| 1 |
R. Ghaffarian, and W. Engelmaier et al, The Institute for Interconnecting and Packaging Electronic Circuit : IPC 9701 Performance Test Methods and QuaIification Requirements for Surface Mount Solder Attachments, the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPC, Northbrook IL (2002)/
|
|
| 2 |
K. Kunishige, N. Yamaguchi, T. Taka and N. Nagao : SAE Tech. Pap. 830632. PA, USA (1983)/
|
|
| 3 |
R.Bosch Gmbh, US Patent 4855017 and 4784720, (1994)/
|
|
| 4 |
JSA :JIS Z 3198 Test methods for lead free solders (2003)/
|
|
| 5 |
S.-J. Lee, M.T. Lusk and Y.-K. Lee : Conversional Model of Transformation Strain to Phase Fraction in Low Alloy Steels, Acta Materialia, 55 (2007), 875-882/
|
|
| 6 |
H. P. Wu, X. J. Wu, M. Y. Ge, G. Q. Zhang, Y. W. Wang and J. Jiang, Composites Sci. and Technol., 67 (2007), 1182/
|
|
| 7 |
J. Kolbe, A. Arp, F. Calderone, E. M. Meyer, W. Meyer, H. Schaefer and M. Stuve, Microelec, Relia., 47 (2007), 331/
|
|
| 8 |
J.W. Kim and S.B. Jung : Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process, Materials Science and Engineering A, 452-453, (2007) 267-272/
|
|
| 9 |
J.W. Yoon, H.S. Chun and S.B. Jung : Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating, Journal of Materials Research, 22 (5), (2007)/
|
|
| 10 |
P. Peyre, G. Sierra, F. Deschaux-Beaume, D. Stuart and G. Fras : Generation of aluminium-steel joints with laser-induced reactive wetting, Materials Science and Engineering A444 (2007) 327-338/
|
|