• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.131-135
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• 2003

Zinc Oxide(ZnO) thin films on Si (100) substrate were deposited by RF magnetron sputter with changing sputtering conditions such as argon/oxygen gas ratios, RF power, and substrate temperature, chamber pressure and target-substrate distance. To analyze a crystallographic properties of the films, $\theta/2\theta$ mode X-ray diffraction, SEM, and AFM analyses. C-axis preferred orientation, resistivity, and surface roughness highly depended on $Ar/O_2$ gas ratios. The resistivity of ZnO thin films rapidly increased with increasing oxygen ratio and the resistivity value of $9{\times}10^7{\Omega}cm$ was obtained at a working pressure of 10 mTorr with $Ar/O_2$=50/50. The surface roughness was also improved with increasing oxygen ratio and the ZnO films deposited with $Ar/O_2$=50/50 showed the excellent roughness value of $28.7{\AA}$.

• The Transactions of the Korean Institute of Power Electronics
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• v.6 no.5
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• pp.394-399
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• 2001

In this Paper, the development of the power supply for dry scrubber is discussed. 1500w, 100kHz power supply Is designed and tested. The main power stage is used for the FB PWM inverter with an LC filter in the secondary circuit. The operation characteristics of power supply are verified by simulation and experimental results.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.373-379
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• 2017

Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.

• Korean Journal of Heritage: History & Science
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• v.46 no.4
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• pp.4-23
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• 2013

Songsalli Ancient Tombs of Gongju consists of seven tombs. King Muryeong's tomb, the seventh tomb, is a brick chamber tomb discovered during the drainage works for the fifth and the sixth tombs in 1971. The excavation at the time focused on topographic surveys of the tomb entrance and the inside of the burial chamber as well as collection of the remains. The burial mount survey confirmed the status of some stone slab remaining and lime-mixed soil layers, but the survey did not examine the exterior structure of the whole tomb as the mounds were removed even more deeply. The excavation revealed damages to the bricks and mural damages due to moisture and fungus in the sixth and the seventh tombs. Between 1996 and 1997, Gongju National University conducted a comprehensive detailed survey of Songsalli Ancient Tombs including a geophysical survey, with an aim to identify the root causes of such degradation. Based on the results, repair took place in 1999 and the fifth, sixth and seventh tombs were placed under permanent conservation to conserve the cultural assets. General public is currently denied access. The purpose of this study was to conduct a three-dimensional resistivity and GPR surveys on the ground surface of the fifth, sixth and seventh tombs of Songsalli Ancient Tombs in order to understand the underground status after repair. The study also aimed to understand the thickness of all the tomb walls and exterior structure based on GPR inside King Muryeong's tomb. The exploration on the ground surface found that the three tombs and soil adjacent to the tombs had resistivity as low as 5 to $90{\Omega}m$, which confirmed that the soil water content was still as high as that prior to the repair work. Additionally, GPR found that the wall construction of the burial chamber of King Muryeong's tomb was approximately 70cm in thickness, while the structure was of 2B with two bricks, about 35cm in length, put together longitudinally(2B brick masonry). The pathway to the burial chamber was of the 2B structure just like that of the burial chamber walls, while its thickness was 80cm with an eyebrow-type arch connected to it. Also, the ceiling exterior appears to have an arch structure, identical to the shape inside.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.265-266
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• 2012

