| 1 |
Kim, Y., and Kwon, W., 2011, "Determination of Optimal Cutting Conditions in Milling Process using Multiple Design of Experiments Technique," KSMTE, Vol. 20, No. 3, pp. 232-238./
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| 2 |
Hwang, W. C., Sim, J. K., and Yang, I. Y., 2011, "A Study on the Collapse Characteristics of Al/CFRP Square Structural Member for Light Weight," Journal of the Korean Society of Manufacturing Technology Engineers, Vol. 20, No. 3, pp. 219-224./
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| 3 |
Han, M. S., and Cho, J. U., 2011, "Study on Durability by Structural Analysis of Bulldozer," Transactions of KSMTE, Vol. 20, No. 3, pp. 239-244./
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| 4 |
Han, M. S., and Cho, J. U., 2011, "Strength and Fatigue Analysis of Universal Joint," Transactions of KSMTE, Vol. 20, No. 4, pp. 427-433./
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| 5 |
Im, K. H., Zhang, G. L., Choi, S. R., Ye, C. H., Ryu, J. S., Lim, S. H., Han, M. G., and Hsu, D. K., 2011, "One-Sided Nondestructive Evaluation of CFRP Composites By Using Ultrasonic Sound," Journal of the Korean Society of Machine Tool Engineers, Vol. 20, No. 1, pp. 47-52./
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| 6 |
Shin, D. S., and Chung S. C., 2011, "2.5D Quick Turnaround Engraving System through Recognition of Boundary Curves in 2D Images," Korean Society of Manufacturing Technology Engineering, Vol. 20, No. 4, pp. 369-375./
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| 7 |
Kim, S. K., and Lim, E. M., 2011, "Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips," Korean Society of Manufacturing Technology Engineers, Vol. 20, No. 5, pp. 559-563./
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| 8 |
Kim, S. K., 2011, "Board-Level Drop Analyses having the Flip Chips with Solder balls of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu," KSMTE, Vol. 20, No. 2, pp. 193-201./
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| 9 |
Kim, S. K., and Lim, E. M., 2011, "Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips," KSMTE, Vol. 20, No. 5, pp. 559-563./
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| 10 |
Kwon, H. H., J., Song, S. E., and Kim, O. S., 2011, "Cold Forging Process Finite Element Analysis of the Unified Universal Shaft Joint for the Automobile," J. of the KSMTE, Vol. 20, No. 5, pp. 582-588./
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