Analysis of Temperature dependent Thermal Expansion Behavior of Composites |
정성욱
(포항공과대학교 기계공학과 대학원)
남현욱 (포항공과대학교 기계공학과 대학원) 정창규 (포항공과대학교 기계공학과 대학원) 한경섭 (포항공과대학교 기계공학과) |
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Preform permeability prediction by self-consistent method and finite element simulation
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DOI ScienceOn |
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Thermal expansion behavior of silver matrix composites
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3 |
Finite element analysis about effects of particle morphology on mechanical response of composites
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Study on temperature dependence of thermal expansion behavior of SiCw/AI composite by internal stress analysis
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DOI ScienceOn |
5 |
Squeeze Casting Conditions of AI/AI203 Metal Matrix Composites with Variations of Preform Drying Process
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DOI ScienceOn |
6 |
Thermal expansion of metal-ceramic composites: a three-dimensional analysis
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7 |
Thermal Expansion Coefficients of Composite Materials Based on Energy Principles
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DOI |
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Effects of thermal processing on thermal expansion Coefficient of a 50 Vol. % SiCp /Al composite
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DOI ScienceOn |
9 |
The Elastic and Thermo-Elastic Properties of Composite Media
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10 |
Analyses of thermal expansion behavior of intergranular two-phase composites
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DOI ScienceOn |
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Fabrication process and thermal properties of <TEX>$SiC_p$</TEX>/AI-Si metal matrix composites for electronic packaging applications
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DOI ScienceOn |
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Thermal expansion responses of pressure infiltrated SiC/Al metal-matrix composites
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DOI ScienceOn |
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Thermal expansion studied of prestrained AI203/AI metal matrix composites
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14 |
Dependence of Thermal Residual Stress on Temperature in a SiC Particle-Reinforced 6061AI Alloy
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Development of light composite materials with low coefficients of thermal expansion
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DOI |
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FE investigation of the effect of particle distribution on the uniaxial stress-strain behaviour of particulate reinforced metal-matrix composites
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DOI |
20 |
Coeffcients of Thermal expansion of metal-matrix composites for electronic packaging
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21 |
A new substarate for electronic packaging: aluminum-silicon carbide(AISic) composites
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