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http://dx.doi.org/10.5228/KSPP.2009.18.6.476

Mechanical and Electrical Properties of Submicrocrystalline Cu-3%Ag Alloy  

Ko, Y.G. (영남대학교 신소재공학부)
Lee, C.W. (한양대학교 금속재료공학과)
NamGung, S. (한양대학교 금속재료공학과)
Lee, D.H. (한양대학교 금속재료공학과)
Shin, D.H. (한양대학교 금속재료공학과)
Publication Information
Transactions of Materials Processing / v.18, no.6, 2009 , pp. 476-481 More about this Journal
Abstract
The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.
Keywords
Cu-Ag Alloy; Equal Channel Angular Pressing; Microstructure; Mechanical Property; Electrical Resistivity;
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