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1 Hyeon-Jin Cho, Heung-Ju Kim, Chang-Keun Cheon, Woong-Seong Chang, Kook-Soo Bang, 'Evaluation of Friction Spot Joining Weldability of Al Alloys for Automotive', Journal of KWS, Vol. 24, No. 1, pp. 50-55, 2006/   KOI View Article
2 Heung-Ju Kim, Chang-Keun Cheon, Sook-Hwan Kim, Woong-Seong Chang, 'Microstructures and Mechanical Properties of the Friction Stir Welded Dissimilar Joint of AZ31B/A6061', Journal of KWS, Vol. 24, No. 4, pp. 6-10, 2006/   KOI View Article
3 Yun-Mo Yeon, Chang-Yong Lee, Won-Bae Lee, Seung-Boo Jung, Keun Song, 'Joint Characteristics of Spot Friction Stir Welded A 5052 Alloy Sheet', Journal of KWS, Vol. 24, No. 1, pp. 71-76, 2006/   KOI View Article
4 D.G. Kim, J.W. Kim, S.S. Ha, J.P. Jung, Y.E. Shin, J.H. Moon, and S.B. Jung: Fabrication of through-hole interconnect in Si wafer for 3D package, Journal of KWS, 24-2 (2006), 172-178 (in Korean)/   KOI View Article
5 J.W. Kim, D.G. Kim, W.C. Moon, J.H. Moon, C.C. Shur and S.B. Jung: Application of MEMS technology in microelectronic packaging, Journal of KWS, 24-2 (2006), 142-149 (in Korean)/   KOI View Article
6 I.S. Kim, K.S. Chon, J.S. Son, J.H. Seo, H.H. Kim and J.Y. Shim : A study on Monitoring for process parameters using isotherm radii, Journal of KWS, 24-5 (2006), 37-42. (in Korean)/   KOI View Article
7 Lee, S. M., Kim, J. B. and Na, S. J., 'A study on the resistance welding of metallic sandwich panel : Part 1-Determination of process parameters,' The Korean welding and joining Society, Vol. 23, No. 6, pp. 49-54, 2005/   KOI View Article
8 Strength Commission of Welded Structure, Standardization for Temperature Distribution Prediction of the Arc Weld using FEA. Journal of KWS, 23-6 (2005), 497-503 (in Korean)/ View Article
9 Commission of Design, Analyses and Structural Strength of Welded Structures : Standardization for Temperature Distribution Prediction of the Arc Weld using FEA, Journal of KWS, 23-6 (2005), 1-7 (in Korean)/   KOI View Article
10 J. -H. Kim, K. -H. Shin : Analysis of Transmission Infrared Laser Bonding for Polymer Micro Devices, Journal of KWS, 23-5 (2005), 463-468/   KOI View Article