• 전자공학회지
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• 제19권5호
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• pp.47-52
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• 1992

Ta₂O/Si 계면에서 SiO₂층이 dry O₂ 및 N₂분위기에서 열처리에 의해 형성되며 열처리 온도가 증가할수록 이층의 두께가 증가한다. Dry O₂ 및 N₂에서 열처리 할 때 얇은 Ta₂O 박막(40nm 이하)의 누설전류는 열처리 온도가 증가함에 따라 감소한다. 유전상수 vs 열처리 온도 관계에서 750℃또는 800℃에서 Ta₂O 박막의 결정화에 따른 최대값을 보여주며, 이러한 결정화에 의한 유전상수 증가 효과는 두꺼운 Ta₂O 박막에서 현저히 나타난다. 그러나 고온에서 열처리하면 계면에서 SiO₂층의 형성과 성장 때문에 유전상수는 감소한다. Al/Ta₂O/Si MIS capacitor의 stress에 따른 flat band voltage와 gate voltage instability는 열처리에 의해서 형성된 계면 SiO₂성장으로 설명할 수 있다. 열처리 조건의 함수로서 Ta₂O박막의 전기적 특성은 Ta₂O박막형성 방법에 관계없이 Ta₂O 박막 두께에 강하게 의존한다.

• 한국재료학회지
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• 제12권8호
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• pp.650-655
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• 2002

$SiO_2$ gels containing dispersed fine Te metal particles have been prepared by the sol- gel method using a starting solution containing Tetraethoxy Silane (Si($OC_2$ $H_{5}$ )$_4$), $H_2$O, Ethylalchol ($C_2$$H_{5}$OH), Nitric Acid ($HNO_3$) and Tellurium Tetracholoride ($TeCl_4$) in a several molar ratio. Gelling time of sols was about 3 days and viscosity of solution was very low about 2~3 cP for 3 days. Heat-treatments of the gel have been performed at 500, 700, 900, 1100 and $1300^{\circ}C$ for 1 hour, respectively. We have investigated TG-DTA, X-ray diffraction patterns and SEM of heat-treatmented gels. The size of Te fine particles dispersed in $SiO_2$ gel was about 0.8~1 $\mu\textrm{m}$ and the shape was almost quadrangle.

• 한국세라믹학회지
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• 제50권6호
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• pp.402-409
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• 2013

The objective of this study was to develop a synthesis process for ${\beta}$-SiC powders to reduce the synthesis temperature and to control the particle size and to prevent particle agglomeration of the synthesized ${\beta}$-SiC powders. A phenol resin and TEOS were used as the starting materials for the carbon and Si sources, respectively. $SiO_2$-C hybrid precursors with various C/Si mole ratios were fabricated using a conventional sol-gel process. ${\beta}$-SiC powders were synthesized by a carbothermal reduction process using $SiO_2$-C hybrid precursors with various C/Si mole ratios (1.6 ~ 2.5) fabricated using a sol-gel process. In this study, the effects of excess carbon and the addition of Si powders to the $SiO_2$-C hybrid precursor on the synthesis temperature and particle size of ${\beta}$-SiC were examined. It was found that the addition of metallic Si powders to the $SiO_2$/C hybrid precursor with excess carbon reduced the synthesis temperature of the ${\beta}$-SiC powders to as low as $1300^{\circ}C$. The synthesis temperature for ${\beta}$-SiC appeared to be reduced with an increase of the C/Si mole ratio in the $SiO_2$-C hybrid precursor by a direct carburization reaction between Si and excess carbon.

