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[Search Query: (is02:"2008")AND(is03:"2008")AND(st02:"DHOJBN")AND(st03:"DHOJBN")]

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학술지
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1 J.M. Koo, J.W. Kim, J.W. Yoon, B.I. Noh, C.Y. Lee, J.H. Moon, C.D. Yoo and S.B. Jung: Ultrasonic Bonding Technology for Flip Chip Packaging, Journal of KWS, 26-1 (2008), 31-36 (in Korean)/   KOI   DOI   Ndsl View Article
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