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1 KMCC. "Lead free soldering 신뢰성보증기술” 일본 연수자료. 2003/ View Article
2 산업자원부 기술표준원"무연솔더볼”의 신뢰성규격(RS D0015). 2003./ View Article
3 “EU의 환경관련 무역규제 현황과 대응방안.. 대한상공회의소보도자료. 2003.0 1.14/ View Article
4 C.-H. Kim and S‘ J. Na A Study on HorizontalFillet Welding by Using Rotating Arc -Part 1Relation between Welding Parameters and WeldBead Shape. Journal of KWS. 21-3(2003) .296-301(i n Korean)/ View Article
5 Ning-Cheng Lee. “Reflow soldering processes andtroubleshooting SMT. BGA. CSP and Flip chiptechnologies". 2002. pp.197./ View Article
6 강춘식,정재필, “마이크로접합". 2002. pp79/ View Article
7 Ja-Myeong Koo. Dae-Up Kim and Seung•Boo Jung.’‘CHARACTERIZATION AND ANALYSIS OF SHEARTEST WITH TESTING CONDITIONS ON BGAPACKAGE". IWC-KOREA 2002. 慶州. pp.463/ View Article
8 박재현, “무연솔더볼의 신뢰성 평가기법 개발!' RIST 과제 결과보고서. 2002./ View Article
9 Minhyo Shin. Changhee Lee. Taiwoung Kim. HeedongPark A study on formation of imperfections inCWC(갱 Laser weld of diamond saw blade. Proceedingsof IWC-Korea 2002 Oct. . 639-643/ View Article
10 Minhyo Shin. Changhee Lee. Taiwoung Kim. HeedongPark Formation mechanism of cavity in the C02Laser fusion zone between sintered Fe-base segmentand mild steel sh와1k of diamond saw blade. Proceedingsof the 2002 Spring annual meeting of KWS.232-235 (in Korean)/ View Article