1 |
Y. Ledoux, E. Pairel, R. Arrieux, 2007, An Improved Process Optimisation for Springback Compensation using FEM Simulation and Experimental Design, International Journal of Forming Processes : Computational and Physical Methods , Vol. 10, pp. 219-234
DOI
|
2 |
C. H. Min, 2007, Development of 121 high density probe card using micro-spring architecture, Journal of the Korean Institute of Electronic Material Engineers, Vol. 20, pp.749-755
과학기술학회마을
DOI
ScienceOn
|
3 |
F. Valente, X. P. Li, A. Messina, 1997, Springback prediction for stamping tools compensation by numerical simulation, Computational Plasticity: Fundamentals and Applications , pp. 1431-1438
|
4 |
K. Roll, T. Lemke, K. Wiegand, 2005, Possibilities and Strategies for Simulations and Compensation for Springback, AIP Conference Proceedings, Vol. 778, pp. 295-302
DOI
|
5 |
C. R. Pyo, S. H. Kang, B. H. Jeon, 2002, Development of System based on Digital Image Processing for Precision Measurement of Micro Spring, The Korean Society for Technology of Plasticity, Vol. 11, pp. 620-627
과학기술학회마을
DOI
ScienceOn
|
6 |
J. Dan, W. Lancheng, 2006, Direct generation of die surfaces from measured data points based on springback compensation, International Journal of Advanced Manufacturing Technology, Vol. 31, pp. 574-579
DOI
|
7 |
G. Shen, P. Hu, X. Zhang, 2005, Springback Simulation and Tool Surface Compensation Algorithm for Sheet Metal Forming, AIP Conference Proceedings , Vol. 778, pp. 334-339
DOI
|
8 |
B. H. Kim, S. J. Park, K. Chun, 2004, A fine pitch MEMS probe unit for flat panel display as manufacturing MEMS application, Sensors and Actuators. A, Physical ,Vol. 115, pp. 46-52
DOI
ScienceOn
|
9 |
A. Tang, W. Lee, J. He, 2005, Die Face Engineering Based Springback Compensation Strategy and Implementation, Numerical simulation of 3D sheet metal forming processes; Numisheet 2005, pp. 314-321
|
10 |
A. Accotto, G. Anedda, M. Sperati, 2005, On the Optimization of the Punch-Die Shape: An Application of New Concepts of Tools Geometry Alteration for Springback Compensation, European LS-DYNA Users' Conference, pp. 6d-48
|
11 |
M. Rosamond, D. Wood, 2007, Substrate independent fabrication of a non-planar probe card, Microelectronic Engineering , Vol. 84, pp. 1207-1210
DOI
ScienceOn
|
12 |
T. Meinders, I. A. Burchitz, M. H. A. Bonte, 2008, Numerical product design: Springback prediction, compensation and optimization, International Journal of Machine Tools & Manufacture, Vol. 48, pp. 499-514
DOI
ScienceOn
|
13 |
A. Rosochowski, 2001, Die compensation procedure to negate die deflection and component springback, Journal of Materials Processing Technology , Vol. 115, pp. 187-191
DOI
ScienceOn
|
14 |
J. Weiher, B. Rietman, K. Kose, 2004, Controlling Springback with Compensation Strategies, AIP Conference Proceedings, Vol. 712 , pp. 1011-1015
DOI
|
15 |
F. Knap, J. W. Pilarczyk, 2000, Springback of wire and residual stresses during unloading after plastic deformation, Wire and Cable Technical Symposium (WCTS)2000, pp. 1-4
|