| 1 |
D.G. Kim, J.W. Kim, S.S. Ha, J.P. Jung, Y.E. Shin, J.H. Moon, and S.B. Jung: Fabrication of through-hole interconnect in Si wafer for 3D package, Journal of KWS, 24-2 (2006), 172-178 (in Korean)/
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| 2 |
J.W. Kim, D.G. Kim, W.C. Moon, J.H. Moon, C.C. Shur and S.B. Jung: Application of MEMS technology in microelectronic packaging, Journal of KWS, 24-2 (2006), 142-149 (in Korean)/
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| 3 |
I.S. Kim, K.S. Chon, J.S. Son, J.H. Seo, H.H. Kim and J.Y. Shim : A study on Monitoring for process parameters using isotherm radii, Journal of KWS, 24-5 (2006), 37-42. (in Korean)/
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| 4 |
Strength Commission of Welded Structure, Standardization for Temperature Distribution Prediction of the Arc Weld using FEA. Journal of KWS, 23-6 (2005), 497-503 (in Korean)/
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| 5 |
Commission of Design, Analyses and Structural Strength of Welded Structures : Standardization for Temperature Distribution Prediction of the Arc Weld using FEA, Journal of KWS, 23-6 (2005), 1-7 (in Korean)/
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| 6 |
J. -H. Kim, K. -H. Shin : Analysis of Transmission Infrared Laser Bonding for Polymer Micro Devices, Journal of KWS, 23-5 (2005), 463-468/
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| 7 |
W. S. Hong, S. B. Jung and K. B. Kim : Analysis Method of Metallic Ion Migration, Journal of KWS, 23-2 (2005), 138-146 (in Korean)/
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| 8 |
J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean)/
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| 9 |
T-W. Park, J-H. Cho and S-J. Na : A study on laser joining of low carbon steel and aluminum alloy-part I: process parameters, Journal of KWS 23-5 (2005) 25-29/
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| 10 |
C.H. Ye, B.K. Lee, W.Y. Song, I.S. Oh, C.Y. Kang : Journal of KWS, 23-6(2005), 99-105 (in korea)/
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