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http://dx.doi.org/10.12989/amr.2017.6.2.185

Analytical modeling enables explanation of paradoxical behaviors of electronic and optical materials and assemblies  

Suhir, Ephraim (Department of Mechanical and Materials Engineering, Portland State University)
Publication Information
Advances in materials Research / v.6, no.2, 2017 , pp. 185-220 More about this Journal
Abstract
Merits, attributes and challenges associated with the application of analytical modeling in electronics and photonics materials science are addressed, based mostly on the author's research during his tenure with Bell Labs, University-of-California, Portland State University, and small business innovative research (SBIR) ERS Co., USA. The emphasis is on practically important, yet often paradoxical, i.e., intuitively non-obvious, material behaviors. It is concluded that when material reliability is crucial, ability to effectively quantify it is imperative, and that analytical modeling is the most suitable, although never straightforward, technique to understand, explain and quantify material behaviors, especially in extreme, extraordinary and paradoxical situations.
Keywords
analytical modeling; thermal stresses; assemblies comprised of dissimilar materials; electronics and photonics packaging;
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38 Suhir, E. (1998), "(c) Bending stress in an optical fiber interconnect experiencing significant ends offset", Proceedings of the MRS Symposium, 531.
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55 Suhir, E., Yi, S., Khatibi, G. Nicolics, J. and Lederer, M. (2016), "Semiconductor film grown on a circular substrate: Predictive modeling of lattice-misfit stresses", JMSE, 27(9), 9356-9362.
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68 Suhir, E. (2002), "(c) Could shock tests adequately mimic drop test conditions?", ASME J. Electr. Pack., July.
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82 Suhir, E. (2011), "(g) Analysis of a pre-stressed bi-material accelerated life test (ALT) specimen", ZAMM, 91(5), 371-385.   DOI
83 Suhir, E. and Shakouri, A. (2012), "Assembly bonded at the ends: Could thinner and longer legs result in a lower thermal stress in a thermoelectric module (TEM) design?", ASME J. Appl. Mech., 79(6), 061010.   DOI
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85 Suhir, E., Bechou, L. and Levrier, B. (2013), "Predicted size of an inelastic zone in a ball-grid-array assembly", ASME J. Appl. Mech., 80, 021007.   DOI
86 Suhir, E. (1986), "(b) Calculated thermally induced stresses in adhesively bonded and soldered assemblies", Proceedings of the International Symposium on Microelectr., ISHM, Atlanta, Georgia, October.
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90 Suhir, E., Bubel, G.M. and Tuminaro, R.D. (1991), "Predicted curvature of the glass fiber from the measured curvature of its coating", IEEE/OSA J. Lightw. Technol., 9(6), 701-708.   DOI
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92 Suhir, E. (1991), "(b) Nonlinear dynamic response of a flexible printed circuit board to shock loads applied to its support contour", Proceedings of the 41st Conference on ECTC, May.
93 Suhir, E. (1992), "(a) Response of a flexible printed circuit board to periodic shock loads applied to its support contour", ASME J. Appl. Mech., 59(2), 253-259.   DOI
94 Suhir, E. (1996), "(b) Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics", J. Sol. Struct., 33(24), 3627-3642.   DOI
95 Suhir, E. (1995), "(a) How compliant should a die-attachment be to protect the chip from substrate (card) bowing?", ASME J. Electr. Pack., 117(1), 88-92.   DOI
96 Suhir, E. (1995), "(b) Shock protection with a nonlinear spring", IEEE CPMT Trans. Adv. Pack. Part B, 18(2), 430-437.
97 Suhir, E. (1996), "(a) Dynamic response of a one-degree-of-freedom linear system to a shock load during drop tests: Effect of viscous damping", IEEE CPMT Trans. Part A, 19(3), 435-440.
98 Suhir, E. (1996), "(c) Flex circuit vs regular substrate: Predicted reduction in the shearing stress in solder joints", Proceedings of the 3rd International Conference on Flexible Circuits FLEXCON 96, San-Jose, California, U.S.A., October.
99 Suhir, E. and Weld, J. (1997), Electronic Package with Reduced Bending Stress, US Patent #5,627,407.
100 Suhir, E. (1997), "(a) Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?", IEEE CPMT Trans. Part A, 20(4), 513-517.
101 Suhir, E., Bechou, L. and Nicolics, J. (2015), "Thermal stress in an electronic package sandwiched between two identical substrates", Proceedings of the IEEE Aerospace Conference, Big Sky, Montana, March.
102 Suhir, E., Bensoussan, A. and Nicolics, J. (2015), "(b) Bow-free pre-stressed ALT specimen", Proceedings of the SAE Conference, Seattle, U.S.A., September.
103 Suhir, E., Khatibi, G. and Nicolics, J. (2015), "Predictive modeling of the lattice-misfit stresses in GaN film grown on a circular substrate", Proceedings of the MPPE Conference, Leoben, Austria, November.
