• Journal of the Korean Graphic Arts Communication Society
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• 제11권1호
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• pp.103-122
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• 1993

A cause and counterplan of the increase in dark decay rate of$\varepsilon$-CuPc/PVCz photoreceptor which is consist of the carrier generation layer (CGL) of$\varepsilon$type copper phthalocyanine ($\varepsilon$-CuPc) thin film by an aqueous coating method and the carrier transport layer (CTL) of polyvinylcarbazol (PVCz) by spin coating, are studied in this paper. Electrochemical deposition of CGL was accompanied by an increase in work function of the aluminium substrate during the processes and the enhanced work function 5.3 eV rose above the ionization potential 5.16 eV of $\varepsilon$-CuPc. This resulted in the increased injection of holes from substrate into CGL and a fast dark decay rate. Improved photoreceptor, an electron-transport $\varepsilon$-CuPc/TNF photoreceptor, led to lowing of dark decay rate and increasing of photosensitivity. The carrier generation efficiency (ηg), carrier injection efficiency (ηi) and xerographic gain (G) of the $\varepsilon$-CuPc/TNF photoreceptor were obtained by XTOF method and PIDC.

• Korean Journal of Materials Research
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• 제28권8호
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• pp.435-439
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• 2018

MA Al alloys are examined to determine the effects of alloying of Mg and Cu and rolling on tensile deformation behavior at 748 K over a wide strain rate range($10^{-4}-10^3/s$). A powder metallurgy aluminum alloy produced from mechanically alloyed pure Al powder exhibits only a small elongation-to-failure(${\varepsilon}_f$ < ~50%) in high temperature(748 K) tensile deformation at high strain rates(${\acute{\varepsilon}}=1-10^2/s$). ${\varepsilon}_f$ in MA Al-0.5~4.0Mg alloys increases slightly with Mg content(${\varepsilon}_f={\sim}140%$ at 4 mass%). Combined addition of Mg and Cu(MA Al-1.5%Mg-4.0%Cu) is very effective for the occurrence of superplasticity(${\varepsilon}_f$ > 500%). Warm-rolling(at 393-492 K) tends to raise ${\varepsilon}_f$. Lowering the rolling-temperature is effective for increasing the ductility. The effect is rather weak in MA pure Al and MA Al-Mg alloys, but much larger in the MA Al-1.5%Mg-4.0%Cu alloy. Additions of Mg and Cu and warm-rolling of the alloy cause a remarkable reduction in the logarithm of the peak flow stress at low strain rates (${\acute{\varepsilon}}$< ~1/s) and sharpening of microstructure and smoothening of grain boundaries. Additions of Mg and Cu make the strain rate sensitivity(the m value) larger at high strain rates, and the warm-rolling may make the grain boundary sliding easier with less cavitation. Grain boundary facets are observed on the fracture surface when ${\varepsilon}_f$ is large, indicating the operation of grain boundary sliding to a large extent during superplastic deformation.

• Transactions of Materials Processing
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• 제4권2호
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• pp.159-168
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• 1995

The torsion tests in the range of $550~800^{\circ}C$, $5.0{\times}10^{-3}~5.0{\times}10^0/sec$ were performed to study the effects of strain rate$(\.{\varepsilon})$ and temperature(T) on the hot strength of Cu-Zn alloy. High temperature flow stresses of this alloy increased with increasing $\.{\varepsilon}$ and/or decreasing T, and than the more grain refinement could be obtained. The flow curves exhibited a peak followed by a steady steady state regime as a result of dynamic recrystallization. The hot strength dependence of $\.{\varepsilon}$ and T was described by a hyperbolic sine law, $\.{\varepsilon}=A(sinh0.017{\sigma})^4.81$exp(-216KJ/mol). Hot strength could be reduced at the arbitary condition, $\.{\varepsilon}$ and T, by constitutive parameter Z(Zenner-Hollomon parameter), $Z=A(sinh{\alpha}{\sigma})^n=\.{\varepsilon}$exp(Q/RT).

• Proceedings of the KWS Conference
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• 대한용접접합학회 1994년도 특별강연 및 춘계학술발표 개요집
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• pp.44-47
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• 1994

The ageing behavior of Cu-bearing HSLA steels was studied by using Differential scanning calorimetry(DSC), Transmission electron microscopy and hardness tester. Two heat evolution peaks were observed during DSC scans over the temperature range of 25～590$^{\circ}C$ at a heating rate of 5$^{\circ}C$/min. The peaks appeared in low (241∼319$^{\circ}C$ : HSLA-A, 224∼310$^{\circ}C$ : HSLA-B) and high temperature (514∼590$^{\circ}C$ : HSLA-A, 451∼558$^{\circ}C$ : HSLA-B) are attributed to the formation of coherent Cu-clusters and noncoherent $\varepsilon$-Cu phase, respectively. It was confirmed that as ageing proceeds, the coherent bcc Cu-clusters transform to noncoherent fcc $\varepsilon$-Cu phase. In the case of the ageing to peak hardness at 300$^{\circ}C$ and 400$^{\circ}C$, the coherent Cu-clusters contributed to the hardening. As ageing time and temperature increase over peak hardness, noncoherent $\varepsilon$-Cu are formed and hardness decreases.