• 자원리싸이클링
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• 제24권1호
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• pp.35-42
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• 2015

본 연구는 건식제련법으로 폐 PCB를 처리하는 공정에서 슬래그 중 Ni의 용해거동에 대한 기초연구로서, CaO-$SiO_2-Al_2O_3$-MgO계 슬래그와 Cu-5 wt%Ni합금 사이의 Ni 분배거동을 1623~1823 K의 $CO_2$-CO 분위기 중에서 조사하였다. 평형산소분압이 증가할수록 Ni의 분배비는 선형적으로 증가하였으며, 이 결과로부터 Ni의 슬래그 중 용해반응은 다음과 같이 나타낼 수 있다. $$Ni(l)_{metal}+\frac{1}{2}O_2(g)NiO(l)_{slag}$$ 슬래그 중 염기성 산화물(CaO와 MgO)의 농도가 증가할수록 Ni의 분배비는 선형적으로 증가하였다. 그러나 반응 온도가 높을수록 Ni의 분배비는 선형적으로 감소하였다. 이러한 결과로부터 Ni의 분배비에 미치는 실험변수의 영향을 다중 회귀분석하여 다음과 같은 경험식을 얻었다. $${\log}L_{Ni}=0.4000{\log}P_{O2}-5.1{\times}10^{-4}T+0.3375\(\frac{X_{CaO}+X_{MgO}}{X_{SiO2}}\)$$

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권7호
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• pp.293-297
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• 2003

Silicon dioxide (SiO$_2$) layers were fabricated on Si$_3$N$_4$/SiO$_2$/Si layer structures by low pressure chemical vapor deposition (LPCVD). Potassium and aluminum were then coimplanted by implanting potassium ions with the energy of 100 ［keY］ and dose of 5x10$^{16}$ [cm￣$^2$］ and 1x10$^{17}$ [cm￣$^2$］ into an aluminum buffer layer on the SiO$_2$Si$_3$N4/SiO$_2$/Si structure. The pH, pNa, and pK ion sensitivities of the resulting layers were investigated and compared to those of as-deposited silicon dioxide layer. The pK-sensitivity of the silicon dioxide was enhanced by the K and Al coimplantation. On the contrary, the pH and pNa-sensitivities of the coimplanted silicon dioxides were quite lower than that of the as-deposited silicon dioxide.

• 한국세라믹학회지
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• 제51권5호
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• pp.386-391
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• 2014

Silicon nitride ($Si_3N_4$) is regarded as one of the most promising materials for high temperature structural applications due to its excellent mechanical properties at both room and elevated temperatures. However, one high-temperature $Si_3N_4$ material intended for use in radomes has a relatively high dielectric constant of 7.9 - 8.2 at 8 - 10 GHz. In order to reduce the dielectric constant of the $Si_3N_4$, an in-situ reaction process was used to fabricate $Si_3N_4-SiO_2$-BN composites. In the present study, an in-situ reaction between $B_2O_3$ and $Si_3N_4$, with or without addition of BN in the starting powder mixture, was used to form the composite. The in-situ reaction process resulted in the uniform distribution of the constituents making up the composite ceramic, and resulted in good flexural strength and dielectric constant. The composite was produced by pressure-less sintering and hot-pressing at $1650^{\circ}C$ in a nitrogen atmosphere. Microstructure, flexural strength, and dielectric properties of the composites were evaluated with respect to their compositions and sintering processes. The highest flexural strength (193 MPa) and lowest dielectric constant (5.4) was obtained for the hot-pressed composites. The strength of these $Si_3N_4-SiO_2$-BN composites decreased with increasing BN content.

• 한국재료학회지
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• 제6권6호
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• pp.636-643
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• 1996

공진기형 제 2고조파소자(SHG)는 레이저 빔의 에너지 밀도가 높아 고내구성 박막이 필요하다. 본 연구에서는 광학박막 재료로 고융점 산화물인 ZrO2, TiO2, SiO2를 사용하였다. 반응성 스퍼터링 방법으로 제작한 ZrO2, TiO2, SiO2 박막을 XRD, SAM을 사용하여 분석하였고, 박막의 광학적 특성을 평가하였다. SHG 소자의 KTP 및 Nd:YAG 결정의 반사방지막(A/R 코팅)구성은 ZrO2와 SiO2를 사용하여 컴퓨터로 계산하였는데 기본파인 1064nm와 제 2고조파인 532nm에서 각각 0.1%, 0.5%이하의 반사율을 갖도록 하였다. 또한 고반사막(H/R 코팅)의 경우 1064nm에서 99.9%의 반사율을 갖도록 TiO2와 SiO2로 디자인하였다. 제작한 광학박막의 광학적 특성, 레이저 내구성(laser damage threshold), 온습도 안정성 실험 등을 통해 광학박막을 평가하였다.

