A Study on the Runner and Gate Consequence of Manufacture Double Shot Molding using CAE
![]() |
Kim, O.R.
(한국생산기술연구원 금형기술지원센터)
Cha, B.S. (한국생산기술연구원 금형기술지원센터) Lee, S.Y. (한국생산기술연구원 금형기술지원센터) Kim, Y.G. (한국생산기술연구원 금형기술지원센터) Woo, C.K. (인천대학교 기계공학과) |
1 | O. R. Kim, M.Y. Kim, S. H. Lee, C. O. Kwon, 2006, A Study on Plastic Injection Molding for Warpage Characteristics Evaluation of Mobile Phone Cover, Transactions of Materials Processing, Vol.15, No.1, pp.76-81 DOI ScienceOn |
2 | S. H. Park, 1998, Hyun Dai design of experiments, Min Young Sa |
3 | B. H. Lee, B. H. Kim, 1997, Variation of Part Wall Thicknesses to Reduce Warpage of Injection Molded Part-Robust Design Against Process Variability, Polymer Plastics Technology & Engineering Journal, Vol.36, No.5, pp. 791-807 DOI ScienceOn |
4 | M. C. Huang, C. C. Tai, 2001, The effective factors in the warpage problems of an injected-molded part with a thin shell feature, Journal of Materials Processing Technology, Vol.110, pp. 1-9 DOI ScienceOn |
5 | S. H. Lee, C. J. Hwang, O. R. Kim, Y. M. Heo, 2004, The Warpage of Orthogonal Stiffened Structures in Injection Molding, PPS Asia/Australia meeting, pp. 45-46 |
![]() |