의료용 X-ray의 발전에 따라, 영상의 Digital화가 필요하게 되었다. Digital 영상 구현을 위해 다양한 형태의 영상 검출기가 개발되었다. 진단 영상의 조건으로는 구현 시간이 빠르고 해상도가 높아야 한다. 조건에 부합하는 Flat panel 형태의 직접방식과 간접방식 검출기의 개발이 주로 이루어졌으며, X-ray 검출 효율이 높고 공간 분해능이 높은 직접 방식의 검출기에 대한 연구가 활발히 진행되고 있다. 기존 직접방식의 X-ray 검출물질로는 A-Se이 이용되었다. 하지만 A-Se의 경우 낮은 원자번호로 인해 X-ray에 대한효율이 낮으며, 제조 공정과 수율의 문제로 인해 대체 물질의 개발과 공정의 개선이 필요하다. 선행 연구를 통해 X-ray 검출물질의 전기적 특성을 파악을 통해 대체 물질로서 가능성을 알아보았다. 본 연구에서는 기존에 제작된 X-ray 검출물질의 상부전극 증착 물질과 증착법 선정에 대한 연구이다. 선행 연구를 통해 선정된 X-ray 검출물질은 HgI2이다. 상, 하부 전극 선택에 있어 HgI2의 일함수 값(4.15eV)을 고려하여 그와 비슷한 일함수 값을 가진 물질로 전기적 장벽을 제거하여야 한다. 따라서, ITO (일함수 4.45eV)와 Au (일함수 5.1eV)을 선택하였다. ITO의 증착으로 이용된 방법으로는 on-axis 형태의 magnetron plasma sputtering을 이용하였으며, Au의 증착으로 이용된 방법은 Thermal evaporation deposition을 이용하였다. plasma sputtering에 이용된 타겟은 In2O3;SnO2 (조성비:90:10wt%)를 사용하였으며, Chamber의 크기는 넓이 456 ${\phi}cm^2$ 높이 25 cm이며, 로 target과 기판과의 거리는 15cm이다. plasma발생에 필요한 가스로는 Ar과 O2를 이용하였다. 고 진공 환경 조성에 이용된 장비로는 Rotary pump와 Turbo molecular pump이다. plasma 발생 전 진공도는 $3.2{\times}10^{-5}$ Torr, 발생 후 진공도는 $5.1{\times}10^{-5}$ Torr이다. plasma 환경이 조성된 후 증착 시간은 1분 30초이다. Au는 순도 99.999%를 이용하였으며, 이용된 금은 1회 증착에 0.3 g을 이용하였다. Chamber의 넓이 1,444 ${\phi}cm^2$이며, 높이 40 cm, boat와 기판과의 거리는 25 cm이다. 고 진공 환경 조성에 이용된 장비로는 Rotary pump와 diffusion pump를 이용하였다. Au의 승화 전 진공도는 $2.4{\times}10^{-5}$ Torr 증착 시 진공도는 $4.2{\times}10^{-5}$ Torr이며, Boat에 가해준 전압, 전류는 0.97 V, 47 A이며, 증착 시간은 1분 30초이다. 광도전체 층에 각각 증착된 전극의 저항을 통해 증착상태를 판단하였다. DMM (Digital Multimeter)로 1 cm 간격으로 측정된 표면의 저항은 ITO 약 $8{\Omega}$, Au 약 $3{\Omega}$으로 전극으로서 이용이 가능한 상태이다. Au와 ITO가 증착된 HgI2 시편의 전기적 특성은 기존에 이용된 X-ray 변환물질의 성능보다 우수하였다. 하지만 Au와 ITO가 각각 증착된 시편의 전기적 특성은 큰 차이를 보이지 않았다. ITO의 경우 진공 상태에서 이용되는 Gas가 이용되며, Plasma 환경 조성 유지가 어려운 점이 있다. Au전극은 증착 환경 조성이 쉽지만, 전극 물질 이용효율이 떨어지는 단점이 있다. 본 연구를 통해 X-ray 변환물질인 HgI2의 전극물질로 Au와 ITO의 이용가능성을 알아보았다. 두 전극으로 제작된 검출기의 성능은 큰 차이 없이 우수하였고, 전기적 장벽 상태가 낮아 높은 검출 효율을 보였다. 상대적으로 Au 전극의 공정이 간단하고 수율이 높다. 하지만 Au Source의 이용 효율이 떨어지는 단점이 있다. 본 연구의 결과를 통해 공정상의 유리함과 Source의 이용효율을 고려한 분석에 대한 연구가 필요할 것으로 사료된다.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.380-386
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• 2006

In this study, we had designed and fabricated the plasma focus device which can generate the light source for EUV(Extreme Ultra Violet) lithography. And we also have investigated the basic electrical characteristics of currents, voltages, resistance and inductance of this system. Voltage and current signals were measured by C-dot and B-dot probe, respectively. We applied various voltages of 1.5, 2, 2.5 and 3 kV to the anode electrode and observed voltages and current signals in accordance with various Ar pressures of 1 mTorr to 100 Torr in diode chamber. It is observed that the peak values of voltage and current signals were measured at 300 mTorr, where the inductance and impedance were also estimated to be 73 nH and $35 m{\Omega}$ respectively. The electron temperature has been shown to be 13000 K at the diode voltage of 2.5 kV and this gas pressure of 300 mTorr. It is also found that the ion density Ni and ionization rate 0 have been shown to be $N_i = 8.25{\times}10^{15}/cc$ and ${\delta}$= 77.8%, respectively by optical emission spectroscopy from assumption of local thermodynamic equilibrium(LTE) plasma.

• Current Photovoltaic Research
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• v.2 no.1
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• pp.14-17
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• 2014

In this paper, indium reduced materials for transparent conductive electrodes (TCE) were fabricated and their physical properties were evaluated. Two of materials, indium-zinc-tin oxide (IZTO) and aluminum (Al) were selected as TCE materials. In case of IZTO nanoparticles, composition ratios of In, Zn and Sn is 8:1:1 were synthesized. Size of the synthesized IZTO nanoparticles were less than 10 nm, and specific surface areas were about $90m^2/g$ indicating particle sizes are very fine. Also, the IZTO nanoparticles were well crystallized with (222) preferred orientation despite it was synthesized at the lowered temperature of $300^{\circ}C$. Composition ratios of In, Zn and Sn were very uniform in accordance with those as designed. Meanwhile, Al was deposited onto glass by sputtering in a vacuum chamber for mesh architecture. The Al was well deposited onto the glass, and no pore was observed from the Al surface. The sheet resistance of Al on glass was about $0.3{\Omega}/{\square}$ with small deviation of $0.025{\Omega}/{\square}$, and adhesion was good on the glass substrate since no pelt-off part of Al was observed by tape test. If the Al mesh is combined with ink coated layer which is consistent of IZTO nanoparticles, it is expected that the good and reliable metal mesh architecture for TCE will be formed.

