• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.341-346
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• 2010

In this paper, anti-reflection coating was investigated for decreasing the reflection in visible range of 400~650 [nm] through four staked layers of $Si_xO_y$ and $Si_xN_y$ thin films prepared by reactive sputtering method. Si single crystal of 6 [inch] diameter was used as a sputtering target. Ar and $O_2$ gases were used as sputtering gases for reactive sputtering for the $Si_xO_y$ thin film, and Ar and $N_2$ gases were used for reactive sputtering for the $Si_xN_y$ thin film. DC pulse power of 1900 [W] was used for the reactive sputtering. Refractive index and deposition rate were 1.50 and 2.3 [nm/sec] for the $Si_xO_y$, and 1.94 and 1.8 [nm/sec] for the $Si_xN_y$ thin film, respectively. Considering the simulation of the four layer anti-reflection coating structure with the above mentioned films, the $Si_xO_y-Si_xN_y$ stacked four-layer structure was prepared. The reflection measurement result for that structure showed that a "W" shaped anti-reflection was obtained successfully with a reflection of 1.7 [%] at 550 [nm] region and a reflection of 1 [%] at 400~650 [nm] range.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.35-43
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• 1995

To obtain high quality of $Ta_{2}O_{5}$ film, two dielectric layers of $Si_{3}N_{4}$ and $Ta_{2}O_{5}$ were subsequently formed on Si wafer. Silicon nitride films were thermally grown in 10 Torr ammonia ambient by R.F induced heating system. The thickness of thermally grown $Si_{3}N_{4}$ film was able to be controlled in the range of tens $\AA$ due to the self-limited growth property. $Ta_{2}O_{5}$ film of 200$\AA$ thickness was then deposited on the as-grown $Si_{3}N_{4}$ film about 25$\AA$ thickness by sputtering method and annealed at $900^{\circ}C$in $O_{2}$ ambient for 1hr. Stoichiometry film was prepared by the annealing in oxygen ambient. Despite the high temperature anneal process, silicon oxide layer was not grown at the interface of the layered films because of the oxidation barrier effect of Si$_{3}$N$_{4}$ film. The fabricated $Ta_{2}O_{5}$/$Si_{3}N_{4}$ film showed low leakage current less than several nA and high dielectric breakdown strength.

• The Journal of Natural Sciences
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• v.5 no.2
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• pp.75-80
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• 1992

The objective of this study is to investigate the effect of dispersion of silicon nitride powder with 5wt% $A1_2$$O_3$ and 5wt% $Y_2$$O_3$ on the microstructure of a sintered body. $Si_3$$N_4$ powder was dispered in a distilled water with varing pH.Zeta potential was measured and the dispersion states were directly observed by SEM. Green bodies were obtained by slip-casting and fired at $1750^{\circ}C$ for 1 hr. Microstructures of fired specimens were observed by SEM. The result were that the specimen prepared from the dispersions with pH 5 and 10 showed the best densification.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.5
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• pp.808-815
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• 2008

