| 1 |
Dae-Up Kim, "A study on the formation mechanism of microconstituents in brazed joint of duplex stainless steel and Cr-Cu alloy", J. Kor. Welding Soc., 19, 2001, pp.534/
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| 2 |
Li, J. S., Lim, J. K. and Kim, Y. J. 2001, 'Stress Distribution and Strength Evaluation of Adhesive Bonded Single-lap Joints,' The Korean Welding Society, Vol. 19, No 3, pp. 91-96/
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| 3 |
Lim, J. K., Li, J. S. and Lee, H. J., 1999, 'A Study on the Evaluation of the Environmental Adhesive-Strength for Adhesively Bonded Joints,' Proc. of the 1999 Autumn Annual Meeting of Korean Welding Society, pp. 255-258/
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| 4 |
김철만, 정현호, 김형식, 홍성호, 김우식 1999, '용착금속의 파괴인성에 미치는 불균일 미세조직의 영향,' 대한용접학회지, Vol. 17, No.2, pp. 36-43/
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| 5 |
Shin, Y. E. and Kim, J. M., 1999, 'A Study on the Life Prediction and Quality Improvement of Solder Joint in IC Package,' Journal of KWS, Vol. 17, No. 1, pp. 124-132/
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| 6 |
이원, 윤인식, 1998, '초음파와 신경망을 이용한 오스테나이트계 스테인리스강 304 용접부의 결함 검출 및 평가,' 대한용접학회지, 제16권, 제3호, pp. 192-201/
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| 7 |
Shim, Y. L., 1997, 'Residual Stress, Distortion, and Fracture Analysis of Welded Structures using Finite Element Method,' Journal of KWS, Vo.. 15, No. 2, Feb., pp. 15-25/
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| 8 |
Shim. Y. L., 1997, 'Residual Stress, Distortion, and Fracture Analysis of Welded Structures using Finite Element Method,' Journal of KWS, Vol. 15, No. 2, pp. 15-25/
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| 9 |
A Study on the Life Prediction and Quality Improvement of Solder Joint in IC Package/
[[Y.E.Shin;J.M.Kim]] / null
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| 10 |
Current Status of Tailored Blank Technology/
[[Jong Bong Lee;Hui Dong Park]] / null
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