• Journal of the Korean Vacuum Society
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• v.5 no.4
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• pp.284-291
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• 1996

We have implemented a fast pressure control system for the transport chamber of a high vacuum cluster tool for advance semiconductor fabrication and evaluated its performance. To overcome the typically slow response of mass flow controllers, the modified experimental method is used very effectively to optimize the pressure control procedure. We successfully obtained quite fast pressure control by adjusting the starting time and eht tuning constants by the Ziegler-Nichols method. In the transport pressure $10\times 10^{-5}$ torr, actual pressure control starts from 4 sec after an initial gas load of 2.1 sccm. As a result, optimum conditions for the tuning constants are the rise rate of 0.02 torr/sec, the lag time of 0.15 sec, and the sampling period of 0.5 sec. Then the settling time is about 9 sec within about $\pm$0.5% for the referenced value. This settling time is enhanced above 75 percents in comparison with conventional experimental method. To account for the experimental effects observed, a theoretical model was developed. This experimental result has a tendency to fit with the theoretical result of $\omega$=-1.0.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.82-82
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• 2018

광전소자용 투명전극으로 적용하기 위한 초박형 Al 박막에 대해서 기초연구를 수행하였다. 증착 전 챔버(chamber) 내 기저압력은 $3{\times}10^{-7}Torr$이하로 유지하였으며 Ar 불활성 기체의 유입을 통해 작업압력을 $1{\times}10^{-2}Torr$로 상승시켜 증착을 실시하였다. DC 마그네트론 스퍼터링법을 이용하여 유리기판상에 Al 박막의 증착을 실시하였으며, 박막의 두께가 3-12 nm인 Al 박막을 각각 형성하였다. 두께가 7 nm 일 때 면저항은 $135{\Omega}/{\square}$로 측정되었고 7 nm 이상인 두께의 박막은 두께가 증가할 때 면저항이 점진적으로 감소되는 경향을 확인할 수 있었다. 두께가 10 nm인 박막의 측정된 면저항은 $13.1{\Omega}/{\square}$로 두께 7 nm인 박막과 비교하였을 때 약 10배의 차이를 확인할 수 있었다. 두께 6 nm 이하인 박막은 면저항 측정이 불가능하였는데 이는 SEM 분석 결과, 연속박막을 이루지 못 하였기 때문이라고 결론을 내릴 수 있었으며, 두께 12 nm인 박막까지 완전한 연속박막이 형성되지 않았다. 각각의 박막에서 입자의 크기는 선 교차법(line intercept method)을 이용하여 시편당 평균 120개의 입자에 대한 평균값을 측정하였으며, 이론적으로 예상할 수 있는 바와 같이 두께가 증가할수록 입자크기도 비례하여 증가하게 되는 것을 확인할 수 있었다. 가시광선 파장영역 내 투과도의 경우, 3 nm 두께에서 평균 80% 이상의 투과도가 측정된 데 반하여, 4-5 nm 두께에서 평균 60%로 급격하게 감소되기 시작하며 그 이후, 두께 증가에 따라 투과도가 점진적으로 감소되는 경향을 확인할 수 있었다. 또한 Al 박막은 시간의 경과에 따른 표면의 산화가 진행되어 기존에 측정된 면저항보다 10-60%의 면저항이 증가하였는데 이는 두께가 얇을수록 더 산화의 영향을 많이 받기 때문에 나타난 결과로 보인다. 추후 산화방지막 및 빛반사방지막 층을 초박형 Al박막과 함께 Oxide/Metal/Oxide 구조로 형성하여 위와 같은 현상들을 해결하고 박막물성의 증진을 통해 투명전극에 적용을 목표로 한다.

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.202-210
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• 2001

Spin dependent tunneling (SDT) junction devices of Ta/NiFe/Ta/NiFe/FeMn/NiFe/AlOx/CoFe/NiFe/Al with in-situ naturally oxidized Al barrier were fabricated using ion beam deposition and dc sputtering in UHV chamber of 10$^{-9}$ Torr. The maximum tunneling magnetoresistance (TMR) and the product resistance by junction (R$_{j}$ A) are 16-17% and 50-60 $\Omega$${\mu}{\textrm}{m}$$^2$, respectively. The values of TMR and (R$_{j}$ A) with field annealing were slightly increased. The TMR and (R$_{j}$ A) dependence versus the junction area size was observed. These results were explained by using sheet resistance effect of bottom electrode and spin channel effects.