The composites were fabricated 61[vol.%] ${\beta}$-SiC and 39[vol.%] $TiB_2$ powders with the liquid forming additives of 8, 12, 16[wt%] $Al_2O_3+Y_2O_3$ as a sintering aid by pressureless annealing at 1650[$^{\circ}C$] for 4 hours. The present study investigated the influence of the content of $Al_2O_3+Y_2O_3$ sintering additives on the microstructure, mechanical and electrical properties of the pressureless annealed SiC-$TiB_2$ electroconductive ceramic composites. Reactions between SiC and transition metal $TiB_2$ were not observed in the microstructure and the phase analysis of the pressureless annealed SiC-$TiB_2$ electroconductive ceramic composites. Phase analysis of SiC-$TiB_2$ composites by XRD revealed mostly of ${\alpha}$-SiC(6H), ${\beta}$-SiC(3C), $TiB_2$, and In Situ YAG($Al_2Y_3O_{12}$). The relative density of SiC-$TiB_2$ composites was lowered due to gaseous products of the result of reaction between SiC and $Al_2O_3+Y_2O_3$. There is another reason which pressureless annealed temperature 1650[$^{\circ}C$] is lower $300{\sim}450[^{\circ}C]$ than applied pressure sintering temperature $1950{\sim}2100[^{\circ}C]$. The relative density, the flexural strength, the Young's modulus and the Vicker's hardness showed the highest value of 82.29[%], 189.5[Mpa], 54.60[Gpa] and 2.84[Gpa] for SiC-$TiB_2$ composites added with 16[wt%] $Al_2O_3+Y_2O_3$ additives at room temperature. Abnormal grain growth takes place during phase transformation from ${\beta}$-SiC into ${\alpha}$-SiC was correlated with In Situ YAG phase by reaction between $Al_2O_3$ and $Y_2O_3$ additive during sintering. The electrical resistivity showed the lowest value of 0.0117[${\Omega}{\cdot}cm$] for 16[wt%] $Al_2O_3+Y_2O_3$ additives at 25[$^{\circ}C$]. The electrical resistivity was all negative temperature coefficient resistance (NTCR) in the temperature ranges from $25^{\circ}C$ to 700[$^{\circ}C$]. The resistance temperature coefficient of composite showed the lowest value of $-2.3{\times}10^{-3}[^{\circ}C]^{-1}$ for 16[wt%] additives in the temperature ranges from 25[$^{\circ}C$] to 100[$^{\circ}C$].

• Applied Chemistry for Engineering
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• v.7 no.4
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• pp.645-652
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• 1996

Selective catalytic oxidation of $H_2S$ to elemental sulfur using $TiO_2/SiO_2$ catalysts was investigated in this study. The reaction test with pure $TiS_2$ and $Ti(SO_4)_2$ and cyclic temperature operation revealed that $TiO_2$ had a good resistance to sulfation and sulfidation, which are known as the main cause of catalytic deactivation in sulfur recovery process. With the increase of $TiO_2$ loading amount in $TiO_2/SiO_2$ catalysts, the conversion of $H_2S$ increased and the selectivity of elemental sulfur was very slightly decreased. As the ratio of $O_2/H_2S$ increased, the selectivity to elemental sulfur was drastically decreased. In the presence of 10 vol.% water vapor to a stoichiometric mixture of $H_2S$ and $O_2$($H_2S$= 5 vol.% O=2.5 vol.% ), both activity and selectivity of 10 wt.% $TiO_2/SiO_2$ catalyst are decreased, but it still showed more than 80% of sulfur yield.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.136-136
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• 2011

반도체 및 전자기기 산업에 있어서 NVM은 아주 중요한 부분을 차지하고 있다. NVM은 디스플레이 분야에 많은 기여를 하고 있는데, 측히 AMOLED에 적용이 가능하여 온도에 따라 변하는 구동 전류, 휘도, color balance에 따른 문제를 해결하는데 큰 역할을 한다. 본 연구에서는 bottom gate 구조의 nc-Si NVM 실험을 진행하였다. P-type silicon substrate (0.01~0.02 ${\Omega}-cm$) 위에 Blocking layer 층인 SiO2 (SiH4:N2O=6:30)를 12.5nm증착하였고, Charge trap layer 층인 SiNx (SiH4:NH3=6:4)를 20 nm 증착하였다. 마지막으로 Tunneling layer 층인 SiOxNy은 N2O (2.5 sccm) 플라즈마 처리를 통해 2.5 nm 증착하였다. 이러한 ONO 구조층 위에 nc-Si을 50 nm 증착후에 Source와 Drain 층을 Al 120 nm로 evaporator 이용하여 증착하였다. 제작한 샘플을 전기적 특성인 Threshold voltage, Subthreshold swing, Field effect mobility, ON/OFF current ratio, Programming & Erasing 특성, Charge retention 특성 등을 알아보았다.

