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S. C. Kwon, S. T. Kim, D. V. Kim, J. K. Lee, S. J. Seo, T. S. Yoon, H. T. Jeong, 2018, Mechanical properties of OFC copper fabricated by multi-axial diagonal forging(MADF), Trans. Mater. Process., Vol. 27, No. 4, pp. 250-256./
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S. C. Kwon, S. T. Kim, D. V. Kim, J. K. Lee, S. J. Seo, T. S. Yoon, H. T. Jeong, 2018, Mechanical properties of OFC copper fabricated by multi-axial diagonal forging(MADF), Trans. Mater. Process., Vol. 27, No. 4, pp 250-256/
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K. S. Lee, G. Y Kim, Y. S. Ahn, 2018, Study on the Optimum Design of the Insert Ring and Shrunk Ring of the Cold Forging Die for an Automotive Wheel Nut, Trans. Mater. Process. Vol. 27, No. 3, pp. 165-170/
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B. S. Kwak, M. J. Yoon, J. Y. Jeon, B. S. Kang, T. W. Ku, 2018, Design of Blank Support Structure for Large and Curved Thick Plate Forming, Trans. Mater. Process., Vol. 27, No. 1, pp. 18-27./
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P. S. Ko et. al., 2018, Process Map for Improving the Dimensional Accuracy in the Multi-Stage Drawing Process of Rectangular Bar with Various Aspect Ratio, Trans. Mater. Process., Vol.27, No.3, pp.154-159./
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J. M. Lee, J. H. Jeong, M. S. Chon, H. W. Lee, 2018, Analysis on Fitting Characteristics of a Metal-Sealing Pipe of the Hydrogen Fuel Tank for FCEV, Trans. Mater. Process., Vol. 27, No. 1, pp. 54-59./
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I. K. Lee, S. Y. Lee, D. H. Kim, J. W. Lee, S. K. Lee, 2018, Wire Drawing Process Design for Fine Rhodium Wire, Trans. Mater. Process. Vol. 27, No. 4, pp. 244-249./
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S. T. Kim, S C. Kwon, D. V. Kim, S. Lee, S. H. Choi, H. T. Jeong, 2018, Microstructural Changes of OFC According to the Processing Number of Multi-Axial Diagonal Forging (MADF), Trans. Mater. Process, Vol. 27, No. 6, pp. 347-355./
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S. C. Kwon, S. T. Kim, D. V. Kim, J. K. Lee, S. J. Seo, T. S. Yoon, H. T. Jeong, 2018, Mechanical Properties of OFC Copper Fabricated by Multi-Axial Diagonal Forging (MADF), Trans. Mater. Process, Vol. 27, No. 4, pp. 250-256./
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M. S. Joun, W. J. Chung, S. W. Jeong, 2017, Finite element prediction of deformation of material due to springback after material removal of a forging, Trans. Mat. Proc., Vol. 26, pp205-209./
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