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http://dx.doi.org/10.5228/KSPP.2008.17.7.496

Thermal Viscoelastic Analysis of Plastic Part Considering Residual Stress  

Moon, H.I. (강원대 기계메카트로닉스공학과)
Kim, H.Y. (강원대 기계메카트로닉스공학과)
Choi, C.W. (LG전자 DAC 연구소 C4 group)
Jeong, K.S. (LG전자 DAC 연구소 C4 group)
Publication Information
Transactions of Materials Processing / v.17, no.7, 2008 , pp. 496-500 More about this Journal
Abstract
Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behavior of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.
Keywords
Residual Stress; Viscoelastic; Creep; Stress Relaxation; Thermal Analysis; Prony Series;
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