• Journal of the Korean Ceramic Society
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• v.34 no.3
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• pp.314-322
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• 1997

The thin film processing and the applicability as a IMD material of SiO2 aerogels providing ultralow dielec-tric properties were studied. The SiO2 aerogel films with 0.5g/㎤ density (78% porosity) and 4000~21000$\AA$ thickness could be prepared at 25$0^{\circ}C$ and 1160 psig by supercritical drying of wet-gel films, which were spin-coated at the spin rate of 1000~7000 rpm on p-Si(111) wafer under the isopropanol atmosphere. The optimum viscosity of polymeric SiO2 sols for spin coating was in the range of 10~14 cP. The main fac-tors being able to control the film thickness and microstructures were found to be sol concentration, spin rpm, and aging time of wet-gel films. The dielectric constant of the SiO2 aerogel thin film was around 2.0 low enough to be applied to the next generation semiconductor device beyond the giga level.

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.123-130
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• 1993

Dispersed type Al2O3-SiC composite powders were synthesized from Al-isopropoxide (Al(i-OC3H7)3) and Si(OC2H5)4 precursors by hydrolysis of mixed alkoxides and carbothermal reaction method. The characteristics of the synthesized (dispersed type) Al2O3-SiC composite powders were investigated using XRD, SEM, TEM, BET and particle size analyzer. Carbothermal reaction to produce Al2O3-SiC composite was completed in 10h at 135$0^{\circ}C$ on 3~4㎤/s (0.21~0.28cm/s) of H2 flow rate and about 1/1 of carbon/oxides(=SiO2＋Al2O3) molar ratio. The synthesized powders were observed to have the mean particle size range of 0.4~1.26${\mu}{\textrm}{m}$ and showed finer particle size with increasing SiC content.

• Journal of Biomedical Engineering Research
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• v.15 no.2
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• pp.189-194
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• 1994

Effects of ${AI_2O_3}/{P_2O_5}$ ratio on the crystallization of a series of glasses with the nominal composition of 41.4wt % $SiO_2$, 35.0wt % CaO, 20.6wt % (${P_2O_5}$+${AI_2O_3}$) and 3.0wt% MgO were investigated with DTA, XRD and SEM. The major crystalline phases are apatite and anorthite. The glass transition temperature ($T_g$) and the softening point ($T_s$) are shifted to the upper temperature by increasing $AI_2O_3$ content. The temperature of apatite crystallization ($T_{p1}$) is increased by $AI_2O_3$ content, but the tempera¬ture of anorthite crystallization ($T_{p2}$) is not affected significantly. With increased of $AI_2O_3$, the apatite crystallization is decreased, but anorthite crystallization is increased.

• Korean Journal of Materials Research
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• v.7 no.7
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• pp.587-591
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• 1997

RBS와 XRD를 이용하여 C o-Nb이중층 실리사이드와 구리 배선층간의 열적안정성에 관하여 조사하였다. Cu$_{3}$Si등의 구리 실리사이드는 열처리시 40$0^{\circ}C$정도에서 처음 형성되기 시작하였는데, 이 때 형성되는 구리 실리사이드는 기판의 상부에 존재하던 준안정한 CoSi의 분해시에 발생한 Si원자와의 반응에 의한 것이다. 한편, $600^{\circ}C$에서의 열처리 후에는 CoSi$_{2}$층을 확산.통과한 Cu원자와 기판 Si와의 반응에 의하여 CoSi$_{2}$/Si계면에도 구리 실리사이드가 성장하였는데, 이렇게 구리 실리사이드가 CoSi$_{2}$/Si 계면에 형성되는 것은 Cu원자의 확산속도가 여러 중간층에서 Si 원자의 확산속도 보다 더 빠르기 때문이다. 열처리 결과 최종적으로 얻어진 층구조는 CuNbO$_{3}$/Cu$_{3}$Si/Co-Nb합금층/Nb$_{2}$O$_{5}$CoSi$_{2}$/Cu$_{3}$Si/Si이었다. 여기서 상부에 형성된 CuNbO$_{3}$는 Cu원자가 Nb$_{2}$O$_{5}$및 Co-Nb합금층과 반응하여 기지조직의 입계에 석출되어 형성된 것이다.