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J.W. Yoon, H.S. Chun and S.B. Jung : Reliability evaluation of Au-20Sn flip-chip solder bump fabricated by sequential electroplating method with Sn and Au, Materials Science and Engineering A, 473 (2008), 119-125/
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| 2 |
D.Q. Yu, H. Oppermann, J. Kleff and M. Hutter : Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow, Scripta Materialia, 58 (2008), 606-609/
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| 3 |
J.W. Kim, Y.C. Lee, S.B. Jung : Reliability of conductive adhesives as a Pb-free alternative in flip-chip applications, Journal of Electronic Materials, 37, (2008), 9-16/
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| 4 |
박재현,정재필,정승부, 솔더볼 신뢰성 표준화 연구, 2008, 기술표준원/
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| 5 |
Y. Cao, X. Li and X. Zeng : Frequency characteristics of the MIM thick film capacitors fabricated by laser micro-cladding electronic pastes, Materials Science and Engineering B, 150-3 (2008), 157-162/
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| 6 |
H. J. Park, D. C. Kim, M. J. Kang and S. Rhee : Optimization of the wire feed rate during pulse MIG welding of Al sheets, Journal of Achievements in Materials and Manufacturing Engineering, 27-1 (2008), 83-86/
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| 7 |
Y. J. Kwon, I. Shigematsu and N. Saito: Mater. Lett. 62(2008), 4458-4460/
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| 8 |
H. Badarinarayan, Q. Yang, F. Hunt and K. Okamoto : Effect of Pin Geometry on the Joint Strength of Friction Stir Spot Welded Aluminum Alloys, Proceeding 7th International Symposium on Friction Stir Welding Conference, Kobe, Japan, 2008/
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| 9 |
Koji Tanaka, Masaki Kumagai and Hideo Yoshida : Dissimilar Joining of Aluminum Alloy and Steel Sheets by Friction Stir Spot Welding, Proceeding 7th International Symposium on Friction Stir Welding Conference, Kobe, Japan, 2008/
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| 10 |
Ryoji Ohashi, Mitsuo Fujimoto, Shinji Koga, Rinsei Ikeda and Moriaki Ono : Friction Spot Joining of Steel Sheets with Silicon Nitride Tool, Proceeding 7th International Symposium on Friction Stir Welding Conference, Kobe, Japan, 2008/
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