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Analysis of Temperature dependent Thermal Expansion Behavior of $\textrm{SiC}_\textrm{p}/\textrm{Al}_2\textrm{O}_{3f}/\textrm{Al}$ Composites  

정성욱 (포항공과대학교 기계공학과 대학원)
남현욱 (포항공과대학교 기계공학과 대학원)
정창규 (포항공과대학교 기계공학과 대학원)
한경섭 (포항공과대학교 기계공학과)
Publication Information
Composites Research / v.16, no.1, 2003 , pp. 1-12 More about this Journal
Abstract
This study developed SiC$_{p}$/A1$_2$O$_3$$_{f}$/Al composites for electronic packaging to which reinforcements were added with the volume fractions of 49%, 56% and 63% by the squeeze casting method. 0.8 wt. % of the inorganic binder as well as the A1$_2$O$_3$ fiber and SiC Particles with the volume fraction of 1:10 were added to the composites, which were produced in the newly designed mold. For the produced SiC/Al composites, the CTEs (coefficients of thermal expansion) were measured from 30 to 300 and compared with the FEM numerical simulation to analyze the temperature dependent properties. The experiment showed the CTEs of SiC$_{p}$/A1$_2$O$_3$$_{f}$/Al composites that were intermediate values of those of Rule of Mixture and Turner's Model. The CTEs were close to Turner's Model in the room temperature and approached the Rule of Mixture as the temperature increases. These properties analyzed from the difference of the average stress acting between the matrix and the reinforcements proposed in this study.
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