 이러한 일련의 연구를 통해 온도에 따른 열팽창 특성은 복수입자모델에 의한 2차인 해석을 통해 성공적으로 분석됨을 보였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.32-32
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• 2009

실리콘 박막 태양전지에서 전면 투명전도막(TCO)은 태양전지의 전기, 광학적 특성을 결정하는 중요한 기능을 한다. ZnO:Al TCO는 기존에 사용되던 $SnO_2:F$와는 비정질 실리콘(a-Si:H) 박막 태양전지의 윈도우 층으로 사용되는 p a-SiC:H와의 일함수(work function) 차이로 인해 접촉전위(contact barrier)를 형성하게 되며 이로 인해 태양전지의 충진율(fill factor)이 $SnO_2:F$에 비해 감소하는 단점을 보인다. 본 연구에서는 ZnO:Al/p a-SiC:H 계면의 접촉전위 발생원인 및 태양전지 충진율 감소현상에 관한 정확한 원인규명을 위해 다양한 특성을 갖는 버퍼층을 삽입하여 계면특성 및 태양전지의 동작특성을 분석하고자 한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.208-209
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• 2008

Ni/Ti/Al multilayer system was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Compared with conventional process using Ni, Ni/Ti/Al contact shows perfect ohmic behavior, and possesses much lower contact resistance of about $2.5\times10^{-4}\Omega{\cdot}cm^2$ after $930^{\circ}C$ RTA, which is about 2 orders of magnitude smaller than that of Ni contact. Contact resistance gradually increased as the RTA temperature was lowered in the range of 840 ~ $930^{\circ}C$, and about $3.4\times10^{-4}\Omega{\cdot}cm^2$ was obtained at the lowest RTA temperature of $840^{\circ}C$. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance.

• 한국주조공학회지
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• 제10권4호
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• pp.309-315
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• 1990

Aluminum alloy matrix composites reinforced by SiC particles were prepared by rheocompocasting, a process which consists of the incoporation and distribution of reinforcement by stirring within a semi-solid alloy. When the volume fraction of SiCp and stirring speed were fixed, the dispersion of SiCp in Al-matrix alloy depended on stirring time and solid volume fraction in slurry. The results were as follows : 1) As a dispersed SiCp during stirring at $647^{\circ}C$ in 6063-Al alloy, SiC was better dispersed than that other temperature, where solid volume fraction was 43% in slurry. 2) When increased solid fraction in slurry, rate of dispersing SiC increased during stirring and porosities decreased in matrix alloy after casting. 3) Inspite of stirring with 800rpm, since solid particles of matrix alloy in slurry joined each other and occured joining growth, so that SiC was not dispersed into solid particle.

• 한국전기전자재료학회논문지
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• 제22권9호
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• pp.717-723
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• 2009

Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

• 한국주조공학회지
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• 제15권4호
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• pp.416-421
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• 1995

Recently Al-Cu-P alloys are used to refine primary Si of hypereutectic Al-Si alloys. Because it has inside AlP compound that acts as nucleation site in the melt, Al-Cu-P alloy has good refinement effect in lower holding temperature and after shoter holding times. In this study Al-Cu-P refinement agent was made by mechanical alloying method. When Al-13.5wt%Cu-1.5wt%P was alloyed mechanically for 30hr in Ar atmosphere by high energy ball mill, it had the refinement effect that showed primary Si size of about $30{\mu}m$ in Al-20wt%Si at $760^{\circ}C$, treated for 15min.

• 한국재료학회지
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• 제7권2호
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• pp.145-151
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• 1997

AI-xSi/ySiC( x:6~18wt%, y: 3~9wt%, SiC 입자크기: $10~28{\mu}m$) 복합재료를 재용해한 후 항온 유지하고 응고 시킬때 SiC 입자가 몰드의 하부로 침강하는 현상을 계통적으로 조사하였다. AI-Si/SiC 복합재료 용탕을 항온으로 유지하면 입자가 없는 지역은 유지시간이 약 처음 30분 동안 빠르게 증가한다. SiC 입자가 크기가 클수록 SiC입자의 크기가 클수록 SiC입자의 침강속도가 빠르다. 또한 복합재료중 철가한 SiC 입자의 부피분율이 증가하면 입자의 침강속도는 감소한다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 춘계학술강연 및 발표대회
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.