104 Zhou, C.Y., Yu, T.X. and Suhir, E. (2009), "Design of shock table tests to mimic real-life drop conditions", IEEE CPMT Trans., 32(4), 832-837.
105 Suhir, E. and Reinikainen, T. (2008), "On a paradoxical situation related to lap shear joints: Could transverse grooves in the adherends lead to lower interfacial stresses?", J. Appl. Phys. D, 41.
106 Suhir, E. and Arruda, L. (2009), "The coordinate function in the problem of the nonlinear dynamic response of an elongated printed circuit board (PCB) to a drop impact applied to its support contour", Eur. J. Appl. Phys., 48(2),
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109 Suhir, E. (1992), "(c) Mechanical behavior and reliability of solder joint interconnections in thermally matched assemblies", Proceedings of the 42nd Conference on ECTC, May.
110 Suhir, E. (1992), "(b) Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards used in avionic packaging", J. Sol. Struct., 29(1), 41-55.   DOI
111 Suhir, E. (1992), "(c) Predicted bow of plastic packages of integrated circuit (IC) devices", Proceedings of the 50th SPE Conference, Detroit, Michigan, May.
112 Suhir, E. (1992), "(d) The effect of the nonlinear behavior of the material on two-point bending in optical glass fibers", ASME J. Electr. Pack., 114(2), 246-250.   DOI
113 Suhir, E. (1992), "(e) Elastic stability, free vibrations, and bending of optical glass fibers: Effect of the nonlinear stress-strain relationship", Appl. Opt., 31(24), 5080-5085.   DOI
114 Suhir, E. (1993), "Could the curvature of an optical glass fiber be different from the curvature of its coating?", J. Sol. Struct., 30(17), 2425-2435.   DOI
115 Suhir, E. and Shakouri, A. (2013), "Predicted thermal stresses in a multi-leg thermoelectric module (TEM) design", ASME J. Appl. Mech., 80.
116 Suhir, E. and Bechou, L. (2013), "Saint-Venant‟s principle and the minimum length of a dual-coated optical fiber specimen in reliability (proof) testing", Proceedings of the ESREF Conference, Arcachon, France.
117 Suhir, E. (2013), "(a) Structural dynamics of electronics systems", Mod. Phys. Lett. B, 27(7), 1330004.   DOI
118 Suhir, E. (2013), (b) Thermal Stress in a Tri-Material Assembly with Application to Si-Based Photovoltaic Module (PVM), Encyclopedia of Thermal Stresses, Springer, New York, U.S.A.
119 Suhir, E. (2015), "(a) Analytical predictive modeling in fiber optics structural analysis: Review and extension", SPIE, San-Francisco, U.S.A., February.
120 Suhir, E., Ghaffarian, R. and Nicolics, J. (2015), "Could application of column-grid-array technology result in inelastic-strain-free state-of-stress in solder material?", JMSE, 26(12), 10062-10067.
121 Suhir, E. (2015), "(b) Analytical stress modeling for TSVs in 3D packaging", Semi-Term, San-Jose, March.
122 Suhir, E. (2015), "(c) Predicted Thermal and Lattice-Mismatch Stresses, Handbook of Crystal Growth, Elsevier, New York, U.S.A.
123 Suhir, E. (2015), "(d) Stress related aspects of the physics of GaN material growth", SPIE, San-Francisco, U.S.A., February.
124 Suhir, E. (2015), "(g) Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?", Eur. Phys. J. Appl. Phys., 71(3), 31301.   DOI
125 Suhir, E. (2015), "(h) Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with low modulus solder at its ends", JMSE, 26(12), 9680-9688.
126 Suhir, E., Ghaffarian, R., Bechou, L. and Nicolics, J. (2016), "Column-grid-array (CGA) technology could lead to a highly reliable package design", Proceedings of the IEEE Aerospace Conference, Big Sky, Montana, U.S.A., March.
127 Suhir, E. (2000), "(b) Predicted stresses in, and the bow of, a circular substrate/thin-film system subjected to the change in temperature", J. Appl. Phys., 88(5), 2363-2370.   DOI
128 Suhir, E. (1999), "(b) Thermal stress failures in microelectronics and photonics: Prediction and prevention", Fut. Circ. Int., 5.
129 Suhir, E. (2000), "(a) Microelectronics and photonics-the future", Microelectr. J., 31, 11-12.
130 Timoshenko, S.P. (1925), "Analysis of bi-metal thermostats", J. Opt. Soc. Am., 11.
131 Suhir, E. (2000), "(c) Adhesively bonded assemblies with identical non-deformable adherends and "piecewise continuous" adhesive layer: Predicted thermal stresses and displacements in the adhesive", J. Sol. Struct., 37.
