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http://dx.doi.org/10.5228/KSTP.2011.20.1.29

Investigation into Heat Transfer Characteristics of an Injection Mold by Considering Thermal Contact Resistance  

Kim, Kyung-Min (서울과학기술대학교 NID 융합기술대학원)
Lee, Ki-Yeon (서울과학기술대학교 NID 융합기술대학원)
Sohn, Dong-Hwi (서울과학기술대학교 NID 융합기술대학원)
Park, Keun (서울과학기술대학교 기계설계 자동화공학부)
Publication Information
Transactions of Materials Processing / v.20, no.1, 2011 , pp. 29-35 More about this Journal
Abstract
In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.
Keywords
Thermal Contact Resistance; Injection Mold; Finite Element Analysis; Heat Transfer Analysis;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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