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S.-W. Seo, G.-S. Kim : The Film Property and Deposition Process of TSV Inside for 3D Interconnection, Journal of the Microelectronics & Packaging Society, 15-3 (2008) 47-52 (in Korean)/
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| 2 |
김종연, 유진, '전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구', 한국마이크로전자 및 패키징학회, v.15, no.1, pp. 33-37, 2008/
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| 3 |
Kim, N. W., Kim, K. W., and Sin, H.-C., 2007, "A Viscoelasitc Finite Element Analysis of Thermal Nanoimprint Lithography Process," Journal of the Microelectronics & Packaging Society, Vol. 14, No. 4, pp. 1-7./
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| 4 |
S.-E. Lee and J.-H. Lee : Copper Via Filling Using Organic Additives and Wave Current Electroplating, Journal of Microelectronics & Packaging Society, 14-3 (2007) 37-42 (in Korean)/
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S.H. Park, T.S. Oh, Y.S. Eum and J.T. Moon : Interconnection Processes Using Cu Vias for MEMS Sensor Packages, Journal of the Microelectronics & Packaging Society, 14-4 (2007) 63-69 (in Korean)/
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| 6 |
J.G. Jang, H.W. Kim, “Fabrication and Characterization of Yellow OLED using GDI602:Rubrene(10%) Material(in Korean),” J. of Microelectronics & Packaging Soc., 13 [4] 71-5 (2006)./
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