132 Suhir, E. (2000), "(d) Optical fiber interconnect with the ends offset and axial loading: What could be done to reduce the tensile stress in the fiber?", J. Appl. Phys., 88(7), 3865-3871.   DOI
133 Suhir, E. (2001), (a) Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly, US Patent #6,239,382.
134 Suhir, E. (2001), "(b) Thermo-mechanical stress modeling in microelectronics and photonics", Electr. Cool., 7(4).
135 Suhir, E. (2001), "(c) Analysis of interfacial thermal stresses in a tri-material assembly", J. Appl. Phys., 89(7), 3685-3694.   DOI
136 Suhir, E. (2001), "(d) Thermal stress in a polymer coated optical glass fiber with a low modulus coating at the ends", J. Mater. Res., 16(10), 2996-3004.   DOI
137 Suhir, E. (2001), "(e) Thermal stress in a bi-material assembly adhesively bonded at the ends", J. Appl. Phys., 89(1).
138 Suhir, E. (2002), (a) Bi-material Assembly Bonded at the Ends and Fabrication Method, US Patent #6,460,753.
139 Suhir, E., Morris, J., Wang, L. and Yi, S. (2016), "Could the dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?", JMSE, 27(7), 6697-6702.
140 Suhir, E. (2016), "(a) Predicted lattice-misfit stresses in a gallium-nitride (GaN) film", Proceedings of the International Rel. Phys. Symposium, Pasadena, California, U.S.A.
141 Suhir, E. (2016), "(b) Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: Optimized stress relief", JMSE, 27(5), 4816-4825.
142 Suhir, E. (2016), "(c) Expected stress relief in a bi-material inhomogeneously bonded assembly with a lowmodulus-and/or-low-fabrication-temperature bonding material at the ends", JMSE, 27(6), 5563-5574.
143 Suhir, E. (2016), "(d) Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: Optimized stress relief", JMSE, 27(7), 4816-4825.
144 Suhir, E. (2016), "(e) Analytical modeling occupies a special place in the modeling effort", J. Phys. Math., 7(1).
145 Suhir, E. (2016), "(f) How many peripheral solder joints in a surface mounted design are expected to experience inelastic strains?", J. Electr. Mater., in Print.
146 Suhir, E. (2016), "(g) Probabilistic palmgren-miner rule, with application to solder materials experiencing elastic deformations", JMSE, in Print.
147 Sun, B., Fan, X.J., Qian, C. and Zhang, G.Q. (2016), "PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers", IEEE Trans. Industr. Electr., 63(11), 6726-6735.   DOI
148 Sun, B., Fan, X.J., Ye, H.Y., Fan, J.J., Qian, C., Van Driel, W.D. and Zhang, G.Q. (2017), A Novel Lifetime Prediction for Integrated LED Lamps by Electronic-Thermal Simulation, Reliability Engineering & System Safety,163, 14-21.   DOI
149 Suhir, E. and Reinikainen, T. (2009), "(b) Nonlinear dynamic response of a "flexible-and-heavy" printed circuit board (PCB) to an impact load applied to its support contour", J. Appl. Phys. D, 42(4), 045506.   DOI
150 Suhir, E. and Reinikainen, T. (2009), "(a) Interfacial stresses in a lap shear joint (LSJ): The transverse groove effect (TGE)", JSME J. Sol. Mech. Mater. Eng., 3(6).
151 Suhir, E. (2009), "(a) Analytical thermal stress modeling in electronic and photonic systems", ASME AMR, 62(4).
152 Suhir, E. (2009), "(b) On a paradoxical situation related to bonded joints: Could stiffer mid-portions of a compliant attachment result in lower thermal stress?", J. Sol. Mech. Mater. Eng., 3(7).
153 Suhir, E. (2009), "(c) Thermal stress in a bi-material assembly with a "piecewise-continuous" bonding layer: Theorem of three axial forces", J. Appl. Phys. D, 42.
154 Suhir, E. (2009), "(d) Stretchable electronics: Does one need a good thermal expansion match between the Si die and the plastic carrier?", Proceedings of the 59th Conference on ECTC.
155 Suhir, E. (2010), "(a) Predicted stresses in die-carrier assemblies in stretchable electronics: Is there an incentive for using a compliant bond?", ZAMM, 10.
156 Suhir, E. (2009), "(e) Stretchable electronics: Predicted thermo-mechanical stresses in the die", Volume Dedicated to the 60th Birthday of Prof. B. Michel, Fraunhofer Institute, Berlin, Germany.
157 Suhir, E. and Arruda, L. (2010), "Could an impact load of finite duration acting on a duffing oscillator be substituted with an instantaneous impulse?", J. Sol. Mech. Mater. Eng., 4(9).
158 Suhir, E. and Reinikainen, T. (2010), "Interfacial stresses in a lap shear joint (LSJ): The transverse groove effect (TGE) and the predicted peeling stress", J. Sol. Mech. Mater. Eng., 4(8), 1116-1130.   DOI