• Journal of the Korean Graphic Arts Communication Society
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• 제8권1호
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• pp.1-20
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• 1990

$\alpha$,$\beta$,$\varepsilon$ type copper phthalocy $\alpha$,$\beta$,$\varepsilon$ type copper phthalocyanine(CuPc) pigment was purified by a simple train sublimation technique. The layered photoconductor was made with $\varepsilon$ type CuPc as a carrier generation layer(CGL) and polyvinly carvazol(PVCz) as a carrier transport layer(CLT). A CGL of CuPc was electrochemical deposited on an Al substrate used as cathode in pigment dispersion solutions. a CTL of PVCz pwas spin coated on $\varepsilon$ type CuPc thin film by a spin coater. The effect of sonication time, electrophotographic property of the layered photoconductor were studied with surface coverage, surface potential and sensitivity.

• Transactions of Materials Processing
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• 제4권2호
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• pp.169-179
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• 1995

Static restoration mechanism during hot interrupted deformation of Cu-Zn alloy was studied in the temperature range from $550^{\circ}C$ to $750^{\circ}C$ and at a constant strain rate of 0.1/sec. At a given temperature, the hot interrupted deformations were performed with variation of interrupted time $t_i$ form 1 to 50 sec and of interrupted strain ${\varepsilon}_i$ from 0.15 to 0.90. From the analysis of the values of the critical strain of ${\varepsilon}_c$ for tje initiation of dynamic recrystallization and the peak strain of${\varepsilon}_p$, the relationship ${\varepsilon}_c{\fallingdotseq}0.7{\varepsilon}_p$ was obtained. It was clarified that the softening of the interrupted deformation was mainly the static recrystallization and the fractional softening(FS) which was over 30% mostly confirmed this result. The fractional softening of the interrupted time $t_i$ especially and pre-strain. The FS increased with increasing strain rate, interrupted time and pre-strain. The change of microstructures after hot deformation could be predicted by the FS. when the FS was 30~100%, static recrystallization was happened and grain growth was observed at the condition which was $750^{\circ}C$ deformation temperature, 0.45 prestrain and this condition's FS value was over 100%.

• Journal of the Korean Society for Heat Treatment
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• 제16권6호
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• pp.320-328
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• 2003

A specimen of Cu-35%Sn alloy has been subjected to the unidirectional heat treatment in an attempt to examine the evolution of microstructures under varying thermal conditions. The specimen was cast in the form of a cylinder 10 mm in diameter and 200 mm in length, which was then installed in the temperature gradient field established inside a vertical tube furnace. The furnace temperature was adjusted to make the upper part at $750^{\circ}C$ and bottom end part at $300^{\circ}C$ of the specimen. The experiment was terminated by dropping it into water after the 30 minutes holding at given temperature. By the rapid cooling, the high temperature phases, ${\gamma}$ and ${\zeta}$, were retained at ambient temperature with some of ${\gamma}$ phase transformed to ${\varepsilon}$ phase, especially at the grain boundaries of ${\gamma}$ phase. The presence of ${\varepsilon}$ phase was found to determine the nature of phase transformations of the ${\zeta}$ phase undergoes upon cooling. In the close area of the ${\varepsilon}$ phase, ${\varepsilon}$ phase grew separately out of ${\zeta}$, and adds to the preexisting ${\varepsilon}$ whereas in areas away from ${\varepsilon}$, both ${\delta}$ and ${\varepsilon}$ grew simultaneously out of ${\zeta}$, and formed a lamella eutectoid structure. The transformation to ${\delta}$ was found to occur only in slow cooling. The hardness on each phase showed that the retained phases, ${\gamma}$ and ${\zeta}$, could be plastically deformed without brittle fracture while the phases, ${\varepsilon}$ and ${\delta}$, were too brittle to be deformed.

• Proceedings of the KIEE Conference
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• The Transactions of The Korean Institute of Electrical Engineers
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• 제58권8호
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of the Korean Graphic Arts Communication Society
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• 제9권1호
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• pp.1-11
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• 1991

In this reseach, double-layered photoconductor consist of the carrier generation layer(CGL) of $\varepsilon$ type copper phthalocyanine thin film by an aqueous coating method and the carrier transport layer(CGL) of polyvinyl carbazol(PVK) by spin coating. We inverstigated effect of the surfactant solution and cathod electrolysis to the crystal type of $\varepsilon$-CuPc in CGL with TEM, SEM and X- ray diffraction spectroscopy and studied the mechanism of an aqueous coating for the preparation of CGL. The effect of the washing of CGL about the electrophotographic characteristics of the $\varepsilon$-CuPc/PVK doublelayered photoconductors is studied also.