• 한국재료학회지
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• 제5권7호
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• pp.897-902
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• 1995

경북 감포지역에서 산출되는 천연 벤토나이트를 이용하여 제올라이트 A를 합성하기 위해 반응기질의 몰비, 반응온도, 반응시간 등에 따른 최적의 합성조건을 조사하였다. 실리카원은 40%-황산용액으로 처리한 천연 벤토나이트를 사용하였고, 알루미늄원은 NaA1O₂를 합성하여 사용하였다. 반응기질의 몰비는 SiO₂ : A1₂O₃ : NaO₂ : H₂O=2 : 1 : 1 : 25와 2 : 1 : 1 : 30이었고, 60℃에서 1시간 묵힘과정을 거친 후 90, 100, 120℃에서 1, 3, 5hr반응시켰다 제올라이트 A의 최적의 합성조건은 SiO₂: Al₂O₃ : Na₂O = H₂O=2 : 1 : 1 : 30이고, 90℃에서 3hr 반응시키는 경우였고, 이 조건에서 합성된 제올라이트의 열적 성질은 79.2℃에서 층간수가 증발하였고, 503.0℃에서 결정수가 탈리되었다. 수분의 감소량은 제올라이트 중량비의 5.9%이었다.

• 한국재료학회지
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• 제9권6호
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• pp.609-614
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• 1999

The effect of the amount of $SiO_2$dopant on the behavior of $AlO_2$$O_3$-composite formation by melt oxdation of Al-alloy was examined in this paper. The $SiO_2$powder was spread on the top surface of the Al-1Mg-3-Si-5Zn-1Cu alloy in th alumina crucible. The selected amount of each powder was 0.03, 0.10, 0.16g/$\textrm{cm}^2$. The oxidation behavior was determined by observing the weight gain after the heat treatment for 10 hours at 1373K. The macroscopic structure of formed oxide layer was examined by an optical microscope. The top surface and the cross-section of the grown oxide layer were investigated by SEM and analysed by EDX. The $SiO_2$ powder was determined to enhance oxidation by thermit reaction with Al which reduced the growth incubation period of the oxidation layer. As the amount of the $SiO_2$dopant increased, the growth rate decreased due to the precipitated Si which blocked the Al-alloy channel in the composite materials. However, more uniform layer was obtained due to the occurrance of the enhanced oxidation reaction in the whole alloy surface compared to the case of addition of less amount of dopant.

• 대한전자공학회논문지
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• 제27권5호
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• pp.709-715
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• 1990

SiO2 films were nitrided by tungsten-halogen heated rapid thermal annealing in ammonia gas at temperatures of 900-1100\ulcorner for 15-180sec. The nitroxide films were analyzed using Auger electron spectroscopy. MIS caapcitors were fabricated using these films as gate insulators. I-V and C-V characteristics of MIS capacitors were investigated. The AES depth profiles of nitroxide film show that the nitrogen rich layer is, at the early stage of nitridation, formed at the surface of nitroxide film and near the interface between nitroxide and silicon. Nitridation of SiO2 makes the film have a larger effective average refractive index. The thermal nitridation of SiO2 on silicon causes the flatband voltage shift due to the change of the fixed charge density. It is found that the dominant conduction mechanism in nitroxide is Fowler-Nordheim tunneling. Rapid thermal nitridation of 200\ulcornerSiO2 on silicon results in an improvement in the dielectric